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5962-9559507HMC

Description
SRAM Module, 128KX32, 35ns, CMOS, CQFP68,
Categorystorage    storage   
File Size214KB,36 Pages
ManufacturerWhite Electronic Designs Corporation
Websitehttp://www.wedc.com/
Download Datasheet Parametric Compare View All

5962-9559507HMC Overview

SRAM Module, 128KX32, 35ns, CMOS, CQFP68,

5962-9559507HMC Parametric

Parameter NameAttribute value
package instructionQFP, QFP68,1.1SQ,50
Reach Compliance Codeunknown
Maximum access time35 ns
I/O typeCOMMON
JESD-30 codeS-XQFP-G68
memory density4194304 bit
Memory IC TypeSRAM MODULE
memory width32
Number of terminals68
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize128KX32
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codeQFP
Encapsulate equivalent codeQFP68,1.1SQ,50
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Maximum standby current0.0116 A
Minimum standby current2 V
Maximum slew rate0.6 mA
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationQUAD
Base Number Matches1
REVISIONS
LTR
F
G
H
DESCRIPTION
Added device type 11. Added vendor CAGE code 0EU86 for device
types 05 through 09. -sld
Add note to paragraph 1.2.2 and table I, conditions. Add case
outline 9.
Correct figure 1, case outline M diagram, adding dimension "c", lead
thickness. Change figure 1, case outline M, A2 maximum dimension
from 0.015" to 0.025" and clarify A2 dimension in note 3.
Figure 1, case outline 9; changed the min limit for dimensions D2/E2
from 0.990 inches to 0.980 inches. Added vendor cage 88379 for the
case outline 9. Updated paragraph 1.2.3 to describe the five class
levels. -sld
Added device types 12 through 18. -sld
Added case outline A -sld
Added case outline B. Added note to paragraph 1.2.4. -sld.
Re-inserted case outline 9 drawing to figure 1. -sld.
DATE (YR-MO-DA)
99-09-07
00-04-06
00-06-14
APPROVED
Raymond Monnin
Raymond Monnin
Raymond Monnin
J
01-05-06
Raymond Monnin
K
L
M
N
01-11-14
03-02-21
03-09-22
04-01-07
Raymond Monnin
Raymond Monnin
Raymond Monnin
Raymond Monnin
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
N
15
N
16
N
17
N
18
REV
SHEET
PREPARED BY
Steve L. Duncan
CHECKED BY
Michael C. Jones
N
19
N
20
N
21
N
1
N
22
N
2
N
23
N
3
N
24
N
4
N
25
N
5
N
26
N
6
N
27
N
7
N
28
N
8
N
29
N
9
N
10
N
11
N
12
N
13
N
14
STANDARD
MICROCIRCUIT
DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
APPROVED BY
Kendall A. Cottongim
MICROCIRCUIT, HYBRID, MEMORY,
DIGITAL, STATIC RANDOM ACCESS
MEMORY, CMOS, 128K x 32-BIT
DRAWING APPROVAL DATE
95-07-19
REVISION LEVEL
N
SIZE
A
SHEET
CAGE CODE
67268
1 OF
29
5962-95595
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E101-04

5962-9559507HMC Related Products

5962-9559507HMC 5962-9559505HMC 5962-9559506HMC 5962-9559506HXC 5962-9559507HXC 5962-9559509HMC
Description SRAM Module, 128KX32, 35ns, CMOS, CQFP68, SRAM Module, 128KX32, 55ns, CMOS, CQFP68, SRAM Module, 128KX32, 45ns, CMOS, CQFP68, SRAM Module, 128KX32, 45ns, CMOS, CQFP68, SRAM Module, 128KX32, 35ns, CMOS, CQFP68, SRAM Module, 128KX32, 20ns, CMOS, CQFP68,
package instruction QFP, QFP68,1.1SQ,50 QFP, QFP68,1.1SQ,50 QFP, QFP68,1.1SQ,50 QFF, QFL68,1.56SQ QFF, QFL68,1.56SQ QFP, QFP68,1.1SQ,50
Reach Compliance Code unknown unknown unknown unknown unknown unknown
Maximum access time 35 ns 55 ns 45 ns 45 ns 35 ns 20 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code S-XQFP-G68 S-XQFP-G68 S-XQFP-G68 S-XQFP-F68 S-XQFP-F68 S-XQFP-G68
memory density 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit
Memory IC Type SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE
memory width 32 32 32 32 32 32
Number of terminals 68 68 68 68 68 68
word count 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words
character code 128000 128000 128000 128000 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
organize 128KX32 128KX32 128KX32 128KX32 128KX32 128KX32
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code QFP QFP QFP QFF QFF QFP
Encapsulate equivalent code QFP68,1.1SQ,50 QFP68,1.1SQ,50 QFP68,1.1SQ,50 QFL68,1.56SQ QFL68,1.56SQ QFP68,1.1SQ,50
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Filter level 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B
Maximum standby current 0.0116 A 0.0116 A 0.0116 A 0.0116 A 0.0116 A 0.0116 A
Minimum standby current 2 V 2 V 2 V 2 V 2 V 2 V
Maximum slew rate 0.6 mA 0.6 mA 0.6 mA 0.6 mA 0.6 mA 0.6 mA
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal form GULL WING GULL WING GULL WING FLAT FLAT GULL WING
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD
Base Number Matches 1 1 1 1 1 1
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