UVPROM, 512KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32
| Parameter Name | Attribute value |
| Maker | AMD |
| Parts packaging code | DIP |
| package instruction | WDIP, DIP32,.6 |
| Contacts | 32 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 200 ns |
| I/O type | COMMON |
| JESD-30 code | R-GDIP-T32 |
| JESD-609 code | e0 |
| length | 42.1005 mm |
| memory density | 4194304 bit |
| Memory IC Type | UVPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 524288 words |
| character code | 512000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 512KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | WDIP |
| Encapsulate equivalent code | DIP32,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE, WINDOW |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 |
| Maximum seat height | 5.588 mm |
| Maximum standby current | 0.0001 A |
| Maximum slew rate | 0.06 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | TIN LEAD |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 15.24 mm |
| Base Number Matches | 1 |
| 5962-9175202MXA | 5962-9175204MXA | 5962-9175204MYA | 5962-9175202MYA | 5962-9175201MXA | 5962-9175201MYA | |
|---|---|---|---|---|---|---|
| Description | UVPROM, 512KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | UVPROM, 512KX8, 150ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | UVPROM, 512KX8, 150ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | UVPROM, 512KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | UVPROM, 512KX8, 250ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | UVPROM, 512KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 |
| Parts packaging code | DIP | DIP | QFJ | QFJ | DIP | QFJ |
| package instruction | WDIP, DIP32,.6 | WDIP, DIP32,.6 | WQCCN, LCC32,.45X.55 | WQCCN, LCC32,.45X.55 | WDIP, DIP32,.6 | WQCCN, LCC32,.45X.55 |
| Contacts | 32 | 32 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 200 ns | 150 ns | 150 ns | 200 ns | 250 ns | 250 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-GDIP-T32 | R-GDIP-T32 | R-CQCC-N32 | R-CQCC-N32 | R-GDIP-T32 | R-CQCC-N32 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 42.1005 mm | 42.1005 mm | 13.97 mm | 13.97 mm | 42.1005 mm | 13.97 mm |
| memory density | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| Memory IC Type | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 32 | 32 | 32 | 32 | 32 | 32 |
| word count | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
| character code | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| organize | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | WDIP | WDIP | WQCCN | WQCCN | WDIP | WQCCN |
| Encapsulate equivalent code | DIP32,.6 | DIP32,.6 | LCC32,.45X.55 | LCC32,.45X.55 | DIP32,.6 | LCC32,.45X.55 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE, WINDOW | IN-LINE, WINDOW | CHIP CARRIER, WINDOW | CHIP CARRIER, WINDOW | IN-LINE, WINDOW | CHIP CARRIER, WINDOW |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Filter level | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
| Maximum seat height | 5.588 mm | 5.588 mm | 3.556 mm | 3.556 mm | 5.588 mm | 3.556 mm |
| Maximum standby current | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| Maximum slew rate | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | YES | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | TIN LEAD | Tin/Lead (Sn/Pb) - hot dipped | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE | NO LEAD |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | QUAD | QUAD | DUAL | QUAD |
| width | 15.24 mm | 15.24 mm | 11.43 mm | 11.43 mm | 15.24 mm | 11.43 mm |
| Maker | AMD | - | AMD | AMD | AMD | AMD |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |
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