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5962R9660201VXC

Description
16X4 OTHER FIFO, CDFP16, METAL SEALED, CERAMIC, FP-16
Categorystorage    storage   
File Size115KB,10 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Download Datasheet Parametric Compare View All

5962R9660201VXC Overview

16X4 OTHER FIFO, CDFP16, METAL SEALED, CERAMIC, FP-16

5962R9660201VXC Parametric

Parameter NameAttribute value
MakerRenesas Electronics Corporation
Parts packaging codeDFP
package instructionDFP, FL16,.3
Contacts16
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresINPUT AC PARAMETRIC VALUES NOT FROM POST RADIATION MEASUREMENT; REGISTER BASED
Maximum clock frequency (fCLK)1.11 MHz
period time900.9 ns
JESD-30 codeR-CDFP-F16
JESD-609 codee4
memory density64 bit
Memory IC TypeOTHER FIFO
memory width4
Number of functions1
Number of terminals16
word count16 words
character code16
Operating modeSYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize16X4
ExportableYES
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDFP
Encapsulate equivalent codeFL16,.3
Package shapeRECTANGULAR
Package formFLATPACK
Parallel/SerialPARALLEL
power supply5/15 V
Certification statusNot Qualified
Filter level38535V;38534K;883S
Maximum seat height2.92 mm
Maximum supply voltage (Vsup)18 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)15 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceGOLD
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
total dose100k Rad(Si) V
width6.73 mm
Base Number Matches1
CD40105BMS
December 1992
CMOS FIFO Register
Description
CD40105BMS is a low-power first-in-first-out (FIFO) “elastic”
storage register that can store 16 4-bit words. It is capable of
handling input and output data at different shifting rates. This
feature makes it particularly useful as a buffer between asyn-
chronous systems.
Each word position in the register is clocked by a control flip-
flop, which stores a marker bit. A “1” signifies that the posi-
tion’s data is filled and a “0” denotes a vacancy in that posi-
tion. The control flip-flop detects the state of the preceding
flip-flop and communicates its own status to the succeeding
flip-flop. When a control flip-flop is in the “0” state and sees a
“1” in the preceding flip-flop, it generates a clock pulse that
transfers data from the preceding four data latches into its
own four data latches and resets the preceding flip-flop to
“0”. The first and last control flip-flops have buffered outputs.
Since all empty locations “bubble” automatically to the input
end, and all valid data ripple through to the output end, the
status of the first control flip-flop (DATA-IN READY) indicates
if the FIFO is full, and the status of the last flip-flop (DATA-
OUT READY) indicates if the FIFO contains data. As the
earliest data are removed from the bottom of the data stack
(the output end), all data entered later will automatically
propagate (ripple) toward the output.
Loading Data
- Data can be entered whenever the DATA-IN
READY (DIR) flag is high, by a low to high transition on the
SHIFT-IN (SI) input. This input must go low momentarily
before the next word is accepted by the FIFO. The DIR flag
will go low momentarily, until that data have been transferred
to the second location. The flag will remain low when all 16-
word locations are filled with valid data, and further pulses
on the SI input will be ignored until DIR goes high.
Continued on next page
Features
• 4 Bits x 16 Words
• High Voltage Type (20V Rating)
• Independent Asynchronous Inputs and Outputs
• 3-State Outputs
• Expandable in Either Direction
• Status Indicators on Input and Output
• Reset Capability
• Standardized Symmetrical Output Characteristics
• 100% Tested for Quiescent Current at 20V
• 5V, 10V and 15V Parametric Ratings
• Maximum Input Current of 1µA at 18V Over Full Pack-
age Temperature Range; 100nA at 18V and +25
o
C
• Noise Margin (Over Full Package/Temperature Range)
- 1V at VDD = 5V
- 2V at VDD = 10V
- 2.5V at VDD = 15V
• Meets All Requirements of JEDEC Tentative Standard
No. 13B, “Standard Specifications for Description of
‘B’ Series CMOS Devices”
Applications
• Bit Rate Smoothing
• CPU/Terminal Buffering
• Data Communications
• Peripheral Buffering
• Line Printer Input Buffers
• Auto Dialers
• CRT Buffer Memories
• Radar Data Acquisition
Pinout
3 - STATE
CONTROL 1
DIR
SI
D0
D1
D2
D3
VSS
2
3
4
5
6
7
8
CD40105BMS
TOP VIEW
16 VDD
15 SO
14 DOR
13 Q0
12 Q1
11 Q2
10 Q3
9 MR
Functional Diagram
3-STATE
CONTROL
D0
D1
D2
D3
SHIFT IN
SHIFT OUT
4
5
6
7
3
15
9
1
13
12
11
10
14
2
Q0
Q1
Q2
Q3
DATA-OUT
READY
DATA-IN
READY
MASTER
RESET
VDD = 16
VSS = 8
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
File Number
3353
7-1317

5962R9660201VXC Related Products

5962R9660201VXC CD40105BFMSR CR1206F-332RFPBCECC40401-008
Description 16X4 OTHER FIFO, CDFP16, METAL SEALED, CERAMIC, FP-16 16X4 OTHER FIFO, CDIP16, FRIT SEALED, CERAMIC, DIP-16 Fixed Resistor, Metal Glaze/thick Film, 0.25W, 332ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP
package instruction DFP, FL16,.3 FRIT SEALED, CERAMIC, DIP-16 CHIP
Reach Compliance Code compliant not_compliant compliant
ECCN code EAR99 EAR99 EAR99
JESD-609 code e4 e0 e0
Number of terminals 16 16 2
Maximum operating temperature 125 °C 125 °C 155 °C
Minimum operating temperature -55 °C -55 °C -55 °C
Package form FLATPACK IN-LINE SMT
surface mount YES NO YES
technology CMOS CMOS METAL GLAZE/THICK FILM
Terminal surface GOLD Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Maker Renesas Electronics Corporation Renesas Electronics Corporation -
Parts packaging code DFP DIP -
Contacts 16 16 -
Other features INPUT AC PARAMETRIC VALUES NOT FROM POST RADIATION MEASUREMENT; REGISTER BASED INPUT AC PARAMETRIC VALUES NOT FROM POST RADIATION MEASUREMENT; REGISTER BASED -
Maximum clock frequency (fCLK) 1.11 MHz 1.5 MHz -
period time 900.9 ns 900.9 ns -
JESD-30 code R-CDFP-F16 R-GDIP-T16 -
memory density 64 bit 64 bit -
Memory IC Type OTHER FIFO OTHER FIFO -
memory width 4 4 -
Number of functions 1 1 -
word count 16 words 16 words -
character code 16 16 -
Operating mode SYNCHRONOUS SYNCHRONOUS -
organize 16X4 16X4 -
Exportable YES YES -
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED -
encapsulated code DFP DIP -
Encapsulate equivalent code FL16,.3 DIP16,.3 -
Package shape RECTANGULAR RECTANGULAR -
Parallel/Serial PARALLEL PARALLEL -
power supply 5/15 V 5/15 V -
Certification status Not Qualified Not Qualified -
Filter level 38535V;38534K;883S 38535V;38534K;883S -
Maximum seat height 2.92 mm 6.35 mm -
Nominal supply voltage (Vsup) 15 V 5 V -
Temperature level MILITARY MILITARY -
Terminal form FLAT THROUGH-HOLE -
Terminal pitch 1.27 mm 2.54 mm -
Terminal location DUAL DUAL -
width 6.73 mm 7.62 mm -
Base Number Matches 1 1 -
Is it Rohs certified? - incompatible incompatible
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