54FCT241ADMX datasheet, PDF - EEWORLD Datasheet

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54FCT241ADMX: DescriptionIC,BUFFER/DRIVER,DUAL,4-BIT,FCT/PCT-CMOS,DIP,20PIN,CERAMIC; Categorylogic logic; File Size361KB，8 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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54FCT241ADMX Overview

IC,BUFFER/DRIVER,DUAL,4-BIT,FCT/PCT-CMOS,DIP,20PIN,CERAMIC

54FCT241ADMX Parametric

Parameter Name	Attribute value
package instruction	DIP, DIP20,.3
Reach Compliance Code	unknown
Control type	ENABLE LOW/HIGH
JESD-30 code	R-XDIP-T20
Load capacitance (CL)	50 pF
Logic integrated circuit type	BUS DRIVER
MaximumI(ol)	0.048 A
Number of digits	4
Number of functions	2
Number of terminals	20
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output characteristics	3-STATE
Output polarity	TRUE
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP20,.3
Package shape	RECTANGULAR
Package form	IN-LINE
method of packing	TAPE AND REEL
power supply	5 V
Certification status	Not Qualified
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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Description	IC,BUFFER/DRIVER,DUAL,4-BIT,FCT/PCT-CMOS,DIP,20PIN,CERAMIC	IC,BUFFER/DRIVER,DUAL,4-BIT,FCT/PCT-CMOS,LLCC,20PIN,CERAMIC	IC,BUFFER/DRIVER,DUAL,4-BIT,FCT/PCT-CMOS,LLCC,20PIN,CERAMIC	IC,BUFFER/DRIVER,DUAL,4-BIT,FCT/PCT-CMOS,DIP,20PIN,CERAMIC	IC,BUFFER/DRIVER,DUAL,4-BIT,FCT/PCT-CMOS,DIP,20PIN,CERAMIC	IC,BUFFER/DRIVER,DUAL,4-BIT,FCT/PCT-CMOS,FP,20PIN,CERAMIC	IC,BUFFER/DRIVER,DUAL,4-BIT,FCT/PCT-CMOS,DIP,20PIN,CERAMIC	74FCT241DCQR
package instruction	DIP, DIP20,.3	QCCN, LCC20,.35SQ	QCCN, LCC20,.35SQ	DIP, DIP20,.3	DIP, DIP20,.3	DFP, FL20,.3	DIP, DIP20,.3	DIP, DIP20,.3
Reach Compliance Code	unknown	unknow	unknown	unknown	unknown	unknown	unknown	unknown
Control type	ENABLE LOW/HIGH	ENABLE LOW/HIGH	ENABLE LOW/HIGH	ENABLE LOW/HIGH	ENABLE LOW/HIGH	ENABLE LOW/HIGH	ENABLE LOW/HIGH	ENABLE LOW/HIGH
JESD-30 code	R-XDIP-T20	S-XQCC-N20	S-XQCC-N20	R-XDIP-T20	R-XDIP-T20	R-XDFP-F20	R-XDIP-T20	R-XDIP-T20
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
MaximumI(ol)	0.048 A	0.048 A	0.048 A	0.048 A	0.048 A	0.048 A	0.064 A	0.064 A
Number of digits	4	4	4	4	4	4	4	4
Number of functions	2	2	2	2	2	2	2	2
Number of terminals	20	20	20	20	20	20	20	20
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	70 °C	70 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-	-
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Output polarity	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	QCCN	QCCN	DIP	DIP	DFP	DIP	DIP
Encapsulate equivalent code	DIP20,.3	LCC20,.35SQ	LCC20,.35SQ	DIP20,.3	DIP20,.3	FL20,.3	DIP20,.3	DIP20,.3
Package shape	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE	FLATPACK	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	NO	NO	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	NO LEAD	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	FLAT	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	DUAL	QUAD	QUAD	DUAL	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1	1	1	1	1

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