5962-9162303MYX datasheet, PDF

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Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> 5962-9162303MYX

5962-9162303MYX: DescriptionGRAPHICS PROCESSOR, CQFP132, CERAMIC, QFP-132; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，92 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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5962-9162303MYX Overview

GRAPHICS PROCESSOR, CQFP132, CERAMIC, QFP-132

5962-9162303MYX Parametric

Parameter Name	Attribute value
Parts packaging code	QFP
package instruction	QFF,
Contacts	132
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
maximum clock frequency	32 MHz
External data bus width	32
JESD-30 code	S-CQFP-F132
length	24.065 mm
Maximum number of bits per pixel	32
Number of terminals	132
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QFF
Package shape	SQUARE
Package form	FLATPACK
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Filter level	MIL-STD-883 Class B
Maximum seat height	3.3 mm
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	FLAT
Terminal pitch	0.635 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	24.065 mm
uPs/uCs/peripheral integrated circuit type	GRAPHICS PROCESSOR
Base Number Matches	1

5962-9162303MYX Related Products

	5962-9162303MYX	5962-9162303MXX	5962-9162304MXX	5962-9162304MYX
Description	GRAPHICS PROCESSOR, CQFP132, CERAMIC, QFP-132	GRAPHICS PROCESSOR, CPGA145, CERAMIC, PGA-145	GRAPHICS PROCESSOR, CPGA145, CERAMIC, PGA-145	GRAPHICS PROCESSOR, CQFP132, CERAMIC, QFP-132
Parts packaging code	QFP	PGA	PGA	QFP
package instruction	QFF,	PGA,	PGA,	QFF,
Contacts	132	145	145	132
Reach Compliance Code	unknown	compli	compli	compli
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
maximum clock frequency	32 MHz	32 MHz	40 MHz	40 MHz
External data bus width	32	32	32	32
JESD-30 code	S-CQFP-F132	S-CPGA-P145	S-CPGA-P145	S-CQFP-F132
Maximum number of bits per pixel	32	32	32	32
Number of terminals	132	145	145	132
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QFF	PGA	PGA	QFF
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK	GRID ARRAY	GRID ARRAY	FLATPACK
Certification status	Not Qualified	Qualified	Qualified	Qualified
Filter level	MIL-STD-883 Class B	MIL-STD-883 Class B	MIL-STD-883 Class B	MIL-STD-883 Class B
Maximum supply voltage	5.5 V	5.5 V	5.25 V	5.25 V
Minimum supply voltage	4.5 V	4.5 V	4.75 V	4.75 V
Nominal supply voltage	5 V	5 V	5 V	5 V
surface mount	YES	NO	NO	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	FLAT	PIN/PEG	PIN/PEG	FLAT
Terminal location	QUAD	PERPENDICULAR	PERPENDICULAR	QUAD
uPs/uCs/peripheral integrated circuit type	GRAPHICS PROCESSOR	GRAPHICS PROCESSOR	GRAPHICS PROCESSOR	GRAPHICS PROCESSOR
Base Number Matches	1	1	1	1
length	24.065 mm	-	39.751 mm	24.065 mm
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
Maximum seat height	3.3 mm	-	5.21 mm	3.3 mm
Terminal pitch	0.635 mm	-	2.54 mm	0.635 mm
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
width	24.065 mm	-	39.751 mm	24.065 mm

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