M55342M05C432ETTR datasheet, PDF

Datasheet> All Categories > Passive components> The resistor> M55342M05C432ETTR

M55342M05C432ETTR: DescriptionFixed Resistor, Metal Glaze/thick Film, 0.225W, 432000ohm, 175V, 1% +/-Tol, 300ppm/Cel, Surface Mount, 2208, CHIP; CategoryPassive components The resistor; File Size91KB，1 Pages; ManufacturerState of the Art Inc.; Environmental Compliance

Download Datasheet Parametric View All

M55342M05C432ETTR Overview

Fixed Resistor, Metal Glaze/thick Film, 0.225W, 432000ohm, 175V, 1% +/-Tol, 300ppm/Cel, Surface Mount, 2208, CHIP

M55342M05C432ETTR Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	State of the Art Inc.
package instruction	SMT, 2208
Reach Compliance Code	compliant
ECCN code	EAR99
structure	Chip
JESD-609 code	e4
Manufacturer's serial number	M55342/05
Installation features	SURFACE MOUNT
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-65 °C
Package height	0.71 mm
Package length	5.72 mm
Package shape	RECTANGULAR PACKAGE
Package form	SMT
Package width	1.78 mm
method of packing	TR
Rated power dissipation(P)	0.225 W
Rated temperature	70 °C
Guideline	MIL-PRF-55342
resistance	432000 Ω
Resistor type	FIXED RESISTOR
series	M55342/05-THICKFILM
size code	2208
surface mount	YES
technology	METAL GLAZE/THICK FILM
Temperature Coefficient	300 ppm/°C
Terminal surface	Palladium/Silver (Pd/Ag)
Terminal shape	WRAPAROUND
Tolerance	1%
Operating Voltage	175 V
Base Number Matches	1

Preview

Download Datasheet

View All

State of the Art, Inc.

Thick Film Chip Resistor

M55342/05 RM2208

GLASS

PASSIVATION

WRAPAROUND

TERMINATIONS

RESISTOR

FILM

96% ALUMINA CHIP

PERFORMANCE

TEMPERATURE RISE (°C)

Resistance Range

Tolerances

Maximum Power

Maximum Voltage

- 22M

1%, 2%, 5%, 10%

225 mW

175 Volts

CHARACTERISTICS*

±100

±0.5%

±0.25%

±0.5%

±300

±0.5%

±0.25%

±0.5%

±2.0%

±1.0%

CURRENT NOISE

POWER DISSIPATION

fiber epoxy board

ceramic board

TESTS

TCR (-55 to +125

C) in ppm/

Thermal Shock

Low Temperature Operation

Short-time Overload

Resistance to Soldering Heat

Moisture Resistance

Life, 2,000 Hours

High Temperature Exposure

POWER DISSIPATION (WATTS)

LIFE TEST

POWER DERATING

*Maximum allowable change per MIL-PRF-55342,

typical change is 10% of these values.

PART NUMBERING

M55342 K 05 B 100D S - TR

PACKAGING CODE: TR = Tape & Reel W= Waffle Pack

PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% S: 0.001% T: Space Level C: Non - ER

RESISTANCE AND TOLERANCE CODE:

Three significant digits, with a letter indicating the

decimal location, the tolerance, and the value range.

D: 1%

E: 1% K

F: 1% M

G: 2%

H: 2% K

T: 2% M

J: 5%

K: 5% K

L: 5% M

M: 10%

N: 10% K

P: 10% M

TERMINATION MATERIALS:

B: Solderable wraparound C: Epoxy bondable palladium/silver wraparound U: Epoxy bondable platinum/gold wraparound

W: Gold wire bondable

G: Gold wraparound

SIZE CODE: /05 = RM2208

TEMPERATURE CHARACTERISTIC: K: ± 100ppm M: ± 300ppm

PERFORMANCE SPECIFICATION MIL-PRF-55342

MECHANICAL

INCHES

MILLIMETERS

.275

MINIMUM

RECOMMENDED

MOUNTING

PADS

(INCHES)

Length

Width

Thickness

Top Term

Bottom Term

Gap

Approx. Weight

.225 (.223 - .237)

.070 (.070 - .080)

.028 (.015 - .033)

.020 (.015 - .025)

.185 (.181 - .189)

.0262 grams

5.72

1.78

0.71

0.51

4.70

(5.66 - 6.02)

(1.78 - 2.03)

(0.38 - 0.84)

(0.38 - 0.64)

(4.60 - 4.80)

.076

.175

.050

State of the Art, Inc.

2470 Fox Hill Road, State College, PA 16803-1797

Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401

“Specifications subject to change without notice.”

www.resistor.com

04/09/08

Recommended Resources

LINUX-based OS - Fedora 11 Final is out, what do you think?: After more than 6 months of development, and two delays on May 26 and June 2, the release is here. Today, the eagerly awaited Fedora support is finally satisfied, and everyone can download Fedora 11 f...; 绿茶 Talking

Experience in choosing communication protocol between ARM and peripherals: When I was working on a project recently, I found that the communication protocols between ARM and FPGA or CPLD are different. Here are some tips: 1. When the speed requirement is not high, it is reco...; hhakex ARM Technology

New clock calendar chip DS12C887 features application: Abstract: This paper briefly introduces the functional characteristics and internal control register parameters of the new clock and calendar chip DS12C887 of DALLAS Company in the United States, give...; loverbill FPGA/CPLD

About MPS mobile power chip...: [i=s]This post was last edited by gh131413 on 2016-9-23 15:07[/i] I am currently using this chip to make a 5V 3A board. The double-sided board cannot pass EMC and exceeds more than ten DBs. After chan...; gh131413 Analog electronics

How to make LM3S development board into a web server?: Connect the LM3S6911 development board to the router so that it can be accessed from the external network.Do I need to apply for a domain name? How can I do this? Can anyone with experience give me so...; pacemaker Microcontroller MCU

PCB of electrode line: Please advise, how to draw the PCB package of the electrode line? I looked at it for a long time but didn't understand it....; princess. PCB Design

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components