5962-8757909XC datasheet, PDF - EEWORLD Datasheet

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5962-8757909XC: DescriptionMIL-STD-1553 Data Bus Transceiver, 1.895 X 0.775 INCH, 0.210 INCH HEIGHT, DIP-36; CategoryWireless rf/communication Telecom circuit; File Size170KB，23 Pages; ManufacturerC-MAC Automotive; Websitehttps://cmac.com

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5962-8757909XC Overview

MIL-STD-1553 Data Bus Transceiver, 1.895 X 0.775 INCH, 0.210 INCH HEIGHT, DIP-36

5962-8757909XC Parametric

Parameter Name	Attribute value
Maker	C-MAC Automotive
Parts packaging code	DIP
package instruction	DIP,
Contacts	36
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T36
JESD-609 code	e4
length	48.13 mm
Negative supply voltage rating	-15 V
Number of functions	2
Number of terminals	36
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	UNSPECIFIED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Filter level	MIL-PRF-38534
Maximum seat height	5.3 mm
surface mount	NO
Telecom integrated circuit types	MIL-STD-1553 DATA BUS TRANSCEIVER
Temperature level	MILITARY
Terminal surface	GOLD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
Base Number Matches	1

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REVISIONS

LTR

DESCRIPTION

Add device type 02. Inactivate device type 01 (no approved source of

supply).

Add device types 03 through 07. Add vendors CAGE 32116, 5Y243,

57363, and 88379. Changed to reflect MIL-H-38534 processing.

Editorial changes throughout.

Add device type 08. Add vendor CAGE 8K957. Editorial changes

throughout.

Corrections to table I and figure 3. Editorial changes throughout.

Changes in accordance with NOR 5962-R189-92.

Redrawn with changes. Add case outlines U and Z. Add device type

09. Editorial changes throughout.

Changes in accordance with NOR 5962-R110-94.

Changes in accordance with NOR 5962-R013-96.

Not used.

Incorporated NOR's 5962-R110-94 and 5962-R013-96. Made

changes to table I for device type 07. Redraw entire document.

Inactivate device types 03, 04, and 07 for new design. Add device

type 10.

Rewrite paragraphs 4.2.a.2. and 4.3.3.b.2 to add T

Table I, Total current, I

CC1

-SB, I

CC1

-25, I

CC1

-50, I

CC1

-100 for device

type 05; change the maximum limit from 25 mA to 60 mA. (4 places)

-gz

DATE (YR-MO-DA)

88-09-20

89-12-04

APPROVED

M. A. Frye

W. Heckman

91-01-16

92-03-03

92-04-27

92-11-11

94-02-17

95-12-15

W. Heckman

Alan Barone

Gregory A. Lude

K. A. Cottongim

Kendall A. Cottongim

96-06-20

98-01-28

04-11-05

07-05-10

K. A. Cottongim

Raymond Monnin

Robert M. Heber

THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Donald R. Osborne

CHECKED BY

D. A. Di Cenzo

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS

AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

AMSC N/A

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

http://www.dscc.dla.mil

APPROVED BY

N. A. Hauck

MICROCIRCUIT, HYBRID, DIGITAL, DUAL

CHANNEL, 15 VOLT, DRIVER-RECEIVER,

RECEIVER IDLE NORMALLY LOW

DRAWING APPROVAL DATE

87-08-06

REVISION LEVEL

SIZE

SHEET

CAGE CODE

67268

1 OF

5962-87579

DSCC FORM 2233

APR 97

5962-E409-07

1.3 Absolute maximum ratings. 1/

Supply voltage range:

(devices 01, 03, 04, 05, 07, 08, and 10) ..........................

(devices 01-04, 06, 07, 08, 09, and 10) ...........................

CC1

(all devices) ....................................................................

Logic input voltage .....................................................................

Receiver differential voltage.......................................................

Receiver common mode voltage range .....................................

Driver peak output current .........................................................

Power dissipation (P

) at T

= +125°C:

(devices 01 and 08) ................................................................

(device 02)..............................................................................

(device 03)..............................................................................

(devices 04 and 10) ................................................................

(device 05)..............................................................................

(devices 06 and 09 .................................................................

(device 07)..............................................................................

Storage temperature range........................................................

Lead temperature (soldering, 10 seconds).................................

Junction temperature (T

(devices 01-04, 06, 07, 08, 09, and 10) ..................................

(device 05)..............................................................................

Thermal resistance, junction-to-case (θ

(devices 01 and 05) ................................................................

(devices 02, 08, and 10) .........................................................

(device 03)..............................................................................

(device 04)..............................................................................

(devices 06 and 09) ................................................................

(device 07)..............................................................................

Thermal resistance, junction-to-ambient (θ

(devices 01 and 05) ................................................................

(devices 02, 08, and 10) .........................................................

(device 03)..............................................................................

(device 04)..............................................................................

(devices 06 and 09) ................................................................

(device 07)..............................................................................

1.4 Recommended operating conditions.

Supply voltage range:

(devices 01, 03, 04, 05, 07, and 10) ................................

(device 08).......................................................................

(devices 01-04, 06, 07, 09, and 10) .................................

(device 08) .......................................................................

CC1

(all devices) ....................................................................

Logic input voltage .....................................................................

Receiver differential voltage:

(devices 01, 02, 03, 06, and 09) .............................................

(devices 04, 05, 07, 08, and 10) .............................................

Receiver common mode voltage range:

(devices 01, 02, 03, 04, 06, and 09) .......................................

(devices 05, 07, 08, and 10) ...................................................

Driver peak output current (all devices) .....................................

Serial data rate ..........................................................................

Junction temperature (T

(devices 01, 02, 03, 05, 06, 08, 09, and 10 ............................

(devices 04 and 07) ................................................................

Case operating temperature range (T

) .....................................

+14.25 V dc to +15.75 V dc

+11.25 V dc to +15.75 V dc

-14.25 V dc to -15.75 V dc

-11.25 V dc to -15.75 V dc

+4.5 V dc to +5.5 V dc

0 V dc to +5 V dc

30 V

P-P

40 V

P-P

-5 V dc to +5 V dc

-10 V dc to +10 V dc

180 mA

1.0 MHz maximum

+150°C

+160°C

-55°C to +125°C

-0.3 V dc to +18 V dc

+0.3 V dc to -18 V dc

-0.3 V dc to +7 V dc

-0.3 V dc to V

CC1

40 V

P-P

-10 V dc to +10 V dc

200 mA

3.3 W

0.96 W 2/

1.65 W 2/

-65°C to +150°C

+300°C

+160°C

+150°C

8.8°C/W

7.0°C/W

47.2°C/W

88°C/W

18°C/W

60°C/W

28.8°C/W

27.0°C/W

67.2°C/W

108°C/W

35°C/W

80°C/W

1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the

maximum levels may degrade the performance and affect reliability.

2/ One channel transmitting at 100 percent duty cycle and the second channel is at standby.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

SIZE

REVISION LEVEL

5962-87579

SHEET

DSCC FORM 2234

APR 97

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part

of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the

solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 - Test Method Standard Microcircuits.

MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 - List of Standard Microcircuit Drawings.

MIL-HDBK-780 - Standard Microcircuit Drawings.

MIL-HDBK-1553 - Multiplex Applications Handbook.

(Copies of these documents are available online at

http://assist.daps.dla.mil/quicksearch/

http://assist.daps.dla.mil

or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of

this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item performance requirements for device class H shall be in accordance with MIL-

PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device

manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may

eliminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-

38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or

function of the device for the applicable device class.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in

MIL-PRF-38534 and herein.

3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein and figure 1.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.

3.2.3 Timing waveforms. The timing waveforms shall be as specified on figure 3.

3.2.4 Typical bus connections. The typical bus connections shall be as specified on figure 4.

3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are

as specified in table I and shall apply over the full specified operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

tests for each subgroup are defined in table I.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

SIZE

REVISION LEVEL

5962-87579

SHEET

DSCC FORM 2234

APR 97

3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with

the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.

3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described

herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,

for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those

which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be

made available to the preparing activity (DSCC-VA) upon request.

3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this

drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets

the performance requirements of MIL-PRF-38534 and herein.

3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of

microcircuits delivered to this drawing.

4. VERIFICATION

4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as

modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form,

fit, or function as described herein.

4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply:

Burn-in test, method 1015 of MIL-STD-883.

(1)

Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level

control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit

shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified

in method 1015 of MIL-STD-883.

or T

as specified in the approved manufacturer's QM plan.

(2)

Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter

tests prior to burn-in are optional at the discretion of the manufacturer.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

SIZE

REVISION LEVEL

5962-87579

SHEET

DSCC FORM 2234

APR 97

5962-8757909XC Related Products

	5962-8757909XC	5962-8757909XA	5962-8757906YC	5962-8757906YA	5962-8757909YA	5962-8757906XA	5962-8757906XC	5962-8757909YC
Description	MIL-STD-1553 Data Bus Transceiver, 1.895 X 0.775 INCH, 0.210 INCH HEIGHT, DIP-36	MIL-STD-1553 Data Bus Transceiver, 1.895 X 0.775 INCH, 0.210 INCH HEIGHT, DIP-36	MIL-STD-1553 Data Bus Transceiver, 1.905 X 0.785 INCH, 0.165 INCH HEIGHT, DFP-36	MIL-STD-1553 Data Bus Transceiver, 1.905 X 0.785 INCH, 0.165 INCH HEIGHT, DFP-36	MIL-STD-1553 Data Bus Transceiver, 1.905 X 0.785 INCH, 0.165 INCH HEIGHT, DFP-36	MIL-STD-1553 Data Bus Transceiver, 1.895 X 0.775 INCH, 0.210 INCH HEIGHT, DIP-36	MIL-STD-1553 Data Bus Transceiver, 1.895 X 0.775 INCH, 0.210 INCH HEIGHT, DIP-36	MIL-STD-1553 Data Bus Transceiver, 1.905 X 0.785 INCH, 0.165 INCH HEIGHT, DFP-36
Maker	C-MAC Automotive	C-MAC Automotive	C-MAC Automotive	C-MAC Automotive	C-MAC Automotive	C-MAC Automotive	C-MAC Automotive	C-MAC Automotive
Parts packaging code	DIP	DIP	DFP	DFP	DFP	DIP	DIP	DFP
package instruction	DIP,	DIP,	DFP,	DFP,	DFP,	DIP,	DIP,	DFP,
Contacts	36	36	36	36	36	36	36	36
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T36	R-XDIP-T36	R-XDFP-F36	R-XDFP-F36	R-XDFP-F36	R-XDIP-T36	R-XDIP-T36	R-XDFP-F36
JESD-609 code	e4	e0	e4	e0	e0	e0	e4	e4
Negative supply voltage rating	-15 V	-15 V	-15 V	-15 V	-15 V	-15 V	-15 V	-15 V
Number of functions	2	2	2	2	2	2	2	2
Number of terminals	36	36	36	36	36	36	36	36
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIP	DIP	DFP	DFP	DFP	DIP	DIP	DFP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	FLATPACK	FLATPACK	FLATPACK	IN-LINE	IN-LINE	FLATPACK
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	MIL-PRF-38534	MIL-PRF-38534	MIL-PRF-38534	MIL-PRF-38534	MIL-PRF-38534	MIL-PRF-38534	MIL-PRF-38534	MIL-PRF-38534
Maximum seat height	5.3 mm	5.3 mm	4.2 mm	4.2 mm	4.2 mm	5.3 mm	5.3 mm	4.2 mm
surface mount	NO	NO	YES	YES	YES	NO	NO	YES
Telecom integrated circuit types	MIL-STD-1553 DATA BUS TRANSCEIVER	MIL-STD-1553 DATA BUS TRANSCEIVER	MIL-STD-1553 DATA BUS TRANSCEIVER	MIL-STD-1553 DATA BUS TRANSCEIVER	MIL-STD-1553 DATA BUS TRANSCEIVER	MIL-STD-1553 DATA BUS TRANSCEIVER	MIL-STD-1553 DATA BUS TRANSCEIVER	MIL-STD-1553 DATA BUS TRANSCEIVER
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	GOLD	TIN LEAD	GOLD	TIN LEAD	TIN LEAD	TIN LEAD	GOLD	GOLD
Terminal form	THROUGH-HOLE	THROUGH-HOLE	FLAT	FLAT	FLAT	THROUGH-HOLE	THROUGH-HOLE	FLAT
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1	1	1	1	1

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