REVISIONS
LTR
A
B
DESCRIPTION
Added device type 10. Redrew entire document.
Corrected true dimensioning table and removed dimensions A2 and F
in figure 1. Changed dimension A min from 0.185 inches to 0.180
inches for case outlines U and Y. Changes dimension A min from
0.210 inches to 0.200 inches for case outlines T and X. Added
vendor CAGE code 88379 for device types 01 through 10. Made
editorial changes throughout.
Added case outlines M, N, 4, and 5. Redrew entire document.
Table I, changed the maximum limit for the supply current 32-bit
mode test (I
CC32
) from 440 to 520 for device types 05 and 06, and
from 500 to 520 for device types 07 and 08. -sld
Figure 1: For case outlines 4 and 5 changed the dimension D3 min
and max limits to 1.020 and 1.060 inches. For case outlines 4 and 5
changed dimension A min limit to .135 inches. For case outlines 4
and 5 changed dimension L min limit to .132 inches. -sld
Table I; changed the max limit for I
CC32
for device types 05, 06, 07,
and 08 from 520 mA to 600 mA. Changed the max limit for I
CCDR1
for
device types 05 through 10 from 10.4 mA to 11.6 mA. -sld
Added device type 11. Added vendor CAGE 0EU86 for device types
05 through 09. -sld
Figure 1; changed the maximum limit for dimension D3 from 1.060
inches to 1.086 inches for case outlines 4 and 5. -sld
Added note to paragraph 1.2.2 and table I regarding the 4 transistor
design. Added footnote 3 for case outlines U, T, X, and Y on the
bulletin page. Redrew entire document. -sld
Added device types 12 through 18. -sld
Updated drawing. -gz
DATE (YR-MO-DA)
95-07-07
95-10-18
APPROVED
K. A. Cottongim
K. A. Cottongim
C
D
96-11-20
97-09-08
K. A. Cottongim
K. A. Cottongim
E
98-04-06
K. A. Cottongim
F
98-07-13
K. A. Cottongim
G
H
J
99-08-27
00-02-07
00-11-14
Raymond Monnin
Raymond Monnin
Raymond Monnin
K
L
01-11-13
07-04-16
Raymond Monnin
Robert M. Heber
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
L
15
L
16
L
17
L
18
REV
SHEET
PREPARED BY
Steve L. Duncan
CHECKED BY
Michael C. Jones
L
19
L
20
L
21
L
1
L
22
L
2
L
23
L
3
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L
4
L
25
L
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26
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STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil/
APPROVED BY
Kendall A. Cottongim
MICROCIRCUIT, HYBRID, DIGITAL, STATIC
RANDOM ACCESS MEMORY, CMOS, 128K x
32-BIT
DRAWING APPROVAL DATE
94-06-24
REVISION LEVEL
L
SIZE
A
SHEET
CAGE CODE
67268
1 OF
26
5962-93187
DSCC FORM 2233
APR 97
5962-E344-07
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When
available, a choice of radiation hardness assurance levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962
⏐
⏐
⏐
Federal
stock class
designator
\
-
⏐
⏐
⏐
RHA
designator
(see 1.2.1)
93187
01
⏐
⏐
⏐
Device
type
(see 1.2.2)
H
⏐
⏐
⏐
Device
class
designator
(see 1.2.3)
M
⏐
⏐
⏐
Case
outline
(see 1.2.4)
X
⏐
⏐
⏐
Lead
finish
(see 1.2.5)
/
\/
Drawing number
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type 1/
01
02
03
04
05,12
06,13
07,14
08,15
09,16
10,17
11,18
Generic number
Circuit function
SRAM, 128K x 32-bit
SRAM, 128K x 32-bit
SRAM, 128K x 32-bit
SRAM, 128K x 32-bit
SRAM, 128K x 32-bit
SRAM, 128K x 32-bit
SRAM, 128K x 32-bit
SRAM, 128K x 32-bit
SRAM, 128K x 32-bit
SRAM, 128K x 32-bit
SRAM, 128K x 32-bit
Access time
120 ns
100 ns
85 ns
70 ns
55 ns
45 ns
35 ns
25 ns
20 ns
17 ns
15 ns
WS128K32-120HQ, ACT-S128K32-120PQ
WS128K32-100HQ, ACT-S128K32-100PQ
WS128K32-85HQ, ACT-S128K32-85PQ
WS128K32-70HQ, ACT-S128K32-70PQ
WS128K32-55HQ, ACT-S128K32-55PQ,
AS8S128K32P-55
WS128K32-45HQ, ACT-S128K32-45PQ,
AS8S128K32P-45
WS128K32-35HQ, ACT-S128K32-35PQ,
AS8S128K32P-35
WS128K32-25HQ, ACT-S128K32-25PQ,
AS8S128K32P-25
WS128K32-20HQ, ACT-S128K32-20PQ,
AS8S128K32P-20
WS128K32-17HQ, ACT-S128K32-17PQ,
AS8S128K32P-17
WS128K32-15HQ
_____
1/ Due to the nature of the 4 transistor design of the die in these device types, topologically pure testing is important,
particularly for high reliability applications. The device manufacturer should be consulted concerning their testing
methods and algorithms.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
L
5962-93187
SHEET
2
DSCC FORM 2234
APR 97
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All
levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and
E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class
K
Device performance documentation
Highest reliability class available. This level is intended for use in space
applications.
Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C and D).
Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must
be specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
H
G
E
D
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: 1/
Outline letter
M
N
T
U
X
Y
4
5
Descriptive designator
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
Terminals
66
66
66
66
66
66
66
66
Package style
Hex-in-line, single cavity, without standoffs
Hex-in-line, single cavity, without standoffs
Hex-in-line, single cavity, with standoffs
Hex-in-line, single cavity, without standoffs
Hex-in-line, single cavity, with standoffs
Hex-in-line, single cavity, without standoffs
Hex-in-line, single cavity, with standoffs
Hex-in-line, single cavity, with standoffs
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 2/
Supply voltage range (V
CC
) ........................................................
Signal voltage range (any pin) ...................................................
Power dissipation (P
D
):
Device types 01 through 08, and 12 through 15 .....................
Device types 09, 10, 11, 16, 17, and 18 ................................
Thermal resistance junction-to-case (θJ
C
) .................................
Storage temperature range........................................................
Lead temperature (soldering, 10 seconds).................................
-0.5 V dc to +7.0 V dc
-0.5 V dc to +7.0 V dc
2.2 W
4.4 W
6.6°C/W
-65°C to +150°C
+300°C
1/ Additional case outlines are available on Standard Microcircuit Drawing 5962-95595.
2/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
A
REVISION LEVEL
L
5962-93187
SHEET
3
DSCC FORM 2234
APR 97
1.4 Recommended operating conditions.
Supply voltage range (V
CC
) ........................................................
Input low voltage range (V
IL
) ......................................................
Input high voltage range (V
IH
) ....................................................
Output low voltage, maximum (V
OL
)...........................................
Output high voltage, minimum (V
OH
) ..........................................
Case operating temperature range (T
C
) .....................................
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or from
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The
manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as
defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not
affect the form, fit, or function of the device for the applicable device class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38534 and herein.
+4.5 V dc to +5.5 V dc
-0.5 V dc to +0.8 V dc
+2.2 V dc to V
CC
+0.3 V dc
+0.4 V dc
+2.4 V dc
-55°C to +125°C
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
L
5962-93187
SHEET
4
DSCC FORM 2234
APR 97
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.
3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figures 4 and 5.
3.2.5 Block diagram. The block diagram shall be as specified on figure 6.
3.2.6 Output load circuit. The output load circuit shall be as specified on figure 7.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with
the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,
for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those
which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be
made available to the preparing activity (DSCC-VA) upon request.
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets
the performance requirements of MIL-PRF-38534 and herein.
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form,
fit, or function as described herein.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
L
5962-93187
SHEET
5
DSCC FORM 2234
APR 97
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