14 Pin DIL Uncooled Laser
Modules
Technical Data
LSC3X00
Features
• Low Cost Plastic Package
(14 Pin DIL)
• LSC3300: 100
µ
W (-10 dBm)
Min. Power Output
LSC3100: 1 mW (0 dBm)
Min. Power Output
• 1280 - 1330 nm Wavelength
• Hermetic Laser Module
• -40
°
C to +85
°
C Operation
Description
LSC3X00 laser modules are high
reliability fiber optic light sources
operating in the 1300 nanometer
band. They are particularly well
suited for applications where low
power dissipation is required.
The internal semiconductor lasers
are based upon InGaAsP buried
heterostructure (BH) technology
and fabricated by the Metal-
Organic Vapor Phase Epitaxy
(MOVPE) process, resulting in
long lifetimes and modest
threshold currents.
The LSC3X00 package includes a
photodiode for monitoring the
laser output. A longhorn type
heatsink mounting flange is
incorporated in the industry
standard 14 pin DIL package.
Two basic varieties are offered
for alternative power ranges. The
“low power” LSC3300 covers the
power range between 100
µW
Applications
• Telecommunications
• Local Area and Metropolitan
Area Networks
• Point to Point
Datacommunications
• Fiber Optic Sensors
• Cable Television
• Military Communications
and Control Systems
• Instrumentation
and 625
µW.
The “high power”
LSC3100 uses the same laser
chip, but with tighter fiber
coupling to achieve output
powers from 1 mW to 2.5 mW.
The low cost outer package is
made feasible by our unique
design of hermetic miniature
laser submodule which houses
the electro-optic devices. The
submodule concept is used as a
building block in many other
Hewlett-Packard products
including cooled 1 mW 14 pin
lasers and DFB modules.
Laser Safety Warning
This device is a Class IIIb (3b) Laser Product. It may emit invisible laser radiation if operated with the fiber pigtail disconnected. To avoid
possible eye damage do not look into an unconnected fiber pigtail during laser operation. Do not exceed specified operating limits.
480
5963-1125E (7/94)
Absolute Maximum Ratings
Absolute maximum limits mean that no catastrophic damage will occur if the product is subjected to these ratings for short periods, provided
each limiting parameter is in isolation and all other parameters have values within the performance specification. It should not be assumed that
limiting values of more than one parameter can be applied to the product at the same time.
Parameter
Laser Forward Current
Laser Reverse Current
Laser Reverse Voltage
Photodiode Reverse Voltage
Photodiode Forward Current
Operating Temperature
Storage Temperature
Relative Humidity
Fiber Pull Strength
Mechanical Shock
Vibration
Symbol
If
Ir
Vlr
Vr
Ipf
Tc
Ts
RH
Conditions
DC
DC
DC
DC
DC
Pf min.
Limits
Min.
Max.
-
150
-
100
-
2
-
10
-
1
-40
+85
-40
+85
0.0
non-
condensing
-
10
Units
mA
µA
V
V
mA
°C
°C
%RH
N
Mil Std 883D, Method 2002,
Condition B
Mil Std 883D, Method 2007,
Condition A
Performance Specifications
Parameter
LASER
Threshold Current
Peak Optical
Output Power
Optical Output
Power
Slope Efficiency
Forward Voltage
Differential
Resistance
Centre Wavelength
Ic Change with
Temperature
Linewidth
Rise Time
Fall Time
Small Signal
Freq. Response
Symbol
Conditions
CW, Tc = 25°C, Pf = Pf min.
unless otherwise stated
LSC3300
Min. Max.
LSC3100
Min. Max.
Units
Ith
Pf
Pth
η
Vf
Rd
λc
∆λ/∆T
∆λ
τr
τf
Bw
Pth = Pf @ Ith -2 mA
5
100
-
4
-
-
1280
-
-
-
-
1.0
35
-
10
16
1.8
10
1330
0.5
5
0.5
0.5
-
5
1000
-
40
-
-
1280
-
-
-
-
1.0
35
-
50
100
1.8
10
1330
0.5
5
0.5
0.5
-
mA
µW
µW
µW/mA
V
Ω
nm
nm/°C
nm
ns
ns
GHz
dV/dI
Note 1
Tc = -40°C to 85°C
FWHM (2.35s)
10% to 90%: Ith to Pf = Pf min.
90% to 10%: Pf = Pf min. to Ith
Pf = Pf min.,
±
3 dB
Note:
1. Modulated measurement available.
If the specific performance you require is not met by the above parameters, please contact Hewlett-Packard as the submodule
designs allows customization of performance to meet your needs.
484
RF/Wirelessly
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