DM74S573BN datasheet, PDF - EEWORLD Datasheet

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DM74S573BN: DescriptionIC 1K X 4 OTPROM, 35 ns, PDIP18, PLASTIC, DIP-18, Programmable ROM; Categorystorage storage; File Size119KB，4 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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DM74S573BN Overview

IC 1K X 4 OTPROM, 35 ns, PDIP18, PLASTIC, DIP-18, Programmable ROM

DM74S573BN Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
Parts packaging code	DIP
package instruction	DIP, DIP18,.3
Contacts	18
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	35 ns
JESD-30 code	R-PDIP-T18
JESD-609 code	e0
length	21.755 mm
memory density	4096 bit
Memory IC Type	OTP ROM
memory width	4
Number of functions	1
Number of terminals	18
word count	1024 words
character code	1000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1KX4
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP18,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum slew rate	0.14 mA
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	BIPOLAR
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm
Base Number Matches	1

DM74S573BN Related Products

	DM74S573BN	DM74S573BJ	DM74S573BV	DM74S573V	DM74S573AV	DM74S573AN	DM74S573AJ	DM74S573N	DM74S573J
Description	IC 1K X 4 OTPROM, 35 ns, PDIP18, PLASTIC, DIP-18, Programmable ROM	1KX4 OTPROM, 35ns, CDIP18, CERAMIC, DIP-18	1KX4 OTPROM, 35ns, PQCC20, PLASTIC, LCC-20	1KX4 OTPROM, 60ns, PQCC20, PLASTIC, LCC-20	IC 1K X 4 OTPROM, 45 ns, PQCC20, PLASTIC, LCC-20, Programmable ROM	1KX4 OTPROM, 45ns, PDIP18, PLASTIC, DIP-18	1KX4 OTPROM, 45ns, CDIP18, CERAMIC, DIP-18	1KX4 OTPROM, 60ns, PDIP18, PLASTIC, DIP-18	IC 1K X 4 OTPROM, 60 ns, CDIP18, CERAMIC, DIP-18, Programmable ROM
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	DIP	DIP	QLCC	QLCC	QLCC	DIP	DIP	DIP	DIP
package instruction	DIP, DIP18,.3	DIP, DIP18,.3	QCCJ, LDCC20,.4SQ	QCCJ, LDCC20,.4SQ	QCCJ, LDCC20,.4SQ	DIP, DIP18,.3	DIP, DIP18,.3	DIP, DIP18,.3	DIP, DIP18,.3
Contacts	18	18	20	20	20	18	18	18	18
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	35 ns	35 ns	35 ns	60 ns	45 ns	45 ns	45 ns	60 ns	60 ns
JESD-30 code	R-PDIP-T18	R-GDIP-T18	S-PQCC-J20	S-PQCC-J20	S-PQCC-J20	R-PDIP-T18	R-GDIP-T18	R-PDIP-T18	R-GDIP-T18
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
memory density	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	4	4	4	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	18	18	20	20	20	18	18	18	18
word count	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words
character code	1000	1000	1000	1000	1000	1000	1000	1000	1000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	1KX4	1KX4	1KX4	1KX4	1KX4	1KX4	1KX4	1KX4	1KX4
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP	QCCJ	QCCJ	QCCJ	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP18,.3	DIP18,.3	LDCC20,.4SQ	LDCC20,.4SQ	LDCC20,.4SQ	DIP18,.3	DIP18,.3	DIP18,.3	DIP18,.3
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	5.08 mm	4.57 mm	4.57 mm	4.57 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm
Maximum slew rate	0.14 mA	0.14 mA	0.14 mA	0.14 mA	0.14 mA	0.14 mA	0.14 mA	0.14 mA	0.14 mA
Maximum supply voltage (Vsup)	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V
Minimum supply voltage (Vsup)	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	YES	YES	NO	NO	NO	NO
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	J BEND	J BEND	J BEND	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	QUAD	QUAD	QUAD	DUAL	DUAL	DUAL	DUAL
width	7.62 mm	7.62 mm	8.89 mm	8.89 mm	8.89 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	-	incompatible	incompatible	incompatible	incompatible
length	21.755 mm	-	8.89 mm	8.89 mm	8.89 mm	21.755 mm	-	21.755 mm	-

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