Philips Semiconductors
Product specification
NPN microwave power transistor
FEATURES
•
Diffused emitter ballasting resistors
providing excellent current sharing
and withstanding a high VSWR
•
Interdigitated structure provides
high emitter efficiency
•
Gold metallization realizes very
good stability of the characteristics
and excellent lifetime
•
Multicell geometry gives good
balance of dissipated power and
low thermal resistance
•
Internal input prematching ensures
good stability and allows an easier
design of wideband circuits.
APPLICATIONS
Intended for use in common emitter,
class AB amplifiers in CW conditions
for professional applications between
1.5 GHz and 1.8 GHz.
DESCRIPTION
NPN silicon planar epitaxial
microwave power transistor in a
SOT437A glued cap metal ceramic
flange package, with emitter
connected to flange.
2
Top view
handbook, 4 columns
LLE16045X
QUICK REFERENCE DATA
Microwave performance up to T
mb
= 25
°C
in a common emitter class AB
amplifier.
MODE OF
OPERATION
Class AB (CW)
f
(GHz)
1.65
V
CE
(V)
24
I
CQ
(A)
0.04
P
L1
(W)
≥4.5
G
po
(dB)
≥8.5
η
C
(%)
typ. 50
Z
i
; Z
L
(Ω)
see Figs 8
and 9
PINNING - SOT437A
PIN
1
2
3
collector
base
emitter connected to flange
DESCRIPTION
1
c
b
3
e
MAM112
Fig.1 Simplified outline and symbol.
WARNING
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided that the BeO slab is not damaged.
All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety
precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of
the user. It must never be thrown out with the general or domestic waste.
1997 Feb 18
2
Philips Semiconductors
Product specification
NPN microwave power transistor
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
V
CBO
V
CER
V
CEO
V
EBO
I
C
P
i
P
tot
T
stg
T
j
T
sld
Note
1. Up to 0.2 mm from ceramic.
PARAMETER
collector-base voltage
collector-emitter voltage
collector-emitter voltage
emitter-base voltage
DC collector current
input power
total power dissipation
storage temperature
junction temperature
soldering temperature
t
≤
10 s; note 1
f = 1.65 GHz; V
CE
= 24 V; class AB
T
mb
= 75
°C
CONDITIONS
open emitter
R
BE
= 220
Ω
open base
open collector
LLE16045X
MIN.
−
−
−
−
−
−
−
−65
−
−
MAX.
45
30
15
3
0.5
1
11
+150
200
235
UNIT
V
V
V
V
A
W
W
°C
°C
°C
handbook, halfpage
1
MBD744
handbook, halfpage
15
MBD745
P tot
IC
(A)
(W)
10
Ι
ΙΙ
10
1
5
10
2
1
10
VCE (V)
0
10
2
0
50
100
150
200
T mb ( o C)
T
mb
≤
75
°C.
(I) Region of permissible DC operation.
(II) Permissible extension provided R
BE
≤
220
Ω.
Fig.2 DC SOAR.
Fig.3 Power derating curve.
1997 Feb 18
3
Philips Semiconductors
Product specification
NPN microwave power transistor
THERMAL CHARACTERISTICS
SYMBOL
R
th j-mb
R
th mb-h
Note
1. See
“Mounting recommendations in the General part of handbook SC19a”.
CHARACTERISTICS
T
j
= 25
°C
unless otherwise specified.
SYMBOL
I
CBO
V
(BR)CER
V
(BR)CBO
V
(BR)EBO
h
FE
PARAMETER
collector cut-off current
collector-emitter breakdown voltage
collector-base breakdown voltage
emitter-base breakdown voltage
DC current gain
CONDITIONS
I
E
= 0; V
CB
= 20 V
I
C
= 1 mA; R
BE
= 220
Ω
I
C
= 1 mA
I
E
= 1 mA
I
C
= 0.25 A; V
CE
= 5 V
−
30
45
3
15
MIN.
PARAMETER
thermal resistance from junction to mounting base
CONDITIONS
T
j
= 100
°C
LLE16045X
MAX.
8.5
0.2
UNIT
K/W
K/W
thermal resistance from mounting base to heatsink note 1
MAX.
75
−
−
−
100
UNIT
µA
V
V
V
APPLICATION INFORMATION
Microwave performance up to T
mb
= 25
°C
in a common emitter class AB amplifier.
MODE OF
OPERATION
Class AB (CW)
f
(GHz)
1.65
V
CE
(V)
24
I
CQ
(A)
0.04
P
L1
(W)
≥4.5
typ. 5.5
G
po
(dB)
≥8.5
typ. 9.5
η
C
(%)
typ. 50
Z
i
; Z
L
(Ω)
see Figs 8
and 9
1997 Feb 18
4
Philips Semiconductors
Product specification
NPN microwave power transistor
LLE16045X
handbook, full pagewidth
30
30
5.0
10.0
7.0
4.0 3.0
40
1.1
7.0
3.0
7.0
3.0
1.1
2.0
4.0
40
MBD750
C5
V BB
C6
VCC
F1
input
C1
L2
L1
C4
output
C2
C3
MBD751
The test circuit is split into two independent halves, each being 30
×
40 mm in size.
Dimensions in mm.
Substrate: Teflon fibreglass.
Thickness: 0.4 mm.
Permittivity:
ε
r
= 2.55.
Fig.4 Prematching test circuit board.
1997 Feb 18
5
京公网安备 11010802033920号
EEWORLD
