MXL1N4686UR-1 datasheet, PDF - EEWORLD Datasheet

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MXL1N4686UR-1: DescriptionZener Diode; CategoryDiscrete semiconductor diode; File Size171KB，5 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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MXL1N4686UR-1 Overview

Zener Diode

MXL1N4686UR-1 Parametric

Parameter Name	Attribute value
Reach Compliance Code	compli
ECCN code	EAR99
Diode type	ZENER DIODE
JESD-609 code	e0
Terminal surface	TIN LEAD
Base Number Matches	1

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1N4678UR-1 thru 1N4717UR-1

Available on

commercial

versions

500 mW SURFACE MOUNT ZENER DIODES

DESCRIPTION

Screening in

reference to

MIL-PRF-19500

available

The 1N4678UR-1 thru 1N4717UR-1 series of 0.5 watt glass surface mount DO-213AA Zener

voltage regulators provides a selection from 1.8 to 43 volts in standard 5% tolerances as well

as tighter tolerances with a very low test current of 50 µA. These have an internal

metallurgical bond. This type of internally bonded Zener package construction is also

available with high-reliability up-screening as described in the Features section. Microsemi

also offers numerous other Zener products to meet higher and lower power applications.

DO-213AA Package

Important:

For the latest information, visit our website

http://www.microsemi.com.

FEATURES

•

Surface mount equivalent of JEDEC registered 1N4678 thru 1N4717 series.

Internal metallurgical bond.

Hermetically sealed surface mount package.

Tighter voltage tolerances of 2% and 1% are available.

Up-screening available in reference to MIL-PRF-19500 (see

part nomenclature

for all available

options).

RoHS compliant devices available (commercial grade only).

Also available in:

DO-35 (DO-204AH)

(surface mount)

1N4678-1 – 1N4717-1

APPLICATIONS / BENEFITS

•

Regulates voltage over a broad operating current and temperature range.

Voltage selection from 1.8 to 43 V.

Standard voltage tolerance +/- 5 %.

Non-sensitive to ESD per MIL-STD-750 method 1020.

Minimal capacitance (see

Figure 2).

Inherently radiation hard as described in Microsemi’s “MicroNote

050”.

MAXIMUM RATINGS

Parameters/Test Conditions

Junction and Storage Temperature

(1)

Thermal Resistance Junction-to-End Cap

(1)

Thermal Resistance Junction-to-Ambient

(2)

Steady-State Power Dissipation

Forward Voltage @ 100 mA

Solder Temperature @ 10 s

Symbol

and T

STG

ӨJL

ӨJA

Value

-65 to +175

100

250

0.5

1.5

260

Unit

C/W

MSC – Lawrence

6 Lake Street,

Lawrence, MA 01841

Tel: 1-800-446-1158 or

(978) 620-2600

Fax: (978) 689-0803

MSC – Ireland

Gort Road Business Park,

Ennis, Co. Clare, Ireland

Tel: +353 (0) 65 6840044

Fax: +353 (0) 65 6822298

Website:

www.microsemi.com

Notes:

1. When mounted on FR4 PC board (1 oz Cu) with recommended footprint (see last page).

2. At T

< 125

C or at ambient T

< 50

C when mounted on FR4 PC board.

T4-LDS-0240-1, Rev. 1 (112022)

Page 1 of 5

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