DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
M3D119
1N4001ID to 1N4007ID
Rectifiers
Product specification
Supersedes data of April 1992
1996 Jun 10
Philips Semiconductors
Product specification
Rectifiers
FEATURES
•
Glass passivated
•
High maximum operating
temperature
•
Low leakage current
•
Excellent stability
•
Available in ammo-pack.
handbook, 4 columns
1N4001ID to 1N4007ID
DESCRIPTION
Cavity free cylindrical glass package
through Implotec™
(1)
technology.
(1) Implotec is a trademark of Philips.
This package is hermetically sealed
and fatigue free as coefficients of
expansion of all used parts are
matched.
k
a
MAM123
Fig.1 Simplified outline (SOD81) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
V
RRM
PARAMETER
repetitive peak reverse voltage
1N4001ID
1N4002ID
1N4003ID
1N4004ID
1N4005ID
1N4006ID
1N4007ID
V
R
continuous reverse voltage
1N4001ID
1N4002ID
1N4003ID
1N4004ID
1N4005ID
1N4006ID
1N4007ID
I
F(AV)
average forward current
averaged over any 20 ms
period; T
amb
= 75
°C;
see Fig.2
averaged over any 20 ms
period; T
amb
= 100
°C;
see Fig.2
I
FRM
I
FSM
T
stg
T
j
repetitive peak forward current
non-repetitive peak forward current
storage temperature
junction temperature
half sinewave; 60 Hz
−
−
−
−
−
−
−
−
−
−
−
−65
−65
50
100
200
400
600
800
1000
V
V
V
V
V
V
V
−
−
−
−
−
−
−
50
100
200
400
600
800
1000
V
V
V
V
V
V
V
CONDITIONS
MIN.
MAX.
UNIT
1.00 A
0.75 A
10
20
+175
+175
A
A
°C
°C
1996 Jun 10
2
Philips Semiconductors
Product specification
Rectifiers
ELECTRICAL CHARACTERISTICS
T
j
= 25
°C;
unless otherwise specified.
SYMBOL
V
F
V
F(AV)
I
R
I
R(AV)
PARAMETER
forward voltage
full-cycle average forward voltage
reverse current
full-cycle average reverse current
I
F(AV)
= 1 A
V
R
= V
Rmax
V
R
= V
Rmax
; T
amb
= 100
°C
1N4001ID to 1N4007ID
CONDITIONS
I
F
= 1 A; see see Fig.3
MAX.
1.1
0.8
10
50
30
V
V
UNIT
µA
µA
µA
V
R
= V
RRMmax
; T
amb
= 75
°C
THERMAL CHARACTERISTICS
SYMBOL
R
th j-tp
R
th j-a
Note
1. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper
≥40 µm,
see Fig.4.
For more information please refer to the
“General Part of associated Handbook”.
PARAMETER
thermal resistance from junction to tie-point
thermal resistance from junction to ambient
note 1
CONDITIONS
lead length = 10 mm
VALUE
60
120
UNIT
K/W
K/W
1996 Jun 10
3
Philips Semiconductors
Product specification
Rectifiers
GRAPHICAL DATA
1N4001ID to 1N4007ID
handbook, halfpage
1.5
MBH386
handbook, halfpage
10
MBH385
IF
(A)
1
IF
(A)
1
0.5
(1)
(2)
(3)
0
0
100
Tamb (°C)
200
10
−1
0
0.5
1
VF (V)
1.5
(1) T
amb
= 100
°C.
(2) T
amb
= 20
°C.
(3) T
amb
=
−50 °C.
Fig.2
Maximum forward current as a function of
ambient temperature.
Fig.3
Forward current as a function of forward
voltage; typical values.
handbook, halfpage
50
25
7
50
2
3
MGA200
Dimensions in mm.
Fig.4 Device mounted on a printed-circuit board.
1996 Jun 10
4
Philips Semiconductors
Product specification
Rectifiers
PACKAGE OUTLINE
1N4001ID to 1N4007ID
handbook, full pagewidth
5 max
0.81
max
2.15
max
MBC051
28 min
3.8 max
28 min
Dimensions in mm.
Fig.5 SOD81.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
1996 Jun 10
5
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