RK80546PE0721M datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> RK80546PE0721M

RK80546PE0721M: DescriptionMicroprocessor, 32-Bit, 2800MHz, CMOS, CPGA478, 1.27 MM PITCH, FLIP CHIP, MICRO PGA-478; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，81 Pages; ManufacturerIntel; Websitehttp://www.intel.com/; Environmental Compliance

Download Datasheet Parametric Compare View All

RK80546PE0721M Overview

Microprocessor, 32-Bit, 2800MHz, CMOS, CPGA478, 1.27 MM PITCH, FLIP CHIP, MICRO PGA-478

RK80546PE0721M Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Intel
Parts packaging code	PGA
package instruction	SPGA, BGA478,26X26,50
Contacts	478
Reach Compliance Code	unknown
ECCN code	3A001.A.3
Address bus width	36
bit size	32
boundary scan	YES
maximum clock frequency	133 MHz
External data bus width	64
Format	FLOATING POINT
Integrated cache	YES
JESD-30 code	S-CPGA-P478
length	35 mm
low power mode	YES
Number of terminals	478
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	SPGA
Encapsulate equivalent code	BGA478,26X26,50
Package shape	SQUARE
Package form	GRID ARRAY, SHRINK PITCH
power supply	1.2 V
Certification status	Not Qualified
Maximum seat height	4.5 mm
speed	2800 MHz
Maximum supply voltage	1.4 V
Minimum supply voltage	1.25 V
Nominal supply voltage	1.2 V
surface mount	NO
technology	CMOS
Terminal form	PIN/PEG
Terminal pitch	1.27 mm
Terminal location	PERPENDICULAR
width	35 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR
Base Number Matches	1

Preview

Download Datasheet

View All

Intel

Pentium

4 Processor on

90 nm Process

Datasheet

2.80 GHz – 3.40 GHz Frequencies Supporting Hyper-Threading

Technology

for All Frequencies with 800 MHz Front Side Bus

February 2005

Document Number: 300561-003

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY

ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN

INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS

ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES

RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER

INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel

Pentium

4 processor on 90 nm process may contain design defects or errors known as errata which may cause the product to deviate

from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Hyper-Threading Technology requires a computer system with an Intel

Pentium

4 processor supporting HT Technology and a Hyper-Threading

Technology enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use.

See

http://www.intel.com/info/hyperthreading/

for more information including details on which processors support HT Technology.

Intel, Pentium, Intel NetBurst, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States

and other countries.

*Other names and brands may be claimed as the property of others.

Datasheet

Contents

Introduction

.................................................................................................................. 9

1.1

1.2

Terminology......................................................................................................... 10

1.1.1 Processor Packaging Terminology......................................................... 10

References .......................................................................................................... 11

Power and Ground Pins ...................................................................................... 13

Decoupling Guidelines ........................................................................................ 13

2.2.1 V

Decoupling ...................................................................................... 13

2.2.2 FSB GTL+ Decoupling ........................................................................... 13

2.2.3 FSB Clock (BCLK[1:0]) and Processor Clocking.................................... 14

Voltage Identification ........................................................................................... 14

2.3.1 Phase Lock Loop (PLL) Power and Filter............................................... 16

Reserved, Unused, and TESTHI Pins.................................................................17

FSB Signal Groups..............................................................................................18

Asynchronous GTL+ Signals............................................................................... 19

Test Access Port (TAP) Connection.................................................................... 19

FSB Frequency Select Signals (BSEL[1:0]) ........................................................ 20

Absolute Maximum and Minimum Ratings .......................................................... 21

Processor DC Specifications............................................................................... 21

Overshoot Specification............................................................................... 29

2.11.1 Die Voltage Validation ............................................................................ 30

Package Mechanical Specifications .................................................................... 31

3.1.1 Package Mechanical Drawing ................................................................ 32

3.1.2 Processor Component Keep-out Zones ................................................. 35

3.1.3 Package Loading Specifications ............................................................ 35

3.1.4 Package Handling Guidelines ................................................................ 35

3.1.5 Package Insertion Specifications ........................................................... 36

3.1.6 Processor Mass Specification ................................................................ 36

3.1.7 Processor Materials................................................................................ 36

3.1.8 Processor Markings................................................................................ 36

3.1.9 Processor Pinout Coordinates................................................................ 37

Processor Pin Assignments ................................................................................ 39

Alphabetical Signals Reference .......................................................................... 54

Processor Thermal Specifications....................................................................... 63

5.1.1 Thermal Specifications ........................................................................... 63

5.1.2 Thermal Metrology ................................................................................. 66

Processor Thermal Features............................................................................... 67

5.2.1 Thermal Monitor ..................................................................................... 67

Electrical Specifications

........................................................................................ 13

2.1

2.2

2.3

2.4

2.5

2.6

2.7

2.8

2.9

2.10

2.11

Package Mechanical Specifications

.................................................................31

3.1

Pin List and Signal Description

.......................................................................... 39

4.1

4.2

Thermal Specifications and Design Considerations

................................. 63

5.1

5.2

Datasheet

5.2.2

5.2.3

5.2.4

5.2.5

5.2.6

On-Demand Mode.................................................................................. 68

PROCHOT# Signal Pin .......................................................................... 68

THERMTRIP# Signal Pin ....................................................................... 69

control

and Fan Speed Reduction.......................................................... 69

Thermal Diode........................................................................................ 69

Features

....................................................................................................................... 71

6.1

6.2

Power-On Configuration Options ........................................................................ 71

Clock Control and Low Power States.................................................................. 72

6.2.1 Normal State—State 1 ........................................................................... 72

6.2.2 AutoHALT Powerdown State—State 2 .................................................. 72

6.2.3 Stop-Grant State—State 3 ..................................................................... 73

6.2.4 HALT/Grant Snoop State—State 4 ........................................................ 73

6.2.5 Sleep State—State 5.............................................................................. 74

Mechanical Specifications ................................................................................... 76

7.1.1 Boxed Processor Cooling Solution Dimensions ..................................... 76

7.1.2 Boxed Processor Fan Heatsink Weight.................................................. 77

7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach

Clip Assembly ........................................................................................ 78

Electrical Requirements ...................................................................................... 78

7.2.1 Fan Heatsink Power Supply ................................................................... 78

Thermal Specifications........................................................................................ 79

7.3.1 Boxed Processor Cooling Requirements ............................................... 79

7.3.2 Variable Speed Fan ............................................................................... 81

Boxed Processor Specifications

....................................................................... 75

7.1

7.2

7.3

Datasheet

Figures

Phase Lock Loop (PLL) Filter Requirements ...................................................... 16

Static and Transient Tolerance for Loadline A............................................. 24

Static and Transient Tolerance for Loadline B............................................. 26

Overshoot Example Waveform.................................................................... 30

Processor Package Assembly............................................................................. 31

Processor Package Drawing (Sheet 1 of 2) ........................................................ 33

Processor Package Drawing (Sheet 2 of 2) ........................................................ 34

Processor Top-Side Markings ............................................................................. 36

Processor Pinout Coordinates (Top View) .......................................................... 37

Pinout Diagram (Top View—Left Side) ............................................................... 40

Pinout Diagram (Top View—Right Side) ............................................................. 41

Thermal Profile .................................................................................................... 66

Case Temperature (TC) Measurement Location................................................. 66

Stop Clock State Machine ................................................................................... 72

Mechanical Representation of the Boxed Processor .......................................... 75

Space Requirements for the Boxed Processor (Side View)................................ 76

Space Requirements for the Boxed Processor (Top View)................................. 77

Boxed Processor Fan Heatsink Power Cable Connector Description................. 78

Baseboard Power Header Placement Relative to Processor Socket.................. 79

Boxed Processor Fan Heatsink Airspace Keep-out Requirements

(side 1 view) ........................................................................................................ 80

Boxed Processor Fan Heatsink Airspace Keep-out Requirements

(side 2 view) ........................................................................................................ 80

Boxed Processor Fan Heatsink Set Points ......................................................... 81

Datasheet

RK80546PE0721M Related Products

	RK80546PE0721M	RK80546PG0721M	B80546PG0881M	BX80546PE2800E	NE80546PG0881M	RK80546PG0881M	B80546PG0801M	B80546PE0721M	B80546PG0721M
Description	Microprocessor, 32-Bit, 2800MHz, CMOS, CPGA478, 1.27 MM PITCH, FLIP CHIP, MICRO PGA-478	Microprocessor, 32-Bit, 2800MHz, CMOS, CPGA478, 1.27 MM PITCH, FLIP CHIP, MICRO PGA-478	Microprocessor, 32-Bit, 3200MHz, CMOS, CPGA478, 1.27 MM PITCH, FLIP CHIP, MICRO PGA-478	Microprocessor, 32-Bit, 2800MHz, CMOS, CPGA478, 1.27 MM PITCH, FLIP CHIP, MICRO PGA-478	Microprocessor, 32-Bit, 3200MHz, CMOS, CPGA478, 1.27 MM PITCH, FLIP CHIP, MICRO PGA-478	Microprocessor, 32-Bit, 3200MHz, CMOS, CPGA478, 1.27 MM PITCH, FLIP CHIP, MICRO PGA-478	Microprocessor, 32-Bit, 3000MHz, CMOS, CPGA478, 1.27 MM PITCH, FLIP CHIP, MICRO PGA-478	Microprocessor, 32-Bit, 2800MHz, CMOS, CPGA478, 1.27 MM PITCH, FLIP CHIP, MICRO PGA-478	Microprocessor, 32-Bit, 2800MHz, CMOS, CPGA478, 1.27 MM PITCH, FLIP CHIP, MICRO PGA-478
Maker	Intel	Intel	Intel	Intel	Intel	Intel	Intel	Intel	Intel
Parts packaging code	PGA	PGA	PGA	PGA	PGA	PGA	PGA	PGA	PGA
package instruction	SPGA, BGA478,26X26,50	SPGA, BGA478,26X26,50	SPGA,	SPGA,	SPGA,	SPGA, BGA478,26X26,50	SPGA,	SPGA,	SPGA,
Contacts	478	478	478	478	478	478	478	478	478
Reach Compliance Code	unknown	unknown	compliant	unknown	compliant	compliant	compliant	compliant	compliant
ECCN code	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3
Address bus width	36	36	36	36	36	36	36	36	36
bit size	32	32	32	32	32	32	32	32	32
boundary scan	YES	YES	YES	YES	YES	YES	YES	YES	YES
maximum clock frequency	133 MHz	200 MHz	200 MHz	133 MHz	200 MHz	200 MHz	200 MHz	133 MHz	200 MHz
External data bus width	64	64	64	64	64	64	64	64	64
Format	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
Integrated cache	YES	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 code	S-CPGA-P478	S-CPGA-P478	S-CPGA-P478	S-CPGA-P478	S-CPGA-P478	S-CPGA-P478	S-CPGA-P478	S-CPGA-P478	S-CPGA-P478
length	35 mm	35 mm	35 mm	35 mm	35 mm	35 mm	35 mm	35 mm	35 mm
low power mode	YES	YES	YES	YES	YES	YES	YES	YES	YES
Number of terminals	478	478	478	478	478	478	478	478	478
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	SPGA	SPGA	SPGA	SPGA	SPGA	SPGA	SPGA	SPGA	SPGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, SHRINK PITCH	GRID ARRAY, SHRINK PITCH	GRID ARRAY, SHRINK PITCH	GRID ARRAY, SHRINK PITCH	GRID ARRAY, SHRINK PITCH	GRID ARRAY, SHRINK PITCH	GRID ARRAY, SHRINK PITCH	GRID ARRAY, SHRINK PITCH	GRID ARRAY, SHRINK PITCH
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.5 mm	4.5 mm	4.5 mm	4.5 mm	4.5 mm	4.5 mm	4.5 mm	4.5 mm	4.5 mm
speed	2800 MHz	2800 MHz	3200 MHz	2800 MHz	3200 MHz	3200 MHz	3000 MHz	2800 MHz	2800 MHz
Maximum supply voltage	1.4 V	1.4 V	1.4 V	1.4 V	1.4 V	1.4 V	1.4 V	1.4 V	1.4 V
Minimum supply voltage	1.25 V	1.25 V	1.25 V	1.25 V	1.25 V	1.25 V	1.25 V	1.25 V	1.25 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal form	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR
width	35 mm	35 mm	35 mm	35 mm	35 mm	35 mm	35 mm	35 mm	35 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR
Base Number Matches	1	1	1	1	1	1	1	1	1
Is it Rohs certified?	conform to	conform to	-	conform to	conform to	conform to	-	-	-

Recommended Resources

Class S amplifier circuit

Charger circuit diagram powered by switching power supply

Soft start circuit diagram using transistors

Interface between serial IO port AD converter and microcontroller

Energy consumption braking circuit of PWM frequency converter

One card multiple numbers card reader circuit schematic diagram

Please help me analyze the op amp circuit and whether my calculation method is correct.: [img]file:///C:\Documents and Settings\Administrator\Application Data\Tencent\Users\386130771\QQ\WinTemp\RichOle\WF`LQPZ0CY6JCU_8LUG]DUU.jpg[/img][img]file:// /C:\Documents and Settings\Administrator\...; wzh7616 51mcu

LCD power-on initialization problem: When using the LM6029A 128*64 LCD module, the reset signal of the LCD is provided by the reset circuit, and the controller is S6B0724A01. The LCD is always unsuccessful when it is powered on for the f...; dreamswang Embedded System

New and old engineers, come and take a look at this "hardcore" oscilloscope: I just read a blog post titled “The Evolution of Universal Oscilloscopes” ( https://home.eeworld.com.cn/my/space.php?uid=169593do=blogid=38945 ) and realized that I’m not the only old-fashioned person...; frankuly Test/Measurement

I just took a picture of the warm moon. I wish all my friends in the forum a happy Mid-Autumn Festival!: After a busy day, I suddenly looked up at night and saw the moon in the sky. I thought it was so beautiful. So I used my not-so-sophisticated photography skills to record it, hoping to bring my most s...; soso Talking

dsp-28035can communication problem help: [color=#000] I encountered some problems. When debugging the code, I used the chip's built-in CAN self-test mode function for debugging (stm = 1;). I completed the self-transmitting and self-receiving...; 黑旋风马内 DSP and ARM Processors

Helper2416-36——Linux driver——Keyboard driver with interrupt: [align=center][b][font=华文楷体][size=22.0pt]Linux[/size][/font][/b][b][font=华文楷体][size=22.0pt]Driver - Keyboard Driver with Interrupts[/size][/font][/b][/align][align=center][b][color=red][font=华文楷体][siz...; yuanlai2010 Embedded System

Analysis of the significance of using M430/OS on the MSP430 MCU

introduction 1 The significance of using RTOS on MSP430 It is understandable that it is meaningless to use RTOS on MSP430. Because the hardware resources of MSP430 are limited (for exampl...[Details]
Design and implementation of ARM-based embedded IPCamera

0 Introduction With the development of society, people pay more and more attention to security work. Monitoring products have been used in various fields instead of being used only in importan...[Details]
High-side current sensor AD8205 and its application circuit design

AD8205 is a single-supply high-performance differential amplifier launched by Analog Devices of the United States . The typical single-supply voltage is 5V, and its common-mode volta...[Details]
Program implementation of state machine idea in single chip microcomputer

The concept of state machine State machine is an important concept in software programming. More important than this concept is its flexible application. In a clear and efficient program, ther...[Details]
USB charging latest specifications (V1.1) and testing

Currently, each country is developing its own USB interface charging specifications , which leads to a major problem that a USB interface charging device manufactured in one country...[Details]
Battery maintenance precautions

a. Keep the battery clean, wipe off the spilled electrolyte, contaminated dirt and dust in time; keep the poles and terminal clamps clean and in good contact, and apply vaseline or butter to preven...[Details]
The core of computer power stability - capacitor

The power supply is the core component of a computer. Although it is not of high value, all computer components rely on the switching power adapter to provide energy, so the stability of a power su...[Details]
When choosing a computer power supply, don’t just focus on the rated power

Don’t just look at the power when choosing a power supply We know that a power supply with a low rated power can hardly meet the power supply needs of the system, which may cause frequent free...[Details]
Design of an automated test bench for heavy-duty vehicle engines

introduction The Steyr diesel engine produced by Weifang Diesel Engine Factory has huge power and is one of the main power models widely used in China's heavy machinery and large trucks. In ...[Details]
Fairchild FAN6208 LLC Power Supply Synchronous Rectification Control Solution

Fairchild's FAN6208 is a synchronous rectification (SR) controller for isolated LLC or LC resonant converters that can drive two individual SR MOSFETs emulating the behavior of rectifier diodes. FAN62...[Details]
Fourteen tips to help your phone battery last longer

If users want to extend the effective use time of the battery, in addition to ensuring the quality of the charger, correct charging techniques are also essential. Here are 14 tips for charging mobile ...[Details]
Rechargeable batteries that look real – supercapacitors

Previously used primarily in high-power power supplies and large industrial and consumer power supplies, supercapacitors are now finding their way into products of all sizes, especially portable de...[Details]
Introduction to the charging principle of rechargeable batteries

1 Introduction With the rapid development of my country's economy, the country has introduced a series of policies such as preferential policies, subsidy policies, and old-for-new policies, wh...[Details]
Electric vehicle charging related matters

First, the choice of charging location. Wireless charging technology is related to the distance and state of the charger and the charged device. That is to say, the distance between the two cannot...[Details]
EMC Confidential

1. Electromagnetic compatibility design Electromagnetic compatibility refers to the ability of electronic equipment to work in a coordinated and effective manner in various electromagnetic env...[Details]

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components