HD74LV139FP datasheet, PDF - EEWORLD Datasheet

HD74LV139FP: DescriptionDecoder/Driver, LV/LV-A/LVX/H Series, Inverted Output, CMOS, PDSO16, EIAJ, SOP-16; Categorylogic logic; File Size114KB，6 Pages; ManufacturerHitachi （Renesas ）; Websitehttp://www.renesas.com/eng/

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HD74LV139FP Overview

Decoder/Driver, LV/LV-A/LVX/H Series, Inverted Output, CMOS, PDSO16, EIAJ, SOP-16

Parameter Name	Attribute value
Maker	Hitachi （Renesas ）
Parts packaging code	SOIC
package instruction	SOP,
Contacts	16
Reach Compliance Code	unknown
ECCN code	EAR99
series	LV/LV-A/LVX/H
JESD-30 code	R-PDSO-G16
length	10.06 mm
Load capacitance (CL)	50 pF
Number of functions	2
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output polarity	INVERTED
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
propagation delay (tpd)	24.5 ns
Certification status	Not Qualified
Maximum seat height	2.2 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	2 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
width	5.5 mm
Base Number Matches	1

	HD74LV139FP	HD74LV139T	HD74LV139RP
Description	Decoder/Driver, LV/LV-A/LVX/H Series, Inverted Output, CMOS, PDSO16, EIAJ, SOP-16	Decoder/Driver, LV/LV-A/LVX/H Series, Inverted Output, CMOS, PDSO16, TSSOP-16	Decoder/Driver, LV/LV-A/LVX/H Series, Inverted Output, CMOS, PDSO16, SOP-16
Maker	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）
Parts packaging code	SOIC	TSSOP	SOIC
package instruction	SOP,	TSSOP,	SOP,
Contacts	16	16	16
Reach Compliance Code	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99
series	LV/LV-A/LVX/H	LV/LV-A/LVX/H	LV/LV-A/LVX/H
JESD-30 code	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16
Load capacitance (CL)	50 pF	50 pF	50 pF
Number of functions	2	2	2
Number of terminals	16	16	16
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
Output polarity	INVERTED	INVERTED	INVERTED
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	TSSOP	SOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE
propagation delay (tpd)	24.5 ns	24.5 ns	24.5 ns
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.2 mm	1.1 mm	1.75 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	2 V	2 V	2 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	GULL WING	GULL WING
Terminal pitch	1.27 mm	0.65 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL
width	5.5 mm	4.4 mm	3.9 mm
length	10.06 mm	5 mm	-

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

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