REVISIONS
LTR
F
G
H
DESCRIPTION
Added device type 11. Added vendor CAGE code 0EU86 for device
types 05 through 09. -sld
Add note to paragraph 1.2.2 and table I, conditions. Add case
outline 9.
Correct figure 1, case outline M diagram, adding dimension "c", lead
thickness. Change figure 1, case outline M, A2 maximum dimension
from 0.015" to 0.025" and clarify A2 dimension in note 3.
Figure 1, case outline 9; changed the min limit for dimensions D2/E2
from 0.990 inches to 0.980 inches. Added vendor cage 88379 for the
case outline 9. Updated paragraph 1.2.3 to describe the five class
levels. -sld
Added device types 12 through 18. -sld
DATE (YR-MO-DA)
99-09-07
00-04-06
00-06-14
APPROVED
Raymond Monnin
Raymond Monnin
Raymond Monnin
J
01-05-06
Raymond Monnin
K
01-11-14
Raymond Monnin
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
K
15
K
16
K
17
K
18
REV
SHEET
PREPARED BY
Steve L. Duncan
CHECKED BY
Michael C. Jones
K
19
K
20
K
21
K
1
K
22
K
2
K
23
K
3
K
24
K
4
K
25
K
5
K
26
K
6
K
7
K
8
K
9
K
10
K
11
K
12
K
13
K
14
STANDARD
MICROCIRCUIT
DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
POST OFFICE BOX 3990
COLUMBUS, OHIO 43216-5000
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
APPROVED BY
Kendall A. Cottongim
MICROCIRCUIT, HYBRID, MEMORY,
DIGITAL, STATIC RANDOM ACCESS
MEMORY, CMOS, 128K x 32-BIT
DRAWING APPROVAL DATE
95-07-19
REVISION LEVEL
K
SIZE
A
SHEET
CAGE CODE
67268
1 OF
26
5962-95595
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E622-01
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When
available, a choice of radiation hardness assurance levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962
Federal
stock class
designator
\
-
RHA
designator
(see 1.2.1)
\/
Drawing number
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type 1/
01
02
03
04
05,12
06,13
07,14
08,15
09,16
10,17
11,18
Generic number
Circuit function
SRAM, 128K x 32-BIT
SRAM, 128K x 32-BIT
SRAM, 128K x 32-BIT
SRAM, 128K x 32-BIT
SRAM, 128K x 32-BIT
SRAM, 128K x 32-BIT
SRAM, 128K x 32-BIT
SRAM, 128K x 32-BIT
SRAM, 128K x 32-BIT
SRAM, 128K x 32-BIT
SRAM, 128K x 32-BIT
Access time
120 ns
100 ns
85 ns
70 ns
55 ns
45 ns
35 ns
25 ns
20 ns
17 ns
15 ns
95595
01
Device
type
(see 1.2.2)
/
H
Device
class
designator
(see 1.2.3)
X
Case
outline
(see 1.2.4)
X
Lead
finish
(see 1.2.5)
WS128K32-120Q
WS128K32-100Q
WS128K32-85Q
WS128K32-70Q
WS128K32-55Q, ACT-S128K32N-055Q, AS8S128K32Q-55
WS128K32-45Q, ACT-S128K32N-045Q, AS8S128K32Q-45
WS128K32-35Q, ACT-S128K32N-035Q, AS8S128K32Q-35
WS128K32-25Q, ACT-S128K32N-025Q, AS8S128K32Q-25
WS128K32-20Q, ACT-S128K32N-020Q, AS8S128K32Q-20
WS128K32-17Q, ACT-S128K32N-017Q, AS8S128K32Q-17
WS128K32-15Q
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level.
All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K,
and E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class
K
H
G
Device performance documentation
Highest reliability class available. This level is intended for use in space
applications.
Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C and D).
1/
Due to the nature of the 4 transistor design of the die used in these device types, topologically pure testing is
important, particularly for high reliability applications. The device manufacturer should be consulted concerning
their testing methods and algorithms.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
K
5962-95595
SHEET
2
DSCC FORM 2234
APR 97
E
D
Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must
be specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
1.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter
M 1/
N
X
Y
Z
9
Descriptive designator
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
Terminals
68
68
68
68
68
68
Package style
Ceramic, quad flatpack, single/dual cavity
Co-fired ceramic, single cavity, ultra
low profile, quad flat pack
Ceramic, quad flatpack
Ceramic, quad flatpack, low profile
Ceramic, quad flatpack, dual cavity
Ceramic, quad flatpack
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 2/
Supply voltage range (V
CC
) ..........................................................
Signal voltage range (any pin) ......................................................
Power dissipation (P
D
):
Device types 01 through 08, and 12 through 15........................
Device types 09, 10, 11, 16, 17, and 18 ....................................
Thermal resistance junction-to-case (θ
JC
):
Case outlines X and Y ...............................................................
Case outline M...........................................................................
Case outline N...........................................................................
Case outline Z ...........................................................................
Case outline 9 ...........................................................................
Storage temperature .....................................................................
Lead temperature (soldering, 10 seconds) ...................................
1.4 Recommended operating conditions.
Supply voltage (V
CC
) .....................................................................
Input low voltage range (V
IL
) .........................................................
Input high voltage range (V
IH
) .......................................................
Output low voltage, maximum (V
OL
)..............................................
Output high voltage, minimum (V
OH
).............................................
Case operating temperature range (T
C
)........................................
+4.5 V dc to +5.5 V dc
-0.3 V dc to +0.8 V dc
+2.2 V dc to V
CC
+0.5 V dc
+0.4 V dc
+2.4 V dc
-55°C to +125°C
-0.5 V dc to +7.0 V dc
-0.5 V dc to +7.0 V dc
2.75 W maximum
3.30 W maximum
6.6°C/W
10°C/W
2.72°C/W
8°C/W
4.9°C/W
-65°C to +150°C
+300°C
1/
2/
The case outline M is available in either a single or dual cavity package.
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
K
5962-95595
SHEET
3
DSCC FORM 2234
APR 97
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's).
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing shall take precedence. Nothing in this document , however, supercedes applicable laws and regulations unless
a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class.
Therefore, the tests and inspections herein may not be performed for the applicable device class (see MIL-PRF-38534).
Furthermore, the manufacturer may take exceptions or use alternate methods to the tests and inspections herein and not
perform them. However, the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device
class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.
3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figures 4 and 5.
3.2.5 Block diagram(s). The block diagram(s) shall be as specified on figure 6.
3.2.6 Output load circuit. The output load circuit shall be as specified on figure 7.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
K
5962-95595
SHEET
4
DSCC FORM 2234
APR 97
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked
with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked as listed in MIL-HDBK-
103 and QML-38534.
3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot
sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for
those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer
and be made available to the preparing activity (DSCC-VA) upon request.
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets
the performance requirements of MIL-PRF-38534 and herein.
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
K
5962-95595
SHEET
5
DSCC FORM 2234
APR 97
Embedded System
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