American Opto Plus LED
C/A542E G/W
0.54’’ Alphanumeric Dual Digit Display
0.54inch (13.80 mm) height
Low power consumption
RoHS Compliance
Case mold type
Package Dimensions
Notes: 1. Label Notes: A: Part Number B: Date
C: Bin Code
2. All dimensions are in millimeters (inches)
3. Tolerance is ± 0.25mm (0.01”) unless otherwise specified
Feb. 2005 Rev. 1.0
American Opto Plus LED
C/A542E G/W
0.54’’ Alphanumeric Dual Digit Display
0.54inch (13.80 mm) height
Low power consumption
RoHS Compliance
Case mold type
DEVICE SELECTION GUIDE
Part Number
C/A 542E G/W
Material
AlGaAs
Chip
Emitted Color
Orange-Red
Face / Segment
Gray / White
ABSOLUTE MAXIMUM RATINGS
Parameter
Power Dissipation per segment
Peak Current per segment
(1/10 Duty Cycle @1KHz )
Continuous Forward Current per segment
Reverse Voltage
Operating Temperature Range
Storage Temperature Range
(Ta=25°C)
Symbol
PAD
IAF
IPF
VR
TOPR
TSTG
Max Rating
75
100
30
5.0
-40~+85
-40~+85
Unit
mW
mA
mA
V
°C
°C
Solder temperature 1.6 mm from body for 3 seconds at 260°C
OPTICAL-ELECTRICAL CHARACTERISTICS
Parameter
Ave. Luminous Intensity
Forward Voltage/segment
Reverse Current/segment
Spectrum Line Half-Width
Dominant Wavelength
Peak Wavelength
Symbol Test Condition
IV
VF
IR
Δλ
λd
λp
IF = 10mA
IF = 10mA
VR = 5V
IF = 10mA
IF = 10mA
IF = 10mA
Min
1900
Typ
4700
1.85
Max
Unit
μcd
2.50
10
V
uA
nm
nm
nm
45
620
630
American Opto Plus LED
C/A542E G/W
0.54’’ Alphanumeric Dual Digit Display
0.54inch (13.80 mm) height
Low power consumption
RoHS Compliance
Case mold type
LAMP HANDLING AND APPLICATION PRECAUTIONS
STORAGE
1. It is recommended to store the products in the following conditions:
a. Humidity: 60% RH Max
Temperature: 5°C ~ 40°C (41°F ~ 105°F)
b. Shelf life in sealed bag: 3 month < 40°C and 90% RH
FORMING
1. Any forming on lead pin must be done before solding, not during or after soldering
2. Avoid applying any stress to resin in order to prevent the epoxy fracture and break on
bonding wire.
3. While forming, please use a tie bar cut or equivalent ot hold or bend the pin.
4. 2mm from the base of resin is the minimum distance for the place bending the lead pin
5. Avoid bending the lead pin at the same point twice or more
SOLDERING
1. No stress can be applied to lead pins when they are heated, otherwise disconnection may
occur.
2. When an LED is mounted into a P.C. board, pitch spacing should be aligned carefully to
avoid causing any stress to the lead wires.
3. Mounting direction (electrode direction) of SMD LED and Display should be
perpendicular to direction of PCB curve
4. After soldering, don’t bend the PCB
CLEANING
1. Avoid using any unspecified chemical solvent to clean LED. For example,
Trichoroethylene, Chlorosen, Acetone, and Diflon S3MC.
2. Any cleaning method can only be taken under normal temperature in one minute or less if
it is required
3. Special attention should be taken when using any chemicals for claning because some
chemicals may damage the surface of epoxy.
MCU
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