|
IS62LV25616ALL-85T |
IS62LV25616ALL-85MI |
IS62LV25616ALL-85TI |
IS62LV25616ALL-85M |
IS62LV25616ALL-85BI |
IS62LV25616ALL-70BI |
IS62LV25616ALL-70MI |
IS62LV25616ALL-70B |
IS62LV25616ALL-70M |
IS62LV25616ALL-70T |
| Description |
Standard SRAM, 256KX16, 85ns, CMOS, PDSO44, TSOP2-44 |
Standard SRAM, 256KX16, 85ns, CMOS, PBGA48, 7.20 X 8.70 MM, MINI, BGA-48 |
Standard SRAM, 256KX16, 85ns, CMOS, PDSO44, TSOP2-44 |
Standard SRAM, 256KX16, 85ns, CMOS, PBGA48, 7.20 X 8.70 MM, MINI, BGA-48 |
Standard SRAM, 256KX16, 85ns, CMOS, PBGA48, 8 X 10 MM, MINI, BGA-48 |
Standard SRAM, 256KX16, 70ns, CMOS, PBGA48, 8 X 10 MM, MINI, BGA-48 |
Standard SRAM, 256KX16, 70ns, CMOS, PBGA48, 7.20 X 8.70 MM, MINI, BGA-48 |
Standard SRAM, 256KX16, 70ns, CMOS, PBGA48, 8 X 10 MM, MINI, BGA-48 |
Standard SRAM, 256KX16, 70ns, CMOS, PBGA48, 7.20 X 8.70 MM, MINI, BGA-48 |
Standard SRAM, 256KX16, 70ns, CMOS, PDSO44, TSOP2-44 |
| Is it lead-free? |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
| Parts packaging code |
TSOP2 |
BGA |
TSOP2 |
BGA |
BGA |
BGA |
BGA |
BGA |
BGA |
TSOP2 |
| package instruction |
TSOP2-44 |
7.20 X 8.70 MM, MINI, BGA-48 |
TSOP2-44 |
7.20 X 8.70 MM, MINI, BGA-48 |
8 X 10 MM, MINI, BGA-48 |
8 X 10 MM, MINI, BGA-48 |
7.20 X 8.70 MM, MINI, BGA-48 |
8 X 10 MM, MINI, BGA-48 |
7.20 X 8.70 MM, MINI, BGA-48 |
TSOP2-44 |
| Contacts |
44 |
48 |
44 |
48 |
48 |
48 |
48 |
48 |
48 |
44 |
| Reach Compliance Code |
compliant |
compli |
compliant |
compliant |
compliant |
compliant |
compliant |
compliant |
compli |
compli |
| ECCN code |
3A991.B.2.A |
3A991.B.2.A |
3A991.B.2.A |
3A991.B.2.A |
3A991.B.2.A |
3A991.B.2.A |
3A991.B.2.A |
3A991.B.2.A |
3A991.B.2.A |
3A991.B.2.A |
| Maximum access time |
85 ns |
85 ns |
85 ns |
85 ns |
85 ns |
70 ns |
70 ns |
70 ns |
70 ns |
70 ns |
| I/O type |
COMMON |
COMMON |
COMMON |
COMMON |
COMMON |
COMMON |
COMMON |
COMMON |
COMMON |
COMMON |
| JESD-30 code |
R-PDSO-G44 |
R-PBGA-B48 |
R-PDSO-G44 |
R-PBGA-B48 |
R-PBGA-B48 |
R-PBGA-B48 |
R-PBGA-B48 |
R-PBGA-B48 |
R-PBGA-B48 |
R-PDSO-G44 |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
| length |
18.41 mm |
8.7 mm |
18.41 mm |
8.7 mm |
10 mm |
10 mm |
8.7 mm |
10 mm |
8.7 mm |
18.41 mm |
| memory density |
4194304 bit |
4194304 bi |
4194304 bit |
4194304 bit |
4194304 bit |
4194304 bit |
4194304 bit |
4194304 bit |
4194304 bi |
4194304 bi |
| Memory IC Type |
STANDARD SRAM |
STANDARD SRAM |
STANDARD SRAM |
STANDARD SRAM |
STANDARD SRAM |
STANDARD SRAM |
STANDARD SRAM |
STANDARD SRAM |
STANDARD SRAM |
STANDARD SRAM |
| memory width |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
| Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
| Number of terminals |
44 |
48 |
44 |
48 |
48 |
48 |
48 |
48 |
48 |
44 |
| word count |
262144 words |
262144 words |
262144 words |
262144 words |
262144 words |
262144 words |
262144 words |
262144 words |
262144 words |
262144 words |
| character code |
256000 |
256000 |
256000 |
256000 |
256000 |
256000 |
256000 |
256000 |
256000 |
256000 |
| Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
| Maximum operating temperature |
70 °C |
85 °C |
85 °C |
70 °C |
85 °C |
85 °C |
85 °C |
70 °C |
70 °C |
70 °C |
| organize |
256KX16 |
256KX16 |
256KX16 |
256KX16 |
256KX16 |
256KX16 |
256KX16 |
256KX16 |
256KX16 |
256KX16 |
| Output characteristics |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
TSOP2 |
LFBGA |
TSOP2 |
LFBGA |
LFBGA |
LFBGA |
LFBGA |
LFBGA |
LFBGA |
TSOP2 |
| Encapsulate equivalent code |
TSOP44,.46,32 |
BGA48,6X8,32 |
TSOP44,.46,32 |
BGA48,6X8,32 |
BGA48,6X8,30 |
BGA48,6X8,30 |
BGA48,6X8,32 |
BGA48,6X8,30 |
BGA48,6X8,32 |
TSOP44,.46,32 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
SMALL OUTLINE, THIN PROFILE |
GRID ARRAY, LOW PROFILE, FINE PITCH |
SMALL OUTLINE, THIN PROFILE |
GRID ARRAY, LOW PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE, FINE PITCH |
SMALL OUTLINE, THIN PROFILE |
| Parallel/Serial |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
| Peak Reflow Temperature (Celsius) |
240 |
NOT SPECIFIED |
240 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
240 |
| power supply |
3/3.3 V |
3/3.3 V |
3/3.3 V |
3/3.3 V |
3/3.3 V |
3/3.3 V |
3/3.3 V |
3/3.3 V |
3/3.3 V |
3/3.3 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
1.2 mm |
1.3 mm |
1.2 mm |
1.3 mm |
1.35 mm |
1.35 mm |
1.3 mm |
1.35 mm |
1.3 mm |
1.2 mm |
| Maximum standby current |
0.00001 A |
0.00001 A |
0.00001 A |
0.00001 A |
0.00001 A |
0.00001 A |
0.00001 A |
0.00001 A |
0.00001 A |
0.00001 A |
| Minimum standby current |
1.5 V |
1.5 V |
1.5 V |
1.5 V |
1.5 V |
1.5 V |
1.5 V |
1.5 V |
1.5 V |
1.5 V |
| Maximum slew rate |
0.04 mA |
0.045 mA |
0.045 mA |
0.04 mA |
0.045 mA |
0.05 mA |
0.05 mA |
0.045 mA |
0.045 mA |
0.045 mA |
| Maximum supply voltage (Vsup) |
3.45 V |
3.45 V |
3.45 V |
3.45 V |
3.45 V |
3.45 V |
3.45 V |
3.45 V |
3.45 V |
3.45 V |
| Minimum supply voltage (Vsup) |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
| Nominal supply voltage (Vsup) |
3 V |
3 V |
3 V |
3 V |
3 V |
3 V |
3 V |
3 V |
3 V |
3 V |
| surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
COMMERCIAL |
INDUSTRIAL |
INDUSTRIAL |
COMMERCIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
GULL WING |
BALL |
GULL WING |
BALL |
BALL |
BALL |
BALL |
BALL |
BALL |
GULL WING |
| Terminal pitch |
0.8 mm |
0.75 mm |
0.8 mm |
0.75 mm |
0.75 mm |
0.75 mm |
0.75 mm |
0.75 mm |
0.75 mm |
0.8 mm |
| Terminal location |
DUAL |
BOTTOM |
DUAL |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
DUAL |
| Maximum time at peak reflow temperature |
30 |
NOT SPECIFIED |
30 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
30 |
| width |
10.16 mm |
7.2 mm |
10.16 mm |
7.2 mm |
8 mm |
8 mm |
7.2 mm |
8 mm |
7.2 mm |
10.16 mm |
| Maker |
Integrated Silicon Solution ( ISSI ) |
Integrated Silicon Solution ( ISSI ) |
Integrated Silicon Solution ( ISSI ) |
Integrated Silicon Solution ( ISSI ) |
Integrated Silicon Solution ( ISSI ) |
- |
Integrated Silicon Solution ( ISSI ) |
Integrated Silicon Solution ( ISSI ) |
Integrated Silicon Solution ( ISSI ) |
Integrated Silicon Solution ( ISSI ) |
| Base Number Matches |
1 |
1 |
1 |
1 |
1 |
1 |
- |
- |
- |
- |
| Humidity sensitivity level |
- |
3 |
- |
3 |
3 |
3 |
3 |
3 |
3 |
- |