®
EMIF06-VID01C1
6 LINES LOW CAPACITANCE EMI FILTER
AND ESD PROTECTION
IPAD™
MAIN APPLICATION
Where EMI filtering in ESD sensitive equipment is
required:
■
■
■
■
LCD and camera for mobile phones
Computers and printers
Communication systems
MCU board
®
DESCRIPTION
The EMIF06-VID01C1 is a 6 lines highly integrat-
ed array designed to suppress EMI / RFI noise in
all systems subjected to electromagnetic interfer-
ences.
The EMIF06-VID01C1 Flip-Chip packaging
means the package size is equal to the die size.
Additionally, this filter includes an ESD protection
circuitry which prevents the protected device from
destruction when subjected to ESD surges up to
15 kV.
BENEFITS
■
High efficiency EMI filtering (-40db @ 900MHz)
■
Low line capacitance suitable for high speed
data bus
■
Low serial resistance for camera impedance
adaptation
■
Optimized PCB space consuming:
2.92mm x 1.29mm
■
Very thin package: 0.69 mm
■
High efficiency in ESD suppression on inputs
pins (IEC61000-4-2 level 4)
■
High reliability offered by monolithic integration
■
High reducing of parasitic elements through
integration & wafer level packaging
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC61000-4-2
Level 4 on input pins 15kV (air discharge)
8kV (contact discharge)
MIL STD 883E
- Method 3015-6 Class 3
Coated Flip-Chip
(15 Bumps)
Table 1: Order Code
Part Number
EMIF06-VID01C1
Marking
GR
Figure 1: Pin Configuration (ball side)
9
8
7
6
5
4
3
2
1
I6
Gnd
O6
I5
I4
Gnd
O4
I3
I2
Gnd
O2
I1
A
B
O5
O3
O1
C
Figure 2: Configuration
R
Input
Output
R = 100
Ω
C
LINE
= 16pF typ. @ 3V
TM:
IPAD is a trademark of STMicroelectronics.
February 2005
REV. 1
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EMIF06-VID01C1
Table 2: Absolute Ratings
(limiting values)
Symbol
T
j
T
op
T
stg
Parameter and test conditions
Maximum junction temperature
Operating temperature range
Storage temperature range
Value
125
- 40 to + 85
- 55 to + 150
Unit
°C
°C
°C
Table 3: Electrical Characteristics
(T
amb
= 25°C)
Symbol
V
BR
I
RM
V
RM
R
Parameter
Breakdown voltage
Leakage current @ V
RM
V
BR
V
RM
I
R
I
RM
I
RM
I
R
V
RM
V
BR
I
V
Stand-off voltage
Series resistance between Input &
Output
Input capacitance per line
C
line
Symbol
V
BR
I
RM
R
C
line
I
R
= 1mA
Test conditions
Min.
6
Typ.
8
Max.
10
500
Unit
V
nA
Ω
pF
V
RM
= 3V per line
I = 10mA
V
R
= 3V DC 1MHz V
OSC
= 30mV
80
100
16
120
19
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EMIF06-VID01C1
Figure 3: S21 (dB) attenuation measurement
0
dB
Figure 4: Analog crosstalk measurement
0
-10
-20
-30
dB
-10
-20
-40
-30
-50
-60
-40
-70
-80
-50
-90
-60
100k
1M
10M
f/Hz
100M
1G
-100
100k
1M
10M
f/Hz
100M
1G
Figure 5: ESD response to IEC61000-4-2
(+15kV air discharge) on one input V(in) and on
one output (Vout)
Figure 6: ESD response to IEC61000-4-2 (-15kV
air discharge) on one input V(in) and on one
output (Vout)
Input
10V/d
Input
10V/d
Output
10V/d
Output
10V/d
200ns/d
200ns/d
Figure 7: Junction capacitance versus reverse
voltage applied (typical values)
C
LINE
(pF)
28
26
24
22
20
18
16
14
12
10
0.0
0.5
1.0
1.5
2.0
2.5
3.0
V
LINE
(V)
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EMIF06-VID01C1
Figure 8: Ordering Information Scheme
EMIF
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
C = Coated Flip-Chip
x = 1: 500µm, Bump = 315µm
= 2: Leadfree Pitch = 500µm, Bump = 315µm
yy
-
xxx zz
Cx
Figure 9: FLIP-CHIP Package Mechanical Data
315µm ± 50
500µm ± 50
250µm ± 50
435µm ± 50
690µm ± 65
50
1µ
m
±5
0
2.92mm ± 50µm
Figure 10: Foot Print Recommendations
Figure 11: Marking
1.29mm ± 50µm
Copper pad Diameter :
250µm recommended , 300µm max
Dot, ST logo
xx = marking
z = packaging location
yww = date code
(y = year
ww = week)
365
240
365
Solder stencil opening : 330µm
Solder mask opening recommendation :
340µm min for 300µm copper pad diameter
x x z
y w w
40
220
All dimensions in µm
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EMIF06-VID01C1
Figure 12: FLIP-CHIP Tape and Reel Specification
Dot identifying Pin A1 location
4 +/- 0.1
Ø 1.5 +/- 0.1
1.75 +/- 0.1
3.5 +/- 0.1
0.73 +/- 0.05
All dimensions in mm
Table 4: Ordering Information
Ordering code
EMIF06-VID01C1
Marking
GR
Package
Flip-Chip
Weight
5.9 mg
Base qty
5000
Delivery mode
Tape & reel 7”
Note:
More packing informations are available in the application note
AN1235: “Flip-Chip: Package description and recommendations for use”
AN1751: “EMI Filters: Recommendations and measurements”
Table 5: Revision History
Date
15-Feb-2005
Revision
1
First issue.
Description of Changes
8 +/- 0.3
ST
ST
ST
xxx
yww
User direction of unreeling
xxx
yww
xxx
yww
4 +/- 0.1
5/6
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