300V, SILICON, PIN DIODE
| Parameter Name | Attribute value |
| Maker | TE Connectivity |
| package instruction | O-CUPM-N1 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Minimum breakdown voltage | 300 V |
| Shell connection | ISOLATED |
| Configuration | SINGLE |
| Diode component materials | SILICON |
| Diode type | PIN DIODE |
| JESD-30 code | O-CUPM-N1 |
| Minority carrier nominal lifetime | 0.8 µs |
| Number of components | 1 |
| Number of terminals | 1 |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| Package shape | ROUND |
| Package form | POST/STUD MOUNT |
| Certification status | Not Qualified |
| Guideline | ESA/SCC 5513/012 |
| surface mount | NO |
| technology | POSITIVE-INTRINSIC-NEGATIVE |
| Terminal form | NO LEAD |
| Terminal location | UPPER |
| Base Number Matches | 1 |
京公网安备 11010802033920号
EEWORLD
