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LFX1200C-03F900I

Description
The ispXPGA architecture
CategoryProgrammable logic devices    Programmable logic   
File Size1MB,119 Pages
ManufacturerLattice
Websitehttp://www.latticesemi.com
Download Datasheet Parametric Compare View All

LFX1200C-03F900I Overview

The ispXPGA architecture

LFX1200C-03F900I Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerLattice
Parts packaging codeBGA
package instructionFPBGA-900
Contacts900
Reach Compliance Codeunknow
ECCN codeEAR99
maximum clock frequency320 MHz
Combined latency of CLB-Max1.07 ns
JESD-30 codeS-PBGA-B900
JESD-609 codee0
length31 mm
Humidity sensitivity level3
Configurable number of logic blocks3844
Equivalent number of gates1250000
Number of entries496
Number of logical units15376
Output times496
Number of terminals900
organize3844 CLBS, 1250000 GATES
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA900,30X30,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)225
power supply1.8 V
Programmable logic typeFIELD PROGRAMMABLE GATE ARRAY
Certification statusNot Qualified
Maximum seat height2.6 mm
Maximum supply voltage1.95 V
Minimum supply voltage1.65 V
Nominal supply voltage1.8 V
surface mountYES
technologyCMOS
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width31 mm
ispXPGA
®
Device Datasheet
June 2010
Select Devices Discontinued!
Product Change Notifications (PCNs) have been issued to discontinue select devices in
this data sheet.
The original datasheet pages have not been modified and do not reflect those changes.
Please refer to the table below for reference PCN and current product status.
Product Line
Ordering Part Number
LFX125B-03F256C
LFX125B-03FN256C
LFX125B-04F256C
LFX125B-04FN256C
LFX125B-05F256C
LFX125B-05FN256C
LFX125B-03F516C
LFX125B-04F516C
LFX125B-05F516C
LFX125C-03F256C
LFX125C-03FN256C
LFX125C-04F256C
LFX125C-04FN256C
LFX125C-03F516C
LFX125C-04F516C
LFX200B-03F256C
LFX200B-03FN256C
LFX200B-04F256C
LFX200B-04FN256C
LFX200B-05F256C
LFX200B-05FN256C
LFX200B-03F516C
LFX200B-04F516C
LFX200B-05F516C
LFX200C-03F256C
LFX200C-03FN256C
LFX200C-04F256C
LFX200C-04FN256C
LFX200C-03F516C
LFX200C-04F516C
Product Status
Reference PCN
LFX125B
Discontinued
PCN#09-10
LFX125C
Discontinued
PCN#09-10
Active / Orderable
LFX200B
Discontinued
PCN#09-10
LFX200C
Discontinued
PCN#09-10
5555 N.E. Moore Ct.
Hillsboro, Oregon 97124-6421 Phone (503) 268-8000
Internet: http://www.latticesemi.com
FAX (503) 268-8347

LFX1200C-03F900I Related Products

LFX1200C-03F900I XPGA LFX1200B-03F900I
Description The ispXPGA architecture The ispXPGA architecture The ispXPGA architecture
Is it Rohs certified? incompatible - incompatible
Maker Lattice - Lattice
Parts packaging code BGA - BGA
package instruction FPBGA-900 - FPBGA-900
Contacts 900 - 900
Reach Compliance Code unknow - compli
ECCN code EAR99 - EAR99
maximum clock frequency 320 MHz - 320 MHz
Combined latency of CLB-Max 1.07 ns - 1.07 ns
JESD-30 code S-PBGA-B900 - S-PBGA-B900
JESD-609 code e0 - e0
length 31 mm - 31 mm
Humidity sensitivity level 3 - 3
Configurable number of logic blocks 3844 - 3844
Equivalent number of gates 1250000 - 1250000
Number of entries 496 - 496
Number of logical units 15376 - 15376
Output times 496 - 496
Number of terminals 900 - 900
organize 3844 CLBS, 1250000 GATES - 3844 CLBS, 1250000 GATES
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code BGA - BGA
Encapsulate equivalent code BGA900,30X30,40 - BGA900,30X30,40
Package shape SQUARE - SQUARE
Package form GRID ARRAY - GRID ARRAY
Peak Reflow Temperature (Celsius) 225 - 225
power supply 1.8 V - 2.5/3.3 V
Programmable logic type FIELD PROGRAMMABLE GATE ARRAY - FIELD PROGRAMMABLE GATE ARRAY
Certification status Not Qualified - Not Qualified
Maximum seat height 2.6 mm - 2.6 mm
Maximum supply voltage 1.95 V - 2.7 V
Minimum supply voltage 1.65 V - 2.3 V
Nominal supply voltage 1.8 V - 2.5 V
surface mount YES - YES
technology CMOS - CMOS
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb)
Terminal form BALL - BALL
Terminal pitch 1 mm - 1 mm
Terminal location BOTTOM - BOTTOM
Maximum time at peak reflow temperature 30 - 30
width 31 mm - 31 mm
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