ispLSI 2128V
3.3V High Density Programmable Logic
Features
• HIGH DENSITY PROGRAMMABLE LOGIC
—
—
—
—
—
6000 PLD Gates
128 and 64 I/O Pin Versions, Eight Dedicated Inputs
128 Registers
High Speed Global Interconnect
Wide Input Gating for Fast Counters, State
Machines, Address Decoders, etc.
— Small Logic Block Size for Random Logic
Output Routing Pool (ORP)
D7
D6
D5
D4
Output Routing Pool (ORP)
D3
D2
D1
D0
C7
®
Functional Block Diagram*
Output Routing Pool (ORP)
A0
A1
C6
A2
D
Q
C5
• 3.3V LOW VOLTAGE 2128 ARCHITECTURE
— Interfaces with Standard 5V TTL Devices
— The 128 I/O Pin Version is Fuse Map Compatible
with 5V ispLSI 2128
• HIGH PERFORMANCE E CMOS TECHNOLOGY
—
—
—
—
—
—
2
®
A3
G
GLB
B6
B7
D
Q
C4
Output Routing Pool (ORP)
A4
C3
D
Q
A5
C2
A7
EW
f
max
= 80 MHz Maximum Operating Frequency
t
pd
= 10 ns Propagation Delay
Electrically Erasable and Reprogrammable
Non-Volatile
100% Tested at Time of Manufacture
Unused Product Term Shutdown Saves Power
A6
D
B0
B1
B2
B3
B4
Output Routing Pool (ORP)
D
Q
C1
Global Routing Pool (GRP)
B5
C0
Output Routing Pool (ORP)
*128 I/O Version Shown
N
CLK 0
CLK 1
CLK 2
0139A/2128V
• THE EASE OF USE AND FAST SYSTEM SPEED OF
PLDs WITH THE DENSITY AND FLEXIBILITY OF FPGAS
—
—
—
—
—
—
Enhanced Pin Locking Capability
Three Dedicated Clock Input Pins
Synchronous and Asynchronous Clocks
Programmable Output Slew Rate Control
Flexible Pin Placement
Optimized Global Routing Pool Provides Global
Interconnectivity
21
28
VE
— 3.3V In-System Programmability (ISP™) Using
Boundary Scan Test Access Port (TAP)
— Open-Drain Output Option for Flexible Bus Interface
Capability, Allowing Easy Implementation of
Wired-OR or Bus Arbitration Logic
— Increased Manufacturing Yields, Reduced Time-to-
Market and Improved Product Quality
— Reprogram Soldered Devices for Faster Prototyping
• ispDesignEXPERT™ – LOGIC COMPILER AND COM-
PLETE ISP DEVICE DESIGN SYSTEMS FROM HDL
SYNTHESIS THROUGH IN-SYSTEM PROGRAMMING
— Superior Quality of Results
— Tightly Integrated with Leading CAE Vendor Tools
— Productivity Enhancing Timing Analyzer, Explore
Tools, Timing Simulator and ispANALYZER™
— PC and UNIX Platforms
U
Copyright © 2000 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject
to change without notice.
SE
is
pL
SI
FO
The ispLSI 2128V is a High Density Programmable Logic
Device available in 128 and 64 I/O-pin versions. The
device contains 128 Registers, eight Dedicated Input
pins, three Dedicated Clock Input pins, two dedicated
Global OE input pins and a Global Routing Pool (GRP).
The GRP provides complete interconnectivity between
all of these elements. The ispLSI 2128V features in-
system programmability through the Boundary Scan
Test Access Port (TAP). The ispLSI 2128V offers non-
volatile reprogrammability of the logic, as well as the
interconnect to provide truly reconfigurable systems.
The basic unit of logic on the ispLSI 2128V device is the
Generic Logic Block (GLB). The GLBs are labeled A0, A1
.. D7 (see Figure 1). There are a total of 32 GLBs in the
ispLSI 2128V device. Each GLB is made up of four
macrocells. Each GLB has 18 inputs, a programmable
AND/OR/Exclusive OR array, and four outputs which can
be configured to be either combinatorial or registered.
Inputs to the GLB come from the GRP and dedicated
inputs. All of the GLB outputs are brought back into the
GRP so that they can be connected to the inputs of any
GLB on the device.
R
• IN-SYSTEM PROGRAMMABLE
Description
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A.
Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com
September 2000
2128v_14
1
Output Routing Pool (ORP)
Logic
Array
ES
I
Output Routing Pool (ORP)
N
S
Specifications
ispLSI 2128V
Functional Block Diagram
Figure 1. ispLSI 2128V Functional Block Diagram (128-I/O and 64-I/O Versions)
I/O 127
I/O 126
I/O 125
I/O 124
I/O 123
I/O 122
I/O 121
I/O 120
I/O 119
I/O 118
I/O 117
I/O 116
I/O 115
I/O 114
I/O 113
I/O 112
I/O 111
I/O 110
I/O 109
I/O 108
I/O 107
I/O 106
I/O 105
I/O 104
I/O 103
I/O 102
I/O 101
I/O 100
I/O 99
I/O 98
I/O 97
I/O 96
I/O 63
I/O 62
I/O 61
I/O 60
I/O 59
I/O 58
I/O 57
I/O 56
I/O 55
I/O 54
I/O 53
I/O 52
I/O 51
I/O 50
I/O 49
I/O 48
IN 7*
IN 6*
IN 7
IN 6
RESET
GOE 0
GOE 1
Input Bus
RESET
GOE 0
GOE 1
Megablock
Input Bus
Output Routing Pool (ORP)
Megablock
Generic Logic
Blocks (GLBs)
Output Routing Pool (ORP)
D4
D3
D2
D1
D0
IN 5
IN 4
C7
I/O 95
I/O 94
I/O 93
I/O 92
I/O 91
I/O 90
I/O 89
I/O 88
I/O 87
I/O 86
I/O 85
I/O 84
I/O 83
I/O 82
I/O 81
I/O 80
I/O 79
I/O 78
I/O 77
I/O 76
I/O 75
I/O 74
I/O 73
I/O 72
I/O 71
I/O 70
I/O 69
I/O 68
I/O 67
I/O 66
I/O 65
I/O 64
Output Routing Pool (ORP)
Generic Logic
Blocks (GLBs)
D7
D6
D5
D7
D6
D5
D4
D3
D2
D1
D0
IN 5*
IN 4*
S
C7
A0
A0
C6
A1
C5
ES
IG
B4
B5
B6
B7
I/O 4
I/O 5
I/O 6
I/O 7
I/O 8
I/O 9
I/O 10
I/O 11
I/O 12
I/O 13
I/O 14
I/O 15
I/O 16
I/O 17
I/O 18
I/O 19
I/O 20
I/O 21
I/O 22
I/O 23
I/O 24
I/O 25
I/O 26
I/O 27
I/O 28
I/O 29
I/O 30
I/O 31
TDI/IN 0
TMS/IN 1
Output Routing Pool (ORP)
N
C6
C5
I/O 0
I/O 1
I/O 2
I/O 3
Output Routing Pool (ORP)
I/O 0
I/O 1
I/O 2
I/O 3
I/O 47
I/O 46
I/O 45
I/O 44
A1
A2
A3
Output Routing Pool (ORP)
Input Bus
C3
Input Bus
Output Routing Pool (ORP)
Global
Routing
Pool
(GRP)
C4
Input Bus
A3
C3
Input Bus
I/O 4
I/O 5
I/O 6
I/O 7
A2
Global
Routing
Pool
(GRP)
C4
Output Routing Pool (ORP)
I/O 43
I/O 42
I/O 41
I/O 40
A4
A4
Output Routing Pool (ORP)
C2
C2
A5
C1
I/O 8
I/O 9
I/O 10
I/O 11
A5
D
I/O 39
I/O 38
I/O 37
I/O 36
C1
I/O 35
I/O 34
I/O 33
I/O 32
A6
C0
A6
I/O 12
I/O 13
I/O 14
I/O 15
TDI/IN 0
TMS/IN 1
EW
C0
A7
A7
B0
B1
B2
B3
B4
B5
B6
B7
B0
B1
B2
B3
CLK 0
CLK 1
CLK 2
Output Routing Pool (ORP)
Input Bus
ispEN
Output Routing Pool (ORP)
N
Output Routing Pool (ORP)
Input Bus
ispEN
I/O 16
I/O 17
I/O 18
I/O 19
I/O 20
I/O 21
I/O 22
I/O 23
I/O 24
I/O 25
I/O 26
I/O 27
TDO/IN 2
TCK/IN 3
I/O 32
I/O 33
I/O 34
I/O 35
I/O 36
I/O 37
I/O 38
I/O 39
I/O 40
I/O 41
I/O 42
I/O 43
I/O 44
I/O 45
I/O 46
I/O 47
I/O 48
I/O 49
I/O 50
I/O 51
I/O 52
I/O 53
I/O 54
I/O 55
I/O 56
I/O 57
I/O 58
I/O 59
I/O 60
I/O 61
I/O 62
I/O 63
TDO/IN 2
TCK/IN 3
I/O 28
I/O 29
I/O 30
I/O 31
Y0
Y1
Y2
R
0139B/2128V
Y0
Y1
Y2
CLK 0
CLK 1
CLK 2
0139B/2128V.64IO
*Not available on 84-PLCC Device
The GRP has as its inputs, the outputs from all of the
GLBs and all of the inputs from the bi-directional I/O cells.
All of these signals are made available to the inputs of the
GLBs. Delays through the GRP have been equalized to
minimize timing skew.
Clocks in the ispLSI 2128V device are selected using the
dedicated clock pins. Three dedicated clock pins (Y0, Y1,
U
SE
Eight GLBs, 32 or 16 I/O cells, two dedicated inputs and
two or one ORPs are connected together to make a
Megablock (see Figure 1). The outputs of the eight GLBs
are connected to a set of 32 or 16 universal I/O cells by
the two or one ORPs. Each ispLSI 2128V device contains
four Megablocks.
is
p
LS
I2
The 128-I/O 2128V contains 128 I/O cells, while the 64-
I/O version contains 64 I/O cells. Each I/O cell is directly
connected to an I/O pin and can be individually pro-
grammed to be a combinatorial input, output or
bi-directional I/O pin with 3-state control. The signal
levels are TTL compatible voltages and the output drivers
can source 4mA or sink 8mA. Each output can be
programmed independently for fast or slow output slew
rate to minimize overall output switching noise. Device
pins can be safely driven to 5V signal levels to support
mixed-voltage systems.
8V
E
12
FO
2
Y2) or an asynchronous clock can be selected on a GLB
basis. The asynchronous or Product Term clock can be
generated in any GLB for its own clock.
Programmable Open-Drain Outputs
In addition to the standard output configuration, the
outputs of the ispLSI 2128V are individually program-
mable, either as a standard totem-pole output or an
open-drain output. The totem-pole output drives the
specified Voh and Vol levels, whereas the open-drain
output drives only the specified Vol. The Voh level on the
open-drain output depends on the external loading and
pull-up. This output configuration is controlled by a pro-
grammable fuse. When this fuse is erased (JEDEC “1”),
the output is configured as a totem-pole output. When
this fuse is programmed (JEDEC “0”), the output is
configured as an open-drain. The default configuration
when the device is in bulk erased state is totem-pole
configuration. The open-drain/totem-pole option is se-
lectable through the ispDesignEXPERT software tools.
Specifications
ispLSI 2128V
Absolute Maximum Ratings
1
Supply Voltage V
cc
.................................. -0.5 to +5.6V
Input Voltage Applied ............................... -0.5 to +5.6V
Off-State Output Voltage Applied ............ -0.5 to +5.6V
1. Stresses above those listed under the “Absolute Maximum Ratings” may cause permanent damage to the device. Functional
operation of the device at these or at any other conditions above those indicated in the operational sections of this specification
is not implied (while programming, follow the programming specifications).
SYMBOL
PARAMETER
Supply Voltage
Input Low Voltage
Input High Voltage
Commercial
Industrial
EW
DC Recommended Operating Condition
D
MIN.
3.0
3.0
V
SS
– 0.5
2.0
MAX.
3.6
3.6
0.8
5.25
UNITS
V
V
V
V
Table 2-0005/2128V
T
A
= -40°C to + 85°C
8V
E
Capacitance (T
A
=25°C, f=1.0 MHz)
SYMBOL
FO
V
IL
V
IH
R
N
V
CC
T
A
= 0°C to + 70°C
PARAMETER
TYPICAL
10
10
15
UNITS
pf
pf
pf
I2
C
1
C
2
C
3
12
Dedicated Input Capacitance
I/O Capacitance
Clock and Global Output Enable Capacitance
Data Retention Specifications
is
p
PARAMETER
LS
MINIMUM
20
10000
MAXIMUM
–
–
Data Retention
SE
ispLSI Erase/Reprogram Cycles
U
3
ES
IG
Max. Junction Temp. (T
J
) with Power Applied ... 150°C
TEST CONDITIONS
V
CC
= 3.3V, V
IN
= 2.0V
V
CC
= 3.3V, V
I/O
= 2.0V
V
CC
= 3.3V, V
Y
= 2.0V
Table 2-0006/2128V
N
UNITS
Years
Cycles
Table 2-0008/2128V
Case Temp. with Power Applied .............. -55 to 125°C
S
Storage Temperature ................................ -65 to 150°C
Specifications
ispLSI 2128V
Switching Test Conditions
Input Pulse Levels
Input Rise and Fall Time
Input Timing Reference Levels
Output Timing Reference Levels
Output Load
GND to 3.0V
≤
3ns 10% to 90%
1.5V
1.5V
See Figure 2
Figure 2. Test Load
+ 3.3V
R1
Output Load Conditions (see Figure 2)
TEST CONDITION
A
B
Active High
Active Low
Active High to Z
at
V
OH
-0.5V
Active Low to Z
at
V
OL
+0.5V
R1
316Ω
∞
316Ω
∞
316Ω
R2
348Ω
348Ω
348Ω
348Ω
348Ω
CL
35pF
35pF
35pF
5pF
5pF
*
CL includes Test Fixture and Probe Capacitance.
0213A/2128V
C
Table 2-0004/2128V
DC Electrical Characteristics
SYMBOL
PARAMETER
Output Low Voltage
Output High Voltage
Over Recommended Operating Conditions
8V
E
FO
R
N
EW
D
CONDITION
MIN.
–
2.4
–
–
–
–
–
–
–
TYP.
–
–
–
–
–
–
–
–
195
3
12
V
OL
V
OH
I
IL
I
IH
I
IL-isp
I
IL-PU
I
OS
1
I
CC
2, 4
I
OL
= 8 mA
I
OH
= -4 mA
0V
≤
V
IN
≤
V
IL
(Max.)
ES
IG
R2
CL
*
N
MAX. UNITS
0.4
–
-10
10
50
-150
-150
-100
–
V
V
µA
µA
mA
µA
µA
mA
mA
3-state levels are measured 0.5V from steady-state
Table 2 - 0003/2000
active level.
Input or I/O Low Leakage Current
I2
Input or I/O High Leakage Current
(V
CC
– 0.2)V
≤
V
IN
≤
V
CC
V
≤
V
IN
≤
5.25V
CC
0V
≤
V
IN
≤
V
IL
0V
≤
V
IN
≤
V
IL
V
CC
= 3.3V, V
OUT
= 0.5V
V
IL
= 0.0V, V
IH
= 3.0V
f
CLOCK
= 1 MHz
I/O Active Pull-Up Current
Output Short Circuit Current
Operating Power Supply Current
Table 2-0007/2128V
1. One output at a time for a maximum duration of one second. V
OUT
= 0.5V was selected to avoid test
problems by tester ground degradation. Characterized but not 100% tested.
2. Measured using eight 16-bit counters.
3. Typical values are at V
CC
= 3.3V and T
A
= 25°C.
4. Maximum I
CC
varies widely with specific device configuration and operating frequency. Refer to the Power Consumption
section of this data sheet and Thermal Management section of the Lattice Semiconductor Data Book or CD-ROM to
estimate maximum I
CC
.
U
SE
is
p
LS
ispEN Input Low Leakage Current
4
S
Device
Output
Test
Point
Specifications
ispLSI 2128V
External Timing Parameters
Over Recommended Operating Conditions
PARAMETER
TEST
2
#
COND.
A
A
A
–
–
–
A
–
–
–
–
A
–
B
C
B
C
–
–
1
2
3
4
5
6
7
8
9
4
DESCRIPTION
1
-80
–
–
3
1
tsu2 + tco1
-60
–
–
61.7
51.3
71.4
9.0
–
0.0
–
0.0
–
8.0
–
–
–
–
7.0
7.0
15.0
20.0
–
–
–
–
–
–
–
16.0
–
18.0
18.0
12.0
12.0
–
–
MIN. MAX. MIN. MAX.
10.0
15.0
–
–
–
–
UNITS
ns
ns
MHz
MHz
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
18 External Synchronous Clock Pulse Duration, High
19 External Synchronous Clock Pulse Duration, Low
FO
t
pd1
t
pd2
f
max
f
max (Ext.)
f
max (Tog.)
t
su1
t
co1
t
h1
t
su2
t
co2
t
h2
t
r1
t
rw1
t
ptoeen
t
ptoedis
t
goeen
t
goedis
t
wh
t
wl
1.
2.
3.
4.
Data Propagation Delay, 4PT Bypass, ORP Bypass
Data Propagation Delay
Clock Frequency with Internal Feedback
Clock Frequency, Max. Toggle
GLB Reg. Setup Time before Clock, 4 PT Bypass
GLB Reg. Clock to Output Delay, ORP Bypass
GLB Reg. Hold Time after Clock, 4 PT Bypass
GLB Reg. Setup Time before Clock
Clock Frequency with External Feedback
(
80.0
7.0
–
0.0
9.0
–
D
EW
0.0
–
7.0
–
–
–
–
5.0
5.0
10 GLB Reg. Clock to Output Delay
11 GLB Reg. Hold Time after Clock
12 Ext. Reset Pin to Output Delay
13 Ext. Reset Pulse Duration
14 Input to Output Enable
15 Input to Output Disable
16 Global OE Output Enable
17 Global OE Output Disable
N
R
U
SE
is
p
LS
I2
12
8V
E
Unless noted otherwise, all parameters use the GRP, 20 PTXOR path, ORP and Y0 clock.
Refer to Timing Model in this data sheet for further details.
Standard 16-bit counter using GRP feedback.
Reference Switching Test Conditions section.
5
ES
IG
6.5
–
–
–
14.0
–
15.0
15.0
10.0
10.0
–
–
11.0
7.5
100
N
8.5
9.5
)
64.5
Table 2-0030/2128V
S