This product complies with the RoHS Directive (EU 2002/95/EC).
Light Emitting Diodes
LNJ816C8DRA
Surface Mounting Chip LED
Microlens Type
Absolute Maximum Ratings
T
a
= 25°C
Parameter
Power dissipation
Forward current
Pulse forward current
*
Reverse voltage
Operating ambient temperature
Storage temperature
Symbol
P
D
I
F
I
FP
V
R
T
opr
T
stg
Rating
60
20
100
3
–30 to +85
–40 to +100
Unit
mW
mA
mA
V
°C
°C
Lighting Color
Orange
Note) *: The condition of I
FP
is duty 10%, Pulse width 1 msec.
Electro-Optical Characteristics
T
a
= 25°C±3°C
Parameter
Luminous intensity
*
Reverse current
Forward voltage
Peak emission wavelength
Spectral half band width
Note) *: Measurement tolerance:
±20%
100
Symbol
I
O
I
R
V
F
λ
P
Δλ
I
F
= 10 mA
V
R
= 3 V
I
F
= 10 mA
I
F
= 10 mA
I
F
= 10 mA
Conditions
Min
1.1
Typ
2.1
Max
10
Unit
mcd
µA
V
nm
nm
1.93
630
40
2.60
I
O
I
F
100
50
30
I
F
V
F
1 000
Relative luminous intensity
T
a
Relative luminous intensity (%)
1.6
1.8
2.0
2.2
2.4
Luminous intensity I
O
(mcd)
Forward current I
F
(mA)
50
30
10
5
3
1
0.5
0.3
0.1
500
300
10
5
3
100
50
30
1
3
5
10
30
50
100
1
10
−20
0
20
40
60
80
100
Forward current I
F
(mA)
Forward voltage V
F
(V)
30
Ambient temperature T
a
(°C)
Relative luminous intensity
λ
P
Relative luminous intensity (%)
100
80
60
50°
40
60°
70°
80°
550
600
650
700
90°
100
80
60
40
20
I
F
T
a
30°
40°
20° 10°
0°
80°
60°
40°
20°
0
Forward current I
F
(mA)
Directive characteristics
10° 20°
30°
40°
50°
60°
70°
20
10
20
0
80°
20
40
60
80
90°
100
0
0
20
40
60
80
100
Peak emission wavelength
λ
P
(nm)
Publication date: January 2009
Relative luminous intensity (%)
SHD00673BEK
Ambient temperature T
a
(°C)
1
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)
If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
–
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
–
Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
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