Microcontroller, 8-Bit, UVPROM, 8051 CPU, 12MHz, CMOS, CDIP40, CERAMIC, DIP-40
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| Parts packaging code | DIP |
| package instruction | DIP, DIP40,.6 |
| Contacts | 40 |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.2.C |
| Has ADC | NO |
| Address bus width | 16 |
| bit size | 8 |
| CPU series | 8051 |
| maximum clock frequency | 12 MHz |
| DAC channel | NO |
| DMA channel | NO |
| External data bus width | 8 |
| JESD-30 code | R-GDIP-T40 |
| JESD-609 code | e0 |
| length | 52.3875 mm |
| Number of I/O lines | 32 |
| Number of terminals | 40 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| PWM channel | NO |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP40,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| RAM (bytes) | 128 |
| rom(word) | 8192 |
| ROM programmability | UVPROM |
| Filter level | 38535Q/M;38534H;883B |
| Maximum seat height | 5.588 mm |
| speed | 12 MHz |
| Maximum slew rate | 275 mA |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
| Base Number Matches | 1 |
| 8753H/BQA | 8751H-8/BQA | 8751H-8/BUA | 8753H-8/BUA | 8751H/BQA | 8753H-8/BQA | 8751H/BUA | 8753H/BUA | |
|---|---|---|---|---|---|---|---|---|
| Description | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 12MHz, CMOS, CDIP40, CERAMIC, DIP-40 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 8MHz, CMOS, CDIP40, CERAMIC, DIP-40 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 8MHz, CMOS, CQCC44, CERAMIC, LCC-44 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 8MHz, CMOS, CQCC44, CERAMIC, LCC-44 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 12MHz, CMOS, CDIP40, CERAMIC, DIP-40 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 8MHz, CMOS, CDIP40, CERAMIC, DIP-40 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 12MHz, CMOS, CQCC44, CERAMIC, LCC-44 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 12MHz, CMOS, CQCC44, CERAMIC, LCC-44 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | DIP | DIP | LCC | LCC | DIP | DIP | LCC | LCC |
| package instruction | DIP, DIP40,.6 | DIP, DIP40,.6 | QCCN, LCC44,.65SQ | CERAMIC, LCC-44 | DIP, DIP40,.6 | DIP, DIP40,.6 | QCCN, LCC44,.65SQ | CERAMIC, LCC-44 |
| Contacts | 40 | 40 | 44 | 44 | 40 | 40 | 44 | 44 |
| Reach Compliance Code | unknown | unknow | unknow | unknown | unknown | unknown | unknown | unknown |
| ECCN code | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| Has ADC | NO | NO | NO | NO | NO | NO | NO | NO |
| Address bus width | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| bit size | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| CPU series | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 |
| maximum clock frequency | 12 MHz | 8 MHz | 8 MHz | 8 MHz | 12 MHz | 8 MHz | 12 MHz | 12 MHz |
| DAC channel | NO | NO | NO | NO | NO | NO | NO | NO |
| DMA channel | NO | NO | NO | NO | NO | NO | NO | NO |
| External data bus width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 code | R-GDIP-T40 | R-GDIP-T40 | S-CQCC-N44 | S-CQCC-N44 | R-GDIP-T40 | R-GDIP-T40 | S-CQCC-N44 | S-CQCC-N44 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 52.3875 mm | 52.3875 mm | 16.51 mm | 16.51 mm | 52.3875 mm | 52.3875 mm | 16.51 mm | 16.51 mm |
| Number of I/O lines | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Number of terminals | 40 | 40 | 44 | 44 | 40 | 40 | 44 | 44 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| PWM channel | NO | NO | NO | NO | NO | NO | NO | NO |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP | DIP | QCCN | QCCN | DIP | DIP | QCCN | QCCN |
| Encapsulate equivalent code | DIP40,.6 | DIP40,.6 | LCC44,.65SQ | LCC44,.65SQ | DIP40,.6 | DIP40,.6 | LCC44,.65SQ | LCC44,.65SQ |
| Package shape | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
| Package form | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM (bytes) | 128 | 128 | 128 | 128 | 128 | 128 | 128 | 128 |
| rom(word) | 8192 | 4096 | 4096 | 8192 | 4096 | 8192 | 4096 | 8192 |
| ROM programmability | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM |
| Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| Maximum seat height | 5.588 mm | 5.588 mm | 3.556 mm | 3.556 mm | 5.588 mm | 5.588 mm | 3.556 mm | 3.556 mm |
| speed | 12 MHz | 8 MHz | 8 MHz | 8 MHz | 12 MHz | 8 MHz | 12 MHz | 12 MHz |
| Maximum slew rate | 275 mA | 275 mA | 275 mA | 275 mA | 275 mA | 275 mA | 275 mA | 275 mA |
| Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | YES | NO | NO | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | QUAD | QUAD | DUAL | DUAL | QUAD | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 15.24 mm | 15.24 mm | 16.51 mm | 16.51 mm | 15.24 mm | 15.24 mm | 16.51 mm | 16.51 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Maker | AMD | - | - | AMD | AMD | AMD | AMD | AMD |