SCOPE:
CMOS, 12-BIT BUFFERED, MULTIPLYING D/A CONVERTER
Generic Number
MX7545S(x)/883B
MX7545T(x)/883B
MX7545U(x)/883B
MX7545GU(x)/883B
Device Type
01
02
03
04
Case Outline(s).
The case outlines shall be designated in Mil-Std-1835 and as follows:
Outline Letter
MAXIM SMD
Q
R
E
2
Mil-Std-1835
GDIP1-T20 or CDIP2-T20
CQCC1-N20
Case Outline
Package Code
J20
L20
20 LEAD CERDIP
20 LCC
Absolute Maximum Ratings:
V
REF
to GND ...............................................................................................……. -0.3V, + 17V
Digital Input to DGND ...............................................................................…..... -0.3V to V
DD
V
RFB
to GND ...........................................................................................................…….
±25V
V
REF
to GND ...........................................................................................................…….
±25V
V
OUT1
to AGND ..........................................................................................……. -0.3V to V
DD
AGND to DGND ........................................................................................……. -0.3V to V
DD
Lead Temperature (soldering, 10 seconds) ........................................................................ +300°C
Storage Temperature ........................................................................................... -65°C to +150°C
Continuous Power Dissipation ..........................................................................…….. T
A
=+70°C
20 pin CERDIP(derate 11.1mW/°C above +70°C) .................................................…….. 889mW
20 pin LCC(derate 9.1mW/°C above +70°C) ..........................................................……. 727mW
Junction Temperature T
J
....................................................................................…….... +150°C
Thermal Resistance, Junction to Case,
ΘJC
20 pin CERDIP................................................................................................…….... 40°C/W
20 pin LCC .....................................................................................................………. 20°C/W
Thermal Resistance, Junction to Ambient,
ΘJA:
20 pin CERDIP................................................................................................…….... 90°C/W
20 pin LCC ...................................................................................................………. 110°C/W
Recommended Operating Conditions
Ambient Operating Range (T
A
) .........................................................……….. -55°C to
+125°C
Supply Voltage Range .............................................................................………... +5V to +15V
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
----------------------------
Electrical Characteristics of MX7545/883B for
SMD 5962-87702
19-0277
Page 2 of
Rev. C
7
TABLE 1. ELECTRICAL TESTS:
TEST
Resolution
NOTE 4
Symbol
RES
RA
CONDITIONS
-55
°C ≤T
A
≤
+125°C 1/
Unless otherwise specified
V
DD
=+5V and +15V
V
DD
=+5V and +15V
Group A
Subgroup
Device
type
All
Limits
Min
12
Limits
Max
Units
Bits
±2.0
±1.0
±0.5
±4.0
±1.0
±20
±10
±5.0
±6.0
±1.0
±2.0
±25
±15
±10
±6.0
±7.0
±5
±10
±0.015
±0.03
%/%
±0.01
±0.02
±10
±200
LSB
LSB
Relative Accuracy
1,2,3
01
02
03,04
01
10-bit monotonic, V
DD
=+5V and
+15V
Differential Nonlinearity
DNL
12-bit monotonic, V
DD
=+5V and
+15V
V
DD
=5V
Gain Error
NOTE 3
AE
1
2,3
1
2,3
V
DD
=15V
Gain Error
NOTE 3
AE
1
2,3
Gain Temperature
Coefficient NOTE 4
Power Supply Rejection
TC
AE
V
DD
=+5V
1,2,3
1,2,3
LSB
02,03,
04
01
02
03
1,2,3
04
01
02
03
LSB
04
ppm/°C
All
PSRR
V
DD
=+15V
∆V
DD
=±5%, V
DD
=5V
∆V
DD
=±5%, V
DD
=15V
1
2,3
1
2,3
1
2,3
All
Out1 Leakage Current
Feedthrough Error
NOTE 4, NOTE 5
I
OUT1
FTE
V
DD
=+5V & +15V, ___ __
D0-D11=0V, WR=CS=0V
VREF=±10V, 10kHz sine wave
V
DD
=5V
All
nA
4,5,6
VREF=±10V, 10kHz sine wave
V
DD
=15V
V
DD
=+5V and +15V
V
DD
=+5V
V
DD
=+15V
V
DD
=+5V
1,2,3
V
DD
=+15V
All
10
mVp-p
Input Resistance
Digital Input High
Voltage
Digital Input Low
Voltage
R
IN
V
IH
1,2,3
1,2,3
All
All
7
2.4
13.5
25
kΩ
V
V
IL
0.8
All
V
1.5
----------------------------
Electrical Characteristics of MX7545/883B for
SMD 5962-87702
19-0277
Page 3 of
Rev. C
7
TEST
Digital Input Leakage
Current
Symbol
I
IN
CONDITIONS
-55
°C ≤T
A
≤
+125°C 1/
Unless otherwise specified
V
IN
=0V or V
DD
V
DD
=+5V or +15V
D0-D11, V
DD
=5V
___ __
WR, CS, V
DD
=5V
D0-D11, V
IN
=0V, V
DD
=15V
___ __
WR, CS, V
IN
=0V, V
DD
=15V
V
DD
=5V
___ __
D0-D11=0V, WR, CS=0V
Group A
Subgroup
Device
type
All
Limits
Min
Limits
Max
±1.0
±10
5
20
Units
µA
1
2,3
Digital Input Capacitance
NOTE 2, NOTE 6
C
IN
4
All
pF
5
20
70
pF
Output Capacitance
NOTE 2, NOTE 6
C
OUT1
V
DD
=5V
___ __
D0-D11=V
DD
, WR, CS=0V
4
___ __
V
DD
=15V
D0-D11=0V, WR, CS=0V
V
DD
=15V
___ __
D0-D11=V
DD
, WR, CS=0V
V
DD
=5V
9,10,11
200
All
70
200
170
All
All
All
Chip Select to Write-
Setup Time NOTE 7
Chip Select to Write-Hold
Time NOTE 7
Write Pulse Width NOTE
7
Data-Setup Time
NOTE 7
Data-Hold Time NOTE 7
t
CS
ns
95
0
170
ns
95
150
ns
80
5
2.0
ns
t
CH
t
WR
V
DD
=15V
V
DD
=+5V and +15V
t
CS
±t
WR
, t
CH
±0,
V
DD
=+5V
t
CS
≥t
WR
, t
CH
≥0,
V
DD
=15V
V
DD
=5V
V
DD
=15V
V
DD
=+5V and +15V
All digital inputs V
IL
or V
IH
V
DD
=+5V and +15V
All digital inputs 0V or V
DD
V
DD
=+5V and +15V
9,10,11
9,10,11
t
DS
9,10,11
All
t
DH
9,10,11
1,2,3
1
2,3
All
ns
mA
µA
Supply Current
I
DD
All
100
500
NOTE 1:
NOTE 2:
NOTE 3:
NOTE 4:
V
DD
=+15V, V
OUT1
=0V; VREF=+10V, AGND=DGND, unless otherwise specified.
These parameters may be guaranteed if not tested at 25°C to the limits specified in Table 1.
Measured using internal feedback resistor and includes effect of 5ppm max gain TC.
These parameters may be guaranteed if not tested over the full military temp range to the
limits specified in Table 1.
NOTE 5: Feedthrough error can be reduced by connecting the metal lid on the package to ground.
NOTE 6: Subgroup 4 (C
IN
measurement) shall be measured only for the initial test and after process
or design changes which may affect capacitance.
NOTE 7: Timing Diagram. See Commercial Datasheet.
----------------------------
Electrical Characteristics of MX7545/883B for
SMD 5962-87702
19-0277
Page 4 of
Rev. C
7
ORDERING INFORMATION:
Package
Pkg. Code
01
20 pin CERDIP
J20
01
20 pin LCC
L20
02
20 pin CERDIP
J20
02
20 pin LCC
L20
03
20 pin CERDIP
J20
03
20 pin LCC
L20
04
20 pin CERDIP
J20
04
20 pin LCC
L20
MAXIM PART #
MX7545SQ/883B
MX7545SE/883B
MX7545TQ/883B
MX7545TE/883B
MX7545UQ/883B
MX7545UE/883B
MX7545GUQ/883B
MX7545GUE/883B
SMD Number
5962-8770201RA
5962-87702012C
5962-8770202RA
5962-87702022C
5962-8770203RA
5962-87702032C
5962-8770204RA
5962-87702042C
TERMINAL CONNECTIONS:
J20 & L20
Pin
1
OUT1
2
AGND
3
DGND
4
D11(MSB)
5
D10
6
D9
7
D8
8
D7
9
D6
10
D5
11
D4
12
D3
13
D2
14
D1
15
D0(LSB)
16
__
CS
17
___
WR
18
V
DD
19
VREF
20
R
FB
----------------------------
Electrical Characteristics of MX7545/883B for
SMD 5962-87702
19-0277
Page 5 of
Rev. C
7
QUALITY ASSURANCE
Sampling and inspection procedures shall be in accordance with MIL-Prf-38535, Appendix A as specified in Mil-
Std-883.
Screening shall be in accordance with Method 5004 of Mil-Std-883. Burn-in test Method 1015:
1. Test Condition, A, B, C, or D.
2. TA = +125°C minimum.
3. Interim and final electrical test requirements shall be specified in Table 2.
Quality conformance inspection shall be in accordance with Method 5005 of Mil-Std-883, including Groups A, B,
C, and D inspection.
Group A inspection:
1. Tests as specified in Table 2.
2. Selected subgroups in Table 1, Method 5005 of Mil-Std-883 shall be omitted.
Group C and D inspections:
a. End-point electrical parameters shall be specified in Table 1.
b. Steady-state life test, Method 1005 of Mil-Std-883:
1. Test condition A, B, C, D.
2. TA = +125°C, minimum.
3. Test duration, 1000 hours, except as permitted by Method 1005 of Mil-Std-883.
TABLE 2.
ELECTRICAL TEST REQUIREMENTS
Mil-Std-883 Test Requirements
Subgroups
per Method 5005, Table 1
1
1*, 2, 3
1, 2, 3, 4**, 5, 6, 9, 10***, 11***
1
Interim Electric Parameters
Method 5004
Final Electrical Parameters
Method 5005
Group A Test Requirements
Method 5005
Group C and D End-Point Electrical Parameters
Method 5005
*
**
***
PDA applies to Subgroup 1 only.
Subgroup 4 shall be tested at initial qualification and upon redesign. Sample size will
be 116 units.
Subgroups 10 and 11, if not tested shall be guaranteed to the specified limits of Table 1.
----------------------------
Electrical Characteristics of MX7545/883B for
SMD 5962-87702
19-0277
Page 6 of
Rev. C
7
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