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322CNQ030

Description
150 A, 30 V, SILICON, RECTIFIER DIODE, TO-249AA
CategoryDiscrete semiconductor    diode   
File Size65KB,3 Pages
ManufacturerInternational Rectifier ( Infineon )
Websitehttp://www.irf.com/
Download Datasheet Parametric View All

322CNQ030 Overview

150 A, 30 V, SILICON, RECTIFIER DIODE, TO-249AA

322CNQ030 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerInternational Rectifier ( Infineon )
Parts packaging codeTO-249AA
package instructionR-PSFM-T9
Contacts9
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresFREE WHEELING DIODE, HIGH RELIABILITY
applicationGENERAL PURPOSE
Shell connectionISOLATED
ConfigurationCOMMON CATHODE, 2 ELEMENTS
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
Maximum forward voltage (VF)0.7 V
JEDEC-95 codeTO-249AA
JESD-30 codeR-PSFM-T9
Maximum non-repetitive peak forward current10000 A
Number of components2
Phase1
Number of terminals9
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Maximum output current150 A
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Certification statusNot Qualified
Maximum repetitive peak reverse voltage30 V
Maximum reverse current10000 µA
surface mountNO
technologySCHOTTKY
Terminal formTHROUGH-HOLE
Terminal locationSINGLE
Base Number Matches1
Preliminary Data Sheet PD-20550 rev. A 04/01
322CNQ030
SCHOTTKY RECTIFIER
300 Amp
Major Ratings and Characteristics
Characteristics
I
F(AV)
Rectangular
waveform
V
RRM
I
FSM
@ tp = 5 µs sine
V
F
T
J
@ 150 Apk, T
J
= 125°C
(per leg)
range
Description/Features
The 322CNQ030 isolated center tap Schottky rectifier module
series has been optimized for low reverse leakage at high
temperature. The proprietary barrier technology allows for
reliable operation up to 150° C junction temperature. Typical
applications are in switching power supplies, converters, free-
wheeling diodes, and reverse battery protection.
150 °C T
J
operation
High Surge Capability
Center tap module
High purity, high temperature epoxy encapsulation for
enhanced mechanical strength and moisture resistance
Low forward voltage drop
High frequency operation
Guard ring for enhanced ruggedness and long term
reliability
Low profile, high current package
322CNQ030 Units
300
30
10,000
0.56
A
V
A
V
- 55 to 150
°C
CASE STYLE AND DIMENSIONS
* PRE-SOLDER CHIP DIMENSIONS
Outline D-60 (Modified JEDEC TO-249AA)
Dimensions in millimeters and inches
www.irf.com
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