EEWORLDEEWORLDEEWORLD

Part Number

Search

5962-9559505HXC

Description
SRAM Module, 512KX8, 55ns, CMOS, CQFP68, 40 X 40 MM, HERMETIC SEALED, CERAMIC, QFP-68
Categorystorage    storage   
File Size369KB,12 Pages
ManufacturerWhite Microelectronics
Download Datasheet Parametric View All

5962-9559505HXC Overview

SRAM Module, 512KX8, 55ns, CMOS, CQFP68, 40 X 40 MM, HERMETIC SEALED, CERAMIC, QFP-68

5962-9559505HXC Parametric

Parameter NameAttribute value
package instruction40 X 40 MM, HERMETIC SEALED, CERAMIC, QFP-68
Reach Compliance Codeunknown
Maximum access time55 ns
Other featuresUSER CONFIGURABLE AS 128K X 32
Spare memory width16
JESD-30 codeS-CQFP-F68
JESD-609 codee4
length40 mm
memory density4194304 bit
Memory IC TypeSRAM MODULE
memory width8
Number of functions1
Number of ports1
Number of terminals68
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512KX8
Output characteristics3-STATE
ExportableYES
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFF
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height5.1 mm
Minimum standby current2 V
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceGOLD
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationQUAD
width40 mm
Base Number Matches1
Intel interim CEO: Intel's commitment to China will not waver
According to the news on the morning of July 28th, Beijing time, Intel's interim CEO Bob Swan said that China will remain an important market for Intel. [/size][/font][/size][/font][/color][/align][al...
tlyl18108837711 Integrated technical exchanges
Find SAMSUNG S3C2440 development board
Looking for SAMSUNG S3C2440 development board, requiring support for wince5.0 system, preferably near Shenzhen, and able to provide face-to-face technical support services....
liwei3290 Embedded System
Survey on FPGA and CPLD Industry Usage
In which industry do you use FPGA and CPLD?...
eeleader FPGA/CPLD
How to align the characters of PCB component names
I have a basic question, as the title says. I am using AD9....
675452482 PCB Design
A trip to northeastern Yunnan during the National Day holiday
How did you spend your National Day holiday? Please post and share your experiences so that we can have a look:congratulate:[b][size=3][color=#0000ff] [/color][/size][/b] [b][size=3][color=#0000ff]Hea...
eric_wang Talking

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1780  1788  1612  1611  1620  36  33  43  3  44 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号