324-1G7 datasheet, PDF - EEWORLD Datasheet

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324-1G7: DescriptionIC Socket, DIP24, 24 Contact(s), 2.54mm Term Pitch, 0.6inch Row Spacing, Solder; CategoryThe connector socket; File Size51KB，2 Pages; ManufacturerThomas & Betts Corporation; Websitehttp://www.tnb.com/

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324-1G7 Overview

IC Socket, DIP24, 24 Contact(s), 2.54mm Term Pitch, 0.6inch Row Spacing, Solder

324-1G7 Parametric

Parameter Name	Attribute value
Maker	Thomas & Betts Corporation
Reach Compliance Code	unknown
ECCN code	EAR99
Other features	WITH STANDOFFS
body width	0.7 inch
subject depth	0.21 inch
body length	1.2 inch
Contact to complete cooperation	SN-PB
Contact completed and terminated	TIN OVER NICKEL
Contact material	P-CUSN
Contact style	SQ PIN-SKT
current rating	2 A
Device slot type	IC SOCKET
Type of equipment used	DIP24
Dielectric withstand voltage	1000VAC V
Shell material	POLYESTER
Insulation resistance	5000000000 Ω
Manufacturer's serial number	300C
Plug contact pitch	0.1 inch
Installation method	STRAIGHT
Number of contacts	24
Maximum operating temperature	105 °C
Minimum operating temperature	-55 °C
PCB contact pattern	RECTANGULAR
PCB contact row spacing	0.6 mm
Terminal pitch	2.54 mm
Termination type	SOLDER
Base Number Matches	1

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300C Series

Stamped Dual Wipe Contact DIP Sockets

328-AG19DC

FEATURES:

The Augat 300C Series dual wipe contact adds a new family of

product to Augat's low cost DIP socket line.

• Closed bottom prevents solder wicking

• Standoff's facilitate board cleaning

• Low profile design

•

Recognized under the Component Program of Underwriters

Laboratories, Inc. File No. E111362

PERFORMANCE SPECIFICATIONS:

MECHANICAL

Vibration ........................ Passed MIL-STD-1344, Method 2005.1,

Condition III, 15 G’s

Shock .............................. Passed MIL-STD-1344, Method 2004.1,

Condition G, 100 G’s

Durability ...................... Passed MIL-STD-1344, Method 2016

Normal Force ................ 170 Grams (6.0 oz.) with .009" x .015"

(0,23 x 0,38) IC lead typ.

Contact Retention .......... 340 Grams (12.0 oz.) minimum

Solderability .................. Passed MIL-STD-202, Method 208

Insertion Force .............. 169 Grams (6.0 oz.) average with a .013"x .020"

(0,33 x 0,51) dia. polished steel pin

Withdrawal Force .......... 43 Grams (1.5 oz.) average with a .009" x .015"

(0,23 x 0,38) dia. polished steel pin

ELECTRICAL

Contact Resistance ........ 10 Milliohms

Contact Rating .............. 2 Amps

Capacitance .................... .5 pF per MIL-STD-202, Method 305

(Adjacent contacts max.)

Insulation Resistance .... 5,000 Megohms @ 500 VDC per MIL-STD-1344,

Method 3003.1

Dielectric Withstanding

Voltage ...................... 1,000 Volts RMS per MIL-STD-1344,

Method 3001

ENVIRONMENTAL

Humidity ........................ Passed MIL-STD-1344, Method 1002.2

Thermal Shock .............. Passed MIL-STD-1344, Method 1003.1

Temperature Cycling .... Passed MIL-STD-1344, Method 1003.1

Operation Temperature .. Gold -55°C to +125°C

Tin -55°C to +105°C

Salt Spray ...................... Passed MIL-STD-1344, Method 1001.1

APPLICATION DIMENSIONS:

• PCB Thickness Range: Standard .062" and .092" (1,57 and 2,34))

• PCB Hole Size Range: .035"

.003" (0,89

0,08) standard tail

• IC Pin Dimension Range: .008" x .015" ( 0,20 x 0,38) through

.013" x .020" (0,33 x 0,51), .100" (2,54) min. length

MATERIAL SPECIFICATIONS:

Insulator ........................ Thermoplastic polyester, UL rated 94V-0

Contacts .......................... Phosphor bronze

Plating ............................ Tin/lead

Quality & Innovation From The

Product Group

Thomas & Betts

1555 Lynnfield Road

Memphis, TN 38119

(901) 682-8221 FAX (901) 537-8805

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