5962-8751501KX datasheet, PDF - EEWORLD Datasheet

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5962-8751501KX: DescriptionUVPROM, 8KX8, 45ns, CMOS, CDFP24, CERAMIC, FP-24; Categorystorage storage; File Size156KB，16 Pages; ManufacturerWaferscale Integration Inc.

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5962-8751501KX Overview

UVPROM, 8KX8, 45ns, CMOS, CDFP24, CERAMIC, FP-24

5962-8751501KX Parametric

Parameter Name	Attribute value
package instruction	CERAMIC, FP-24
Reach Compliance Code	unknown
Maximum access time	45 ns
JESD-30 code	R-GDFP-F24
memory density	65536 bit
Memory IC Type	UVPROM
memory width	8
Number of functions	1
Number of terminals	24
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	8KX8
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DFP
Package shape	RECTANGULAR
Package form	FLATPACK
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	FLAT
Terminal location	DUAL
Base Number Matches	1

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REVISIONS

LTR

DESCRIPTION

DATE

APPROVED

Add six new device types for vendor CAGE number 65786. Add

vendor CAGE number 1FN41 as a source of supply for devices 01KX,

02KX, 03KX, and 04KX. Change to vendor similar part number for

vendor CAGE number 1FN41. Change to margin test method A for

vendor CAGE number 66579. Remove 4.5.1, 4.5.2, 4.5.3, figures 5

and 6, and table III from drawing. Change to parameters t

and t

table I. Change to figures 2 and 3. Editorial changes throughout.

5 year review and update. Changed input capacitance from 6 pF to

10 pF. ksr

93-01-21

M. A. Frye

06-06-06

Raymond Monnin

THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Kenneth Rice

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

http://www.dscc.dla.mil

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS

AVAILABLE FOR USE BY

All DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

AMSC N/A

CHECKED BY

Charles Reusing

APPROVED BY

Michael A. Frye

DRAWING APPROVAL DATE

88-06-21

REVISION LEVEL

MICROCIRCUIT, MEMORY,

DIGITAL, CMOS, 8K X 8 UV

EPROM, MONOLITHIC SILICON

SIZE

CAGE CODE

SHEET

67268

1 OF

5962-87515

5962-E483-06

DSCC FORM 2233

APR 97

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part

of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the

solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 -

MIL-STD-1835 -

Test Method Standard Microcircuits.

Interface Standard Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 -

MIL-HDBK-780 -

List of Standard Microcircuit Drawings.

Standard Microcircuit Drawings.

(Copies of these documents are available online at

http://assist.daps.dla.mil/quicksearch/

http://assist.daps.dla.mil

from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN

class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing

(QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535

may be processed as QML product in accordance with the manufacturer's approved program plan and qualifying activity

approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make

modifications to the requirements herein. These modifications shall not affect the PIN as described herein. A "Q" or "QML"

certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in

MIL-PRF-38535, appendix A and herein.

3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.3 Truth table. The truth table shall be as specified on figure 2.

3.2.3.1 Unprogrammed or erased devices. The truth table for unprogrammed devices for contracts involving no altered item

drawing shall be as specified on figure 2. When required in groups A, B, or C inspection (see 4.3), the devices shall be

programmed by the manufacturer prior to test in a checkerboard pattern or equivalent (a minimum of 50 percent of the total

number of bits programmed) or to any altered item drawing pattern which includes at least 25 percent of the total numbers of bits

programmed.

3.2.3.2 Programmed devices. The truth table for programmed devices shall be as specified by an attached altered item

drawing.

3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are

as specified in table I and shall apply over the full case operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

tests for each subgroup are described in table I.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-87515

SHEET

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