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74HC4851; 74HCT4851
8-channel analog multiplexer/demultiplexer with
injection-current effect control
Rev. 02 — 2 September 2008
Product data sheet
1. General description
The 74HC4851; 74HCT4851 are high-speed Si-gate CMOS devices and are specified in
compliance with JEDEC standard no. 7A.
The 74HC4851; 74HCT4851 are 8-channel analog multiplexers/demultiplexers with three
digital select inputs (S0 to S2), an active-LOW enable input (E), eight independent
inputs/outputs (Y0 to Y7) and a common input/output (Z). The devices feature
injection-current effect control, which has excellent value in automotive applications where
voltages in excess of the supply voltage are common.
With E LOW, one of the eight switches is selected (low impedance ON-state) by S0 to S2.
With E HIGH, all switches are in the high-impedance OFF-state, independent of S0 to S2.
The injection-current effect control allows signals at disabled analog input channels to
exceed the supply voltage without affecting the signal of the enabled analog channel.
This eliminates the need for external diode/resistor networks typically used to keep the
analog channel signals within the supply-voltage range.
2. Features
I
Injection-current cross coupling < 1 mV/mA
I
Wide supply voltage range from 2.0 V to 6.0 V for 74HC4851
I
ESD protection:
N
HBM JESD22-A114E exceeds 2000 V
N
CDM JESD22-C101C exceeds 1000 V
I
Latch-up performance exceeds 100 mA per JESD 78 Class II level A
I
Low ON-state resistance:
N
400
Ω
(typical) at V
CC
= 2.0 V
N
215
Ω
(typical) at V
CC
= 3.0 V
N
120
Ω
(typical) at V
CC
= 3.3 V
N
76
Ω
(typical) at V
CC
= 4.5 V
N
59
Ω
(typical) at V
CC
= 6.0 V
NXP Semiconductors
74HC4851; 74HCT4851
8-channel analog MUX/DEMUX with injection-current effect control
3. Applications
I
I
I
I
Analog multiplexing and demultiplexing
Digital multiplexing and demultiplexing
Signal gating
Automotive application
4. Ordering information
Table 1.
Ordering information
Package
Temperature range Name
74HC4851D
74HC4851PW
74HC4851BQ
−40 °C
to +125
°C
−40 °C
to +125
°C
−40 °C
to +125
°C
SO16
TSSOP16
Description
plastic small outline package; 16 leads;
body width 3.9 mm
plastic thin shrink small outline package; 16 leads;
body width 4.4 mm
Version
SOT109-1
SOT403-1
SOT763-1
Type number
DHVQFN16 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 16 terminals;
body 2.5
×
3.5
×
0.85 mm
SO16
TSSOP16
plastic small outline package; 16 leads;
body width 3.9 mm
plastic thin shrink small outline package; 16 leads;
body width 4.4 mm
74HCT4851D
−40 °C
to +125
°C
SOT109-1
SOT403-1
SOT763-1
74HCT4851PW
−40 °C
to +125
°C
74HCT4851BQ
−40 °C
to +125
°C
DHVQFN16 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 16 terminals;
body 2.5
×
3.5
×
0.85 mm
5. Functional diagram
11
10
9
6
0
8X
2
G8
0
7
13
S0
S1
S2
11
10
9
14
15
12
1
5
2
E
6
3
Z
4
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
3
MUX/DMUX
0
1
2
3
4
5
6
7
13
14
15
12
1
5
2
4
001aad541
001aad542
Fig 1. Logic symbol
74HC_HCT4851_2
Fig 2. IEC logic symbol
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 — 2 September 2008
2 of 20
NXP Semiconductors
74HC4851; 74HCT4851
8-channel analog MUX/DEMUX with injection-current effect control
V
CC
16
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
INJECTION
CURRENT
CONTROL
8
001aaf875
13
Y0
S0
11
14
Y1
15
Y2
S1
10
12
Y3
1-OF-8
DECODER
1
Y4
S2
9
5
Y5
2
Y6
E
6
4
Y7
3
Z
GND
Fig 3. Functional diagram
74HC_HCT4851_2
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 — 2 September 2008
3 of 20
NXP Semiconductors
74HC4851; 74HCT4851
8-channel analog MUX/DEMUX with injection-current effect control
6. Pinning information
6.1 Pinning
74HC4851
74HCT4851
Y4
Y6
Z
Y7
Y5
E
n.c.
GND
1
2
3
4
5
6
7
8
001aaf876
74HC4851
74HCT4851
16 V
CC
15 Y2
Y6
14 Y1
13 Y0
12 Y3
11 S0
10 S1
9
S2
Z
Y7
Y5
E
n.c.
2
3
4
5
6
7
8
GND
S2
9
GND
(1)
terminal 1
index area
16 V
CC
15 Y2
14 Y1
13 Y0
12 Y3
11 S0
10 S1
Y4
1
001aaf877
Transparent top view
(1) The die substrate is attached to this pad using
conductive die attach material. It can not be used as
a supply pin or input.
Fig 4. Pin configuration SO16 and TSSOP16
Fig 5. Pin configuration DHVQFN16
6.2 Pin description
Table 2.
Symbol
Y4
Y6
Z
Y7
Y5
E
n.c.
GND
S2
S1
S0
Y3
Y0
Y1
Y2
V
CC
Pin description
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Description
independent input/output
independent input/output
common input/output
independent input/output
independent input/output
enable input (active LOW)
not connected
ground (0 V)
select input
select input
select input
independent input/output
independent input/output
independent input/output
independent input/output
supply voltage
74HC_HCT4851_2
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 — 2 September 2008
4 of 20
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