54F219LL datasheet, PDF - EEWORLD Datasheet

54F219LL: DescriptionStandard SRAM, 16X4, 32ns, TTL, CQCC20, CERAMIC, LCC-20; Categorystorage storage; File Size134KB，10 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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54F219LL Overview

Standard SRAM, 16X4, 32ns, TTL, CQCC20, CERAMIC, LCC-20

Parameter Name	Attribute value
package instruction	CERAMIC, LCC-20
Reach Compliance Code	unknown
Maximum access time	32 ns
JESD-30 code	S-CQCC-N20
length	8.89 mm
memory density	64 bit
Memory IC Type	STANDARD SRAM
memory width	4
Number of functions	1
Number of terminals	20
word count	16 words
character code	16
Operating mode	ASYNCHRONOUS
Maximum operating temperature	100 °C
Minimum operating temperature	-55 °C
organize	16X4
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Maximum seat height	1.905 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	TTL
Temperature level	OTHER
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
width	8.89 mm
Base Number Matches	1

	54F219LL	54F219FL	54F219DL
Description	Standard SRAM, 16X4, 32ns, TTL, CQCC20, CERAMIC, LCC-20	Standard SRAM, 16X4, 32ns, TTL, CDFP16, CERPACK-16	Standard SRAM, 16X4, 32ns, TTL, CDIP16, CERAMIC, DIP-16
package instruction	CERAMIC, LCC-20	DFP,	DIP,
Reach Compliance Code	unknown	unknown	unknown
Maximum access time	32 ns	32 ns	32 ns
JESD-30 code	S-CQCC-N20	R-GDFP-F16	R-GDIP-T16
length	8.89 mm	9.6645 mm	19.43 mm
memory density	64 bit	64 bit	64 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	4	4	4
Number of functions	1	1	1
Number of terminals	20	16	16
word count	16 words	16 words	16 words
character code	16	16	16
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	100 °C	100 °C	100 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C
organize	16X4	16X4	16X4
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	QCCN	DFP	DIP
Package shape	SQUARE	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	FLATPACK	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL
Maximum seat height	1.905 mm	2.032 mm	5.08 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V
surface mount	YES	YES	NO
technology	TTL	TTL	TTL
Temperature level	OTHER	OTHER	OTHER
Terminal form	NO LEAD	FLAT	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	2.54 mm
Terminal location	QUAD	DUAL	DUAL
width	8.89 mm	6.604 mm	7.62 mm
Base Number Matches	1	1	1

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