DM74S570AJ/A+ datasheet, PDF - EEWORLD Datasheet

DM74S570AJ/A+: DescriptionIC,PROM,512X4,TTL,DIP,16PIN,CERAMIC; Categorystorage storage; File Size207KB，4 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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DM74S570AJ/A+ Overview

IC,PROM,512X4,TTL,DIP,16PIN,CERAMIC

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
Maximum access time	45 ns
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
memory density	2048 bit
Memory IC Type	OTP ROM
memory width	4
Number of terminals	16
word count	512 words
character code	512
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512X4
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

	DM74S570AJ/A+	DM74S570AN/A+	DM74S570J/A+	DM74S570N/A+
Description	IC,PROM,512X4,TTL,DIP,16PIN,CERAMIC	IC,PROM,512X4,TTL,DIP,16PIN,PLASTIC	IC,PROM,512X4,TTL,DIP,16PIN,CERAMIC	IC,PROM,512X4,TTL,DIP,16PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown
Maximum access time	45 ns	45 ns	55 ns	55 ns
JESD-30 code	R-XDIP-T16	R-PDIP-T16	R-XDIP-T16	R-PDIP-T16
JESD-609 code	e0	e0	e0	e0
memory density	2048 bit	2048 bit	2048 bit	2048 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	4	4	4	4
Number of terminals	16	16	16	16
word count	512 words	512 words	512 words	512 words
character code	512	512	512	512
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	512X4	512X4	512X4	512X4
Package body material	CERAMIC	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO
technology	TTL	TTL	TTL	TTL
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL

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