Microcontroller, 4-Bit, MROM, LC6500 CPU, 4.33MHz, CMOS, PQFP64
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | SANYO |
| package instruction | QFP, QFP64,.8SQ,32 |
| Reach Compliance Code | unknown |
| bit size | 4 |
| CPU series | LC6500 |
| JESD-30 code | S-PQFP-G64 |
| JESD-609 code | e0 |
| Number of terminals | 64 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -30 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QFP |
| Encapsulate equivalent code | QFP64,.8SQ,32 |
| Package shape | SQUARE |
| Package form | FLATPACK |
| power supply | 5 V |
| Certification status | Not Qualified |
| RAM (bytes) | 128 |
| rom(word) | 8192 |
| ROM programmability | MROM |
| speed | 4.33 MHz |
| Maximum slew rate | 10 mA |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 0.8 mm |
| Terminal location | QUAD |
| Base Number Matches | 1 |
| LC6554H(64QFP) | LC6554H(64DIP) | LC6554D(64QFP) | LC6554D(64DIP) | |
|---|---|---|---|---|
| Description | Microcontroller, 4-Bit, MROM, LC6500 CPU, 4.33MHz, CMOS, PQFP64 | Microcontroller, 4-Bit, MROM, LC6500 CPU, 4.33MHz, CMOS, PDIP64 | Microcontroller, 4-Bit, MROM, LC6500 CPU, 1.44MHz, CMOS, PQFP64 | Microcontroller, 4-Bit, MROM, LC6500 CPU, 1.44MHz, CMOS, PDIP64 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | SANYO | SANYO | SANYO | SANYO |
| package instruction | QFP, QFP64,.8SQ,32 | SDIP, SDIP64,.75 | QFP, QFP64,.8SQ,32 | SDIP, SDIP64,.75 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| bit size | 4 | 4 | 4 | 4 |
| CPU series | LC6500 | LC6500 | LC6500 | LC6500 |
| JESD-30 code | S-PQFP-G64 | R-PDIP-T64 | S-PQFP-G64 | R-PDIP-T64 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Number of terminals | 64 | 64 | 64 | 64 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| Minimum operating temperature | -30 °C | -30 °C | -30 °C | -30 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QFP | SDIP | QFP | SDIP |
| Encapsulate equivalent code | QFP64,.8SQ,32 | SDIP64,.75 | QFP64,.8SQ,32 | SDIP64,.75 |
| Package shape | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | FLATPACK | IN-LINE, SHRINK PITCH | FLATPACK | IN-LINE, SHRINK PITCH |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM (bytes) | 128 | 128 | 128 | 128 |
| rom(word) | 8192 | 8192 | 8192 | 8192 |
| ROM programmability | MROM | MROM | MROM | MROM |
| speed | 4.33 MHz | 4.33 MHz | 1.44 MHz | 1.44 MHz |
| Maximum slew rate | 10 mA | 10 mA | 10 mA | 10 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | OTHER | OTHER | OTHER | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| Terminal pitch | 0.8 mm | 1.78 mm | 0.8 mm | 1.78 mm |
| Terminal location | QUAD | DUAL | QUAD | DUAL |