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BQ25120A

Description
BQ25120A 700nA Low Iq Highly Integrated Battery Charge Management Solution
Categorysemiconductor    Power management   
File Size3MB,72 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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BQ25120A Overview

BQ25120A 700nA Low Iq Highly Integrated Battery Charge Management Solution

BQ25120A Parametric

Parameter NameAttribute value
Battery charge voltage(Min)(V)3.6
RatingCatalog
Absolute Vin (safety rating)(Max)((V))20
Number of series cells1
Package GroupDSBGA|25
Control interfaceI2C
FeaturesIntegrated Buck Converter,Integrated LDO,JEITA BAT Temp Monitoring (Thermistor Pin),OVP,Power Path,Temp Monitoring (Thermistor Pin),Thermal Regulation,UVLO
Operating Vin(Min)(V)3.4
Battery charge voltage(Max)(V)4.65
Cell chemistryLi-Ion/Li-Polymer
Approx. price(US$)1.60 | 1ku
Control topologyLinear
Charge current(Max)(A)0.3
Operating Vin(Max)(V)5.5

BQ25120A Related Products

BQ25120A BQ25120AYFPR BQ25120AYFPT
Description BQ25120A 700nA Low Iq Highly Integrated Battery Charge Management Solution 700nA Low Iq Highly Integrated Battery Charge Management Solution 25-DSBGA -40 to 85 700nA Low Iq Highly Integrated Battery Charge Management Solution 25-DSBGA -40 to 85
Brand Name - Texas Instruments Texas Instruments
Is it lead-free? - Lead free Lead free
Is it Rohs certified? - conform to conform to
Maker - Texas Instruments Texas Instruments
package instruction - VFBGA, DSBGA-25
Reach Compliance Code - compliant compliant
Factory Lead Time - 12 weeks 6 weeks
Samacsys Description - 700nA Low Iq Highly Integrated Battery Charge Management Solution 700nA Low Iq Highly Integrated Battery Charge Management Solution
Adjustable threshold - YES YES
Analog Integrated Circuits - Other Types - POWER SUPPLY MANAGEMENT CIRCUIT POWER SUPPLY MANAGEMENT CIRCUIT
JESD-30 code - R-XBGA-B25 S-XBGA-B25
JESD-609 code - e1 e1
length - 2.53 mm 2.53 mm
Humidity sensitivity level - 1 1
Number of channels - 4 4
Number of functions - 1 1
Number of terminals - 25 25
Maximum operating temperature - 85 °C 85 °C
Minimum operating temperature - -40 °C -40 °C
Package body material - UNSPECIFIED UNSPECIFIED
encapsulated code - VFBGA VFBGA
Package shape - RECTANGULAR SQUARE
Package form - GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) - NOT SPECIFIED NOT SPECIFIED
Maximum seat height - 0.5 mm 0.5 mm
Maximum supply voltage (Vsup) - 5.5 V 5.5 V
Minimum supply voltage (Vsup) - 3.4 V 3.4 V
Nominal supply voltage (Vsup) - 5 V 5 V
surface mount - YES YES
Temperature level - INDUSTRIAL INDUSTRIAL
Terminal surface - Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form - BALL BALL
Terminal pitch - 0.4 mm 0.4 mm
Terminal location - BOTTOM BOTTOM
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED
width - 2.468 mm 2.468 mm
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