ASG303
Features
·SiGe
Technology
·19
dB Gain at 900 MHz
·+19
dBm P1dB
·+40
dBm Output IP3
·2.9
dB Noise Figure
·MTTF
> 100 Years
·Single
+5 V Supply
·SOT-89
Surface Mount Package
Description
DC-2500 MHz SiGe HBT Amplifier
The ASG303 is designed for high linearity, high
gain, and low noise over a wide range of fre-
quency, being suitable for use in both receiver
and
transmitter
of
wireless
and
wireline
is
telecommunication
systems.
The
product
303
Package Style: SOT-89
manufactured using a state-of-the-art SiGe HBT
process of the company's own, making it cost-
effective and highly reliable. The amplifiers are
available in a low cost SOT-89
completing stringent DC and RF tests.
package
Specifications
1)
Parameters
Frequency Range
Gain
Input VSWR
Output VSWR
Output IP3
2)
Units
MHz
dB
-
-
dBm
dB
dBm
mA
V
3)
Min.
Typ.
250 - 2500
Max.
Applications
·CDMA,GSM,W-CDMA,PCS
·Gain
Block
·CATV
Amplifier
·IF
Amplifier
·Bluetooth
Amplifier
·Wireless
LAN Amplifier
18
19
1.5
1.5
38
40
2.9
19
55
5
78.2
Noise Figure
Output P1dB
Supply Current
Supply Voltage
Thermal Resistance, R
th
°C/W
1) Measurement conditions are as follows: T = 25°C, V
CC
= 5 V, Freq. = 900 MHz, 50 ohm system.
2) OIP3 is measured with two tones at an output power of +8 dBm/tone separated by 1 MHz.
3) The thermal resistance was determined at a DC power of 0.270 W (V
CC
=5 V, I
C
=54 mA) with RF signal and a lead temperature
of 28.8
°C
Absolute Maximum Ratings
Parameters
Operating Case Temperature
Storage Temperature
Supply Voltage
Operating Junction Temperature
Input RF Power (continuous)
Rating
-40 to
+85°C
-40 to
+150°C
8V
150°C
+6 dB above Input P1dB
Remarks
More Information
Website: www.asb.co.kr
E-mail: sales@asb.co.kr
Tel: (82) 42-528-7220
Fax: (82) 42-528-7222
ASB Inc., 4th Fl. Venture Town
Bldg., 367-17 Goijeong-Dong,
Seo-Gu, Daejon 302-716, Korea
Application Note
Ordering Information
Part Number
ASG303
EB-ASG303-900
EB-ASG303-2000
Description
High linearity medium power amplifier
(Available in tape and reel)
Fully assembled evaluation kit (900 MHz)
Fully assembled evaluation kit (2000 MHz)
1/6
ww.ASB.co.kr
March 2004
ASG303
Outline Drawing
(Unit: mm)
3
a
2
2
1
Pin Description
Function
Input
Ground
Output
Pin No.
1
2
3
Land Pattern
Mounting Configuration
(Unit: mm)
Note: 1. The number and size of ground via holes in a circuit board is critical for thermal
and RF grounding considerations.
2. We recommend that the ground via holes be placed on the bottom of lead pin 2
for better RF and thermal performance, as shown in the drawing at the left side.
2/6
ww.ASB.co.kr
March 2004
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