Application Specification
Miniature Spring
Socket Contacts
NOTE
NOTE
114-13152
22 JUN 05
Rev A
All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters [and
inches]. Unless otherwise specified, dimensions have a tolerance of +0.13 [+.005] and angles have a tolerance of +2 .
Figures and illustrations are for identification only and are not drawn to scale.
_
1. INTRODUCTION
This specification covers the application of Miniature Spring Socket Contacts. These requirements are
applicable to the product with hand or automatic application tooling.
When corresponding with Tyco Electronics Personnel, use the terminology provided on this specification to
help facilitate your inquiry for information. Basic terms and features of the socket is provided in Figure 1.
Typical Miniature Spring Contact
Eyelet
Series 1
Series 2
Spring
Knockout Bottom
(As Applicable)
Series 3
Series 4
Series 5
Figure 1
2. REFERENCE MATERIAL
2.1. Revision Summary
Initial release of document
2.2. Customer Assistance
Reference Product Base Part Number 330808 and Product Code 3076 are representative numbers of
Miniature Spring Socket Contacts. Use of these numbers will identify the product line and expedite your
inquiries through a service network established to help you obtain product and tooling information. Such
information can be obtained through a local Tyco Electronics Representative (Field Sales Engineer, Field
Applications Engineer, etc) or, after purchase, by calling the Tooling Assistance Center or Product Information
number at the bottom of this page.
S
E
2005 Tyco Electronics Corporation, Harrisburg, PA
This controlled document is subject to change.
PRODUCT INFORMATION 1-800-522-6752
TOOLING ASSISTANCE CENTER 1-800-722-1111
For the latest revision or Regional Customer Service,
visit our website at
All International Rights Reserved
AMP and Tyco are trademarks.
*Trademark
1
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LOC B
www.tycoelectronics.com
Other products, logos, and company names used are the property of their respective owners.
Miniature Spring Socket Contacts
2.3. Drawings
114-13152
Customer Drawings for specific products are available from the service network. The information contained in
Customer Drawings takes priority if there is a conflict with this specification or with any other technical
documentation supplied by Tyco Electronics.
2.4. Manuals
Manual 402–40 is available upon request and can be used as a guide to soldering. This manual provides
information on various flux types and characteristics with the commercial designation and flux removal
procedures. A checklist is included in the manual as a guide for information on soldering problems.
2.5. Instructional Material
The following list includes available instruction sheets (408–series) that provide assembly procedures for
operation, maintenance and repair of tooling; and customer manuals (409–series) that provide setup,
operation, and maintenance of machines.
Document Number
408–3280
409–5449
Document Title
Miniature Spring Socket Insertion Tool 382378–1
Miniature Spring Socket Insertion Machines (MSSIM & SCSIM) No. 682127–[ ]
2.6. Specifications
Product Specification 108–14008 provides information about performance, test results, and quality
requirements for the Miniature Spring Socket Contacts.
3. REQUIREMENTS
3.1. Safety
Do not stack socket contact packages so high that the shipping containers buckle or deform.
3.2. Material
The eyelet is made of copper and the spring is made of beryllium–copper. The socket contacts are available in
tin or gold plate.
3.3. Storage
A. Shelf Life
The sockets should remain in the shipping containers until ready for use to prevent deformation to the
contacts. The sockets should be used on a first in, first out basis to avoid storage contamination that could
adversely affect performance.
B. Chemical Exposure
Do not store sockets near any chemical listed below as they may cause stress corrosion cracking in the
contacts.
Alkalies
Amines
Ammonia
Carbonates
Citrates
Nitrites
Phosphates Citrates
Sulfur Nitrites
Sulfur Compounds
Tartrates
3.4. PC Board Requirements
A. Material and Thickness
The pc board material must be glass epoxy (FR–4 or G–10). The pc board thickness shall be 0.79–3.18
[.031–.125] thick.
NOTE
Contact the Product Information Center at the number listed at the bottom of page 1 for suitability of other board
materials and thicknesses.
B. Hole Dimensions
The pc board may be single–sided or double–sided, with or without plated–thru holes. See Figure 2.
2 of 7
Rev A
Miniature Spring Socket Contacts
114-13152
Board Thickness
0.79-3.18
[.031-.125]
Drilled Hole Diameter
(As Required)
Refer to the Customer Drawing for
Finished Hole Diameter After Plating
Figure 2
C. Layout
(Figure 3)
For components other than Miniature Spring Socket Contacts mounted on the pc board, the clearance
envelope for application tooling shall be 5.03 [.198] minimum diameter on the head side of the pc board
and 2.90 [.114] minimum diameter on the other side.
For plated through holes, tin or tin–lead plating shall not exceed 0.03 [.001] to ensure minimum retention.
NOTE
The pc board should be supported around the hole when inserting sockets. Refer to Instruction Sheet 408-6927.
2.54 [.100] Min.
Refer to the Customer
Refer to 3.4.D
Drawing for Finished Hole
Diameter After Plating
2.54 [.100] Min.
Figure 3
3.5. Insertion
Using the recommended tooling and related documentation provided in Section 5, TOOLING, insert the socket
contacts into the pc board.
3.6. Soldering Socket Contacts
The Miniature Spring Socket Contacts can be soldered with wave, vapor phase, or infrared reflow processes,
provided the temperatures and exposure time are within the ranges specified in Figure 4. Tyco Electronics
recommends the use of SN60 or SN62 solder for the socket contacts. Refer to Paragraph 2.4 for instructional
material that is available for establishing soldering guidelines.
Rev
A
ÉÉÉÉÉ
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ÇÇ
ÉÉÉÉÉ
ÇÇ
ÉÉ
ÉÉ
ÉÉÉÉÉ
ÇÇ
ÉÉ
ÉÉÉÉÉ
ÇÇ
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Tin Lead Plating (As Required)
Edges Shall Be
Free of Burrs
and Fibers
ÉÉÉÉÉ
Ç
É
ÉÉÉÉÉ
Ç
É
ÉÉÉÉÉ
Ç
É
ÉÉÉÉÉ
Ç
É
ÉÉÉÉÉ
Ç
É
ÉÉÉÉÉ
Ç
É
ÉÉÉÉÉ
ÉÉÉÉÉ
Trace Width (As Required)
Pad Width (As Required)
3
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Miniature Spring Socket Contacts
114-13152
TEMPERATURE
SOLDERING PROCESS
CELSIUS
Wave Soldering
Vapor Phase Soldering
Infrared Reflow Soldering
265
260
260
FAHRENHEIT
509
500
500
TIME
(At Max Temperature)
12 Seconds
3 Minutes
3 Minutes
°
D
°
°
°
D
°
°
D
Wave Temperature
A.
Flux Selection
Figure 4
The socket contact must be fluxed prior to soldering with a mildly active, rosin base flux. Selection of the
flux will depend on the type of pc board and other components mounted on the board. Additionally, the flux
must be compatible with the wave solder line, manufacturing, health, and safety requirements. Call the
Product Information phone number at the bottom of page 1 for consideration of other types of flux. Some
fluxes that are compatible with these contacts are provided in Figure 5.
COMMERCIAL DESIGNATION
FLUX TYPE
ACTIVITY
RESIDUE
KESTER
Type RMA
(Mildly Activated)
Mild
Noncorrosive
186
ALPHA
611
Figure 5
B.
Cleaning
After soldering, removal of fluxes, residues, and activators is necessary. Consult with the supplier of the
solder and flux for recommended cleaning solvents. The following is a listing of common cleaning solvents
that will not affect the contacts for the time and temperature specified. See Figure 6.
DANGER
Consideration must be given to toxicity and other safety requirements recommended by the solvent manufacturer.
Refer to the manufacturer's Material Safety Data Sheet (MSDS) for characteristics and handling of cleaners.
Trichloroethylene and Methylene Chloride can be used with no harmful affect to the contacts; however Tyco
Electronics does not recommend them because of the harmful occupational and environmental effects. Both are
carcinogenic (cancer-causing) and Trichloroethylene is harmful to the earth's ozone layer.
NOTE
If you have a particular solvent that is not listed, contact the T
ooling Assistance Center or Product Information number
at the bottom of page 1.
CLEANER
TEMPERATURES
TIME
(Minutes)
TYPE
Aqueous
Solvent
Solvent
Solvent
Aqueous
Aqueous
Aqueous
Aqueous
Solvent
1
5
1
5
5
5
5
5
5
(Maximum)
CELSIUS
132
100
FAHRENHEIT
270
212
NAME
ALPHA 2110
BIOACT EC-7
Butyl CARBITOL
Isopropyl Alcohol
KESTER 5778
KESTER 5779
LONCOTERGE 520
LONCOTERGE 530
Terpene Solvent
Room Ambient
100
100
100
100
100
100
212
212
212
212
212
212
Figure 6
C. Drying
When drying cleaned socket contacts, make certain that temperature limitations are not exceeded: –65° to
125°C [–85° to 257°F]. Excessive temperatures may cause degradation.
3.7. Checking Installed Socket Contact
All solder joints should conform to those specified in Workmanship Specification 101–21. The socket contact
must seat on the pc board to within the tolerance shown in Figure 7. There shall be no deformation of the
socket contact during the insertion operation that will affect the performance.
4 of 7
Rev A
Miniature Spring Socket Contacts
114-13152
PC Board
Pin Contact
Installed Socket Contact
0.76 [.030] Max.
Eyelet
Spring
Solder (Solder Fillet Should be
Evenly Formed Around Socket)
Knockout Bottom
(As Applicable)
Figure 7
3.8. Repair/Replacement
Socket contacts are not repairable if damaged. Damaged socket contacts must be removed and replaced. The
socket contact can be removed from the pc board by standard de–soldering methods.
4. QUALIFICATIONS
Miniature Spring Socket Contacts are not required to be agency approved.
5. TOOLING
Tyco Electronics has existing tooling for applying these socket contacts. Part numbers of available tooling and
the applicable instructional material is provided in Figure 8. A customer supplied support fixture should be used
in conjunction with the application of the Miniature Spring Socket Contacts.
MINIATURE SPRING SOCKETS
SERIES
SIZE
1
2
3
4
5
PIN DIAMETER
+0.025 [.001]
0.305 [.012]
0.355 [.014]
0.635 [.025]
0.889 [.035]
1.066 [.042]
MINIATURE SPRING SOCKET TOOLING (DOCUMENT)
INSERTION MACHINE (409-5449)
HAND INSERTION TOOL (408-3280)
682127-2
682127-3
682127-4
682127-5
682127-6
382378-1
Figure 8 (cont’d)
Rev A
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