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LC6554H(64QFP)

Description
Microcontroller, 4-Bit, MROM, LC6500 CPU, 4.33MHz, CMOS, PQFP64
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size647KB,26 Pages
ManufacturerSANYO
Websitehttp://www.semic.sanyo.co.jp/english/index-e.html
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LC6554H(64QFP) Overview

Microcontroller, 4-Bit, MROM, LC6500 CPU, 4.33MHz, CMOS, PQFP64

LC6554H(64QFP) Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSANYO
package instructionQFP, QFP64,.8SQ,32
Reach Compliance Codeunknown
bit size4
CPU seriesLC6500
JESD-30 codeS-PQFP-G64
JESD-609 codee0
Number of terminals64
Maximum operating temperature70 °C
Minimum operating temperature-30 °C
Package body materialPLASTIC/EPOXY
encapsulated codeQFP
Encapsulate equivalent codeQFP64,.8SQ,32
Package shapeSQUARE
Package formFLATPACK
power supply5 V
Certification statusNot Qualified
RAM (bytes)128
rom(word)8192
ROM programmabilityMROM
speed4.33 MHz
Maximum slew rate10 mA
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationQUAD
Base Number Matches1

LC6554H(64QFP) Related Products

LC6554H(64QFP) LC6554H(64DIP) LC6554D(64QFP) LC6554D(64DIP)
Description Microcontroller, 4-Bit, MROM, LC6500 CPU, 4.33MHz, CMOS, PQFP64 Microcontroller, 4-Bit, MROM, LC6500 CPU, 4.33MHz, CMOS, PDIP64 Microcontroller, 4-Bit, MROM, LC6500 CPU, 1.44MHz, CMOS, PQFP64 Microcontroller, 4-Bit, MROM, LC6500 CPU, 1.44MHz, CMOS, PDIP64
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker SANYO SANYO SANYO SANYO
package instruction QFP, QFP64,.8SQ,32 SDIP, SDIP64,.75 QFP, QFP64,.8SQ,32 SDIP, SDIP64,.75
Reach Compliance Code unknown unknown unknown unknown
bit size 4 4 4 4
CPU series LC6500 LC6500 LC6500 LC6500
JESD-30 code S-PQFP-G64 R-PDIP-T64 S-PQFP-G64 R-PDIP-T64
JESD-609 code e0 e0 e0 e0
Number of terminals 64 64 64 64
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
Minimum operating temperature -30 °C -30 °C -30 °C -30 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QFP SDIP QFP SDIP
Encapsulate equivalent code QFP64,.8SQ,32 SDIP64,.75 QFP64,.8SQ,32 SDIP64,.75
Package shape SQUARE RECTANGULAR SQUARE RECTANGULAR
Package form FLATPACK IN-LINE, SHRINK PITCH FLATPACK IN-LINE, SHRINK PITCH
power supply 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
RAM (bytes) 128 128 128 128
rom(word) 8192 8192 8192 8192
ROM programmability MROM MROM MROM MROM
speed 4.33 MHz 4.33 MHz 1.44 MHz 1.44 MHz
Maximum slew rate 10 mA 10 mA 10 mA 10 mA
Nominal supply voltage 5 V 5 V 5 V 5 V
surface mount YES NO YES NO
technology CMOS CMOS CMOS CMOS
Temperature level OTHER OTHER OTHER OTHER
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING THROUGH-HOLE GULL WING THROUGH-HOLE
Terminal pitch 0.8 mm 1.78 mm 0.8 mm 1.78 mm
Terminal location QUAD DUAL QUAD DUAL
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