Arithmetic Logic Unit, F/FAST Series, 4-Bit, TTL, CDIP24, CERAMIC, DIP-24
| Parameter Name | Attribute value |
| Maker | Rochester Electronics |
| package instruction | DIP, |
| Reach Compliance Code | unknown |
| Other features | CAPABLE OF 16 LOGIC AND ARITHMETIC OPERATIONS |
| series | F/FAST |
| JESD-30 code | R-GDIP-T24 |
| Logic integrated circuit type | ARITHMETIC LOGIC UNIT |
| Number of digits | 4 |
| Number of functions | 1 |
| Number of terminals | 24 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| propagation delay (tpd) | 15 ns |
| Maximum seat height | 4.572 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 15.24 mm |
| Base Number Matches | 1 |
| 54F181DM | 54F181LM | 54F181SDM | |
|---|---|---|---|
| Description | Arithmetic Logic Unit, F/FAST Series, 4-Bit, TTL, CDIP24, CERAMIC, DIP-24 | Arithmetic Logic Unit, F/FAST Series, 4-Bit, TTL, CQCC28, CERAMIC, LCC-28 | Arithmetic Logic Unit, F/FAST Series, 4-Bit, TTL, CDIP24, 0.300 INCH, CERAMIC, DIP-24 |
| package instruction | DIP, | QCCN, | DIP, |
| Reach Compliance Code | unknown | unknow | unknown |
| Base Number Matches | 1 | 1 | 1 |
| Maker | Rochester Electronics | - | Rochester Electronics |
| series | F/FAST | F/FAST | - |
| JESD-30 code | R-GDIP-T24 | S-CQCC-N28 | - |
| Logic integrated circuit type | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | - |
| Number of digits | 4 | 4 | - |
| Number of functions | 1 | 1 | - |
| Number of terminals | 24 | 28 | - |
| Maximum operating temperature | 125 °C | 125 °C | - |
| Minimum operating temperature | -55 °C | -55 °C | - |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | - |
| encapsulated code | DIP | QCCN | - |
| Package shape | RECTANGULAR | SQUARE | - |
| Package form | IN-LINE | CHIP CARRIER | - |
| propagation delay (tpd) | 15 ns | 15 ns | - |
| Maximum seat height | 4.572 mm | 1.905 mm | - |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | - |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | - |
| Nominal supply voltage (Vsup) | 5 V | 5 V | - |
| surface mount | NO | YES | - |
| technology | TTL | TTL | - |
| Temperature level | MILITARY | MILITARY | - |
| Terminal form | THROUGH-HOLE | NO LEAD | - |
| Terminal pitch | 2.54 mm | 1.27 mm | - |
| Terminal location | DUAL | QUAD | - |
| width | 15.24 mm | 11.43 mm | - |
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