SLUS870 – JANUARY 2009...............................................................................................................................................................................................
www.ti.com
This device has limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
(1)
T
A
–55°C to 125°C
(1)
(2)
PACKAGE
(2)
CDIP – J
LCCC – FK
ORDERABLE PART NUMBER
5962-8768104VEA
5962-8768104V2A
TOP-SIDE MARKING
UC1825J-SP
UC1825FK-SP
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at
www.ti.com.
Package drawings, thermal data, and symbolization are available at
SLUS870 – JANUARY 2009...............................................................................................................................................................................................
www.ti.com
ABSOLUTE MAXIMUM RATINGS
(1)
UNIT
Supply voltage
Output current, source or sink, Out A, Out B
Analog inputs
Clock output current
Error amplifier output current
Soft-start sink current
Oscillator charging current
Power dissipation
Storage temperature range
Lead temperature (soldering, 10 seconds)
(1)
V
C
, V
CC
DC
Pulse (0.5
µs)
INV, NI, Ramp
Soft Start, ILIM/SD
Clock
E/A Out
Soft Start
R
T
30
0.5
2.0
–0.3 to 7
–0.3 to 6
–5
5
20
–5
1
–65 to 150
300
W
°C
mA
V
A
V
All voltages are with respect to GND; all currents are positive into, negative out of part; pin numbers refer to DIL-16 package.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (T
A
= T
J
= –55°C to 125°C), unless otherwise noted.
MIN
V
CC
Supply voltage
Sink/source output current (continuous or time average)
Reference load current
10
0
0
MAX
30
100
10
UNIT
V
mA
mA
THERMAL RATINGS TABLE
PACKAGE
DIL-16 (J)
LCC-20 (FK)
(1)
θ
JA
(°C/W)
80–120
70–80
θ
JC
(°C/W)
28
(1)
20
(1)
θ
JC
data values stated were derived from MIL-STD-1835B. MIL-STD-1835B states that the baseline values shown are worst case
(mean + 2s) for a 60 × 60 mil microcircit device silicon die and applicable for devices with die sizes up to 14400 square mils. For device
die sizes greater than 14400 square mils use the following values; dual-in-line, 11°C/W; flat pack 10°C/W; pin grid array, 10°C/W.
Borrowing photos from netizens, a sneak peek of the summit (updated at any time as netizens take photos) (Photographed by: @elvike) ————————The following is a brief story, and there is also a short wa...
This paper uses the characteristics of a four-port network and a new structure to realize the function of a standard waveguide magic T. Not only is the size of the structure greatly reduced, but the d...
I am currently using WinCE 5.0, and I plan to migrate to WinCE 6.0 Rx. What are the benefits of upgrading WinCE5.0 to WinCE 6 Rx? I have checked some articles online, and they all seem to be talking a...
The function is to delete a segment in the flash, but the starting address cannot be passed in. Could you please help me find out where the problem lies? The code is as follows: #include "msp430.h" #i...
1. Can the I+ and I- of sd16 be used to collect voltage signals? If so, how should they be set?2. Can sd16 collect differential signals? If so, can it identify negative voltages? (i.e. collect the dif...
Wave soldering is a crucial electronic component soldering technique used in the production of a wide range of electronic devices, from home appliances to computers to avionics. The process is wide...[Details]
Ever since the Tesla fire incident, electric cars, already known for their poor reputation, have been subjected to even more scathing criticism. Despite this, many people are still willing to buy t...[Details]
1. Introduction
Electronic scales are gradually replacing traditional measuring tools like springs and balances in everyday life, such as electronic price computing scales and electronic weigh...[Details]
On August 18th, Galaxis, a specialist in integrated intelligent intralogistics robotics, officially unveiled its next-generation, ultra-narrow aisle forklift mobile robot, the "VFR Ultra-Narrow Ser...[Details]
A half-bridge is an inverter topology for converting DC to AC. A typical half-bridge circuit consists of two controller switches, a three-wire DC power supply, two feedback diodes, and two capacito...[Details]
1. Multi-channel DAC technology bottleneck
Currently,
the development of multi-channel DAC technology focuses on two core challenges.
First, industrial applications urgently ...[Details]
According to Nikkei, Japan has performed poorly in responding to China's power semiconductor challenges.
There are five major companies in Japan's power chip market: Mitsubishi Electric,...[Details]
On August 22, the Wall Street Journal reported on the 21st local time that the new US government does not plan to acquire equity in semiconductor wafer foundry giant TSMC and Micron, one of the thr...[Details]
My career has been closely tied to the semiconductor industry. From product management to content marketing, I've provided countless forecasts and predictions across a variety of roles. Whethe...[Details]
A tubular motor is an electric motor that is typically used to control the movement of machines and equipment. Tubular motors are generally divided into two categories: linear tubular motors and ro...[Details]
Tools/Materials
Yitong Chuanglian MODBUS to PROFIBUS Gateway YT-PB-03
Siemens s7-300
This article describes how to configure the YT-PB-03 MODBUS to PROFIBUS gat...[Details]
A scale, a large, ground-mounted scale, is typically used to measure the tonnage of truck cargo. It's the primary weighing device used in factories, mines, and businesses for bulk cargo measurement...[Details]
From time to time, I see some audiophiles spending a lot of money or a lot of time to DIY speakers, but the results are not what they want. Below I list some of the small experiences I summarized b...[Details]
introduction
The widespread use of air conditioner communication circuits began with the rise of household inverter air conditioners. With China's energy conservation and emission reduction in...[Details]
introduction
The OMAP-L138 dual-core processor is a new generation of low-power single-chip systems (SoCs) from TI. It is widely used in communications, industrial, medical diagnostic, and aud...[Details]
MCU
京公网安备 11010802033920号
EEWORLD
