DM8596J datasheet, PDF - EEWORLD Datasheet

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DM8596J: DescriptionIC,ROM,512X8,TTL,DIP,24PIN,CERAMIC; Categorystorage storage; File Size171KB，3 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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DM8596J Overview

IC,ROM,512X8,TTL,DIP,24PIN,CERAMIC

DM8596J Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	DIP, DIP24,.3
Reach Compliance Code	unknown
Maximum access time	120 ns
JESD-30 code	R-XDIP-T24
JESD-609 code	e0
memory density	4096 bit
Memory IC Type	MASK ROM
memory width	8
Number of terminals	24
word count	512 words
character code	512
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512X8
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Maximum slew rate	0.17 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

DM8596J Related Products

	DM8596J	DM7596J	DM8596N	DM8796N	DM8796J
Description	IC,ROM,512X8,TTL,DIP,24PIN,CERAMIC	IC,ROM,512X8,TTL,DIP,24PIN,CERAMIC	IC,ROM,512X8,TTL,DIP,24PIN,PLASTIC	IC,ROM,512X8,TTL,DIP,24PIN,PLASTIC	IC,ROM,512X8,TTL,DIP,24PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknow
Maximum access time	120 ns	150 ns	120 ns	120 ns	120 ns
JESD-30 code	R-XDIP-T24	R-XDIP-T24	R-PDIP-T24	R-PDIP-T24	R-XDIP-T24
JESD-609 code	e0	e0	e0	e0	e0
memory density	4096 bit	4096 bit	4096 bit	4096 bit	4096 bi
Memory IC Type	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM
memory width	8	8	8	8	8
Number of terminals	24	24	24	24	24
word count	512 words	512 words	512 words	512 words	512 words
character code	512	512	512	512	512
Maximum operating temperature	70 °C	125 °C	70 °C	70 °C	70 °C
organize	512X8	512X8	512X8	512X8	512X8
Package body material	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	0.17 mA	0.17 mA	0.17 mA	0.17 mA	0.17 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO
technology	TTL	TTL	TTL	TTL	TTL
Temperature level	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	Texas Instruments	Texas Instruments	-	Texas Instruments	Texas Instruments
Base Number Matches	1	1	1	-	-

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