AND Gate, F/FAST Series, 3-Func, 3-Input, TTL, CDFP14
| Parameter Name | Attribute value |
| package instruction | , |
| Reach Compliance Code | unknown |
| series | F/FAST |
| JESD-30 code | R-CDFP-F14 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | AND GATE |
| Number of functions | 3 |
| Number of entries | 3 |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Maximum supply current (ICC) | 9.7 mA |
| propagation delay (tpd) | 7.5 ns |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal form | FLAT |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| 54F11/BDA | 54F10/BDA | 54F11/B2A | 54F11/BCA | 54F10/BCA | 54F10/B2A | |
|---|---|---|---|---|---|---|
| Description | AND Gate, F/FAST Series, 3-Func, 3-Input, TTL, CDFP14 | NAND Gate, F/FAST Series, 3-Func, 3-Input, TTL, CDFP14 | AND Gate, F/FAST Series, 3-Func, 3-Input, TTL, CQCC20 | AND Gate, F/FAST Series, 3-Func, 3-Input, TTL, CDIP14 | NAND Gate, F/FAST Series, 3-Func, 3-Input, TTL, CDIP14 | NAND Gate, F/FAST Series, 3-Func, 3-Input, TTL, CQCC20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| series | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST |
| JESD-30 code | R-CDFP-F14 | R-CDFP-F14 | S-CQCC-N20 | R-CDIP-T14 | R-CDIP-T14 | S-CQCC-N20 |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | AND GATE | NAND GATE | AND GATE | AND GATE | NAND GATE | NAND GATE |
| Number of functions | 3 | 3 | 3 | 3 | 3 | 3 |
| Number of entries | 3 | 3 | 3 | 3 | 3 | 3 |
| Number of terminals | 14 | 14 | 20 | 14 | 14 | 20 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| Package shape | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
| Package form | FLATPACK | FLATPACK | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER |
| Maximum supply current (ICC) | 9.7 mA | 7.7 mA | 9.7 mA | 9.7 mA | 7.7 mA | 7.7 mA |
| propagation delay (tpd) | 7.5 ns | 6.5 ns | 7.5 ns | 7.5 ns | 6.5 ns | 6.5 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | NO | NO | YES |
| technology | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | FLAT | FLAT | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
| Terminal location | DUAL | DUAL | QUAD | DUAL | DUAL | QUAD |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
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