Part Number: XZMOK78W
3.2x2.4mm SMD CHIP LED LAMP
Features
●
Ideal for indication light on hand held products
●
Long life and robust package
●
Standard Package: 1,500pcs/ Reel
●
MSL (Moisture Sensitivity Level): 3
●
RoHS compliant
Package Schematics
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
ATTENTION
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.1(0.004") unless otherwise noted.
3. Specifications are subject to change without notice.
Absolute Maximum Ratings
(T
A
=25°C)
Reverse Voltage
Forward Current
Forward Current (Peak)
1/10 Duty Cycle
0.1ms Pulse Width
Power Dissipation
Operating Temperature
Storage Temperature
V
R
I
F
i
FS
P
D
T
A
Tstg
Orange
(AlGaInP)
5
30
195
75
-40 ~ +85
-40 ~ +85
Operating Characteristics
(T
A
=25°C)
Forward Voltage (Typ.)
(I
F
=20mA)
Forward Voltage (Max.)
(I
F
=20mA)
Reverse Current (Max.)
(V
R
=5V)
Wavelength of Peak
Emission CIE127-2007* (Typ.)
(I
F
=20mA)
Wavelength of Dominant
Emission CIE127-2007* (Typ.)
(I
F
=20mA)
Spectral Line Full Width
At Half-Maximum (Typ.)
(I
F
=20mA)
Capacitance (Typ.)
(V
F
=0V, f=1MHz)
V
F
V
F
I
R
Orange
(AlGaInP)
2.1
2.5
10
Unit
V
mA
mA
mW
°C
Unit
V
V
uA
λP
610*
nm
A Relative Humidity between 40% and 60% is recommended in
ESD-protected work areas to reduce static build up during assembly
process (Reference JEDEC/JESD625-A and JEDEC/J-STD-033)
λD
601*
nm
△λ
29
nm
C
15
pF
Part
Number
Emitting
Color
Emitting
Material
Lens-color
Luminous Intensity
CIE127-2007*
(I
F
=20mA)
mcd
min.
typ.
2690
1590*
Wavelength
CIE127-2007*
λP
nm
Viewing
Angle
2θ 1/2
XZMOK78W
Orange
AlGaInP
Water Clear
1500
1000*
610*
20°
*Luminous intensity value and wavelength are in accordance with CIE127-2007 standards.
Sep 19,2016
XDSA3458
V6-X
Layout: Maggie L.
P. 1/4
Part Number: XZMOK78W
3.2x2.4mm SMD CHIP LED LAMP
Orange
Orange
LED is recommended for reflow soldering and
soldering profile is shown below.
Sep 19,2016
XDSA3458
V6-X
Layout: Maggie L.
P. 2/4
Part Number: XZMOK78W
3.2x2.4mm SMD CHIP LED LAMP
The device has a single mounting surface.
The device must be mounted according to
the specifications.
Recommended Soldering Pattern
(Units : mm; Tolerance: ± 0.1)
Reel Dimension
Tape Specification (Units : mm)
Remarks:
If special sorting is required (e.g. binning based on forward voltage, Luminous intensity / luminous flux, or wavelength),
the typical accuracy of the sorting process is as follows:
1. Wavelength: +/-1nm
2. Luminous intensity / luminous flux: +/-15%
3. Forward Voltage: +/-0.1V
Note: Accuracy may depend on the sorting parameters.
Sep 19,2016
XDSA3458
V6-X
Layout: Maggie L.
P. 3/4
Part Number: XZMOK78W
3.2x2.4mm SMD CHIP LED LAMP
PACKING & LABEL SPECIFICATIONS
XZxxx78x
TERMS OF USE
1. Data presented in this document reflect statistical figures and should be treated as technical reference only.
2. Contents within this document are subject to improvement and enhancement changes without notice.
3. The product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet.
User accepts full risk and responsibility when operating the product(s) beyond their intended specifications.
4. The product(s) described in this document are intended for electronic applications in which a person’s life is not reliant upon the LED. Please
consult with a SunLED representative for special applications where the LED may have a direct impact on a person’s life.
5. The contents within this document may not be altered without prior consent by SunLED.
6. Additional technical notes are available at
http://www.SunLEDusa.com/TechnicalNotes.asp
Sep 19,2016
XDSA3458
V6-X
Layout: Maggie L.
P. 4/4
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