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MQ1N5226CUR-1

Description
Zener Diode
CategoryDiscrete semiconductor    diode   
File Size281KB,6 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

MQ1N5226CUR-1 Overview

Zener Diode

MQ1N5226CUR-1 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Reach Compliance Codecompli
ECCN codeEAR99
Diode typeZENER DIODE
JESD-609 codee0
Terminal surfaceTIN LEAD
Base Number Matches1
1N5221BUR-1 thru 1N5281BUR-1
Available on
commercial
versions
METALLURGICALLY BONDED GLASS
SURFACE MOUNT 500 mW ZENERS
DESCRIPTION
Screening in
reference to
MIL-PRF-19500
available
The 1N5221BUR-1 thru 1N5281BUR-1 series of 0.5 watt Zener voltage regulators provides a
surface mount equivalent to the popular JEDEC registered 1N5221 to 1N5281 series for 2.4 to
200 volts in a metallurgically bonded configuration. They are available with standard 5% or
10% tolerances as well as tighter tolerances identified by different suffix letters on the part
number. Microsemi also offers numerous other Zener products to meet higher and lower
power applications.
Important:
For the latest information, visit our website
http://www.microsemi.com.
DO-213AA Package
FEATURES
Surface mount equivalent of JEDEC registered 1N5221 thru 1N5281 series.
Voltage tolerances of 10%, 5%, 2%, and 1% available.
Hermetically sealed surface mount package.
Internal metallurgical bond.
Up-screening in reference to MIL-PRF-19500 is available. (See
part nomenclature
for all available
options.)
RoHS compliant versions available (commercial grade only).
Also available in:
DO-35
(DO-204AH)
(axial-leaded)
1N5221B-1 thru 1N5281B-1
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current and temperature range.
Extensive selection from 2.4 to 200 V.
Non-sensitive to ESD (MIL-STD-750 method 1020).
Minimal capacitance (see
Figure 3).
Inherently radiation hard per Microsemi “MicroNote
050”.
MAXIMUM RATINGS
Parameters/Test Conditions
Junction and Storage Temperature
(1)
Thermal Resistance Junction-to-Ambient
Thermal Resistance Junction-to-End Cap
(2)
Steady-State Power Dissipation
Forward Voltage @ 200 mA
Solder Temperature @ 10 s
Symbol
T
J
and T
STG
R
ӨJA
R
ӨJEC
P
D
V
F
T
SP
Value
-65 to +175
250
100
0.5
1.1
260
Unit
C
C/W
o
C/W
W
V
o
C
o
o
Notes:
1. When mounted on FR4 PC board (1 oz Cu) with recommended footprint (see last page).
2. At end cap temperature T
EC
< 125
o
C or ambient temperature T
A
< 50
º
C when mounted on FR4 PC
board as described for thermal resistance above (see
Figure 2
for derating).
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
T4-LDS-0232-1, Rev. 1 (111957)
©2011 Microsemi Corporation
Page 1 of 6
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