5962-8959820MYX datasheet, PDF

Datasheet> All Categories > storage> storage> 5962-8959820MYX

5962-8959820MYX: DescriptionStandard SRAM, 128KX8, 25ns, CMOS, CDSO32, CERAMIC, SOJ-32; Categorystorage storage; File Size3MB，939 Pages; ManufacturerWhite Electronic Designs Corporation; Websitehttp://www.wedc.com/

Download Datasheet Parametric View All

5962-8959820MYX Overview

Standard SRAM, 128KX8, 25ns, CMOS, CDSO32, CERAMIC, SOJ-32

5962-8959820MYX Parametric

Parameter Name	Attribute value
package instruction	CERAMIC, SOJ-32
Reach Compliance Code	unknown
Maximum access time	25 ns
JESD-30 code	R-CDSO-J32
length	21.082 mm
memory density	1048576 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	128KX8
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	SOJ
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	3.937 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	DUAL
width	11.05 mm
Base Number Matches	1

Preview

Download Datasheet

View All

NOT MEASUREMENT

SENSITIVE

MIL-HDBK-103AP

6 MARCH 2014

SUPERSEDING

MIL-HDBK-103AN

12 SEPTEMBER 2013

DEPARTMENT OF DEFENSE

HANDBOOK

LIST OF STANDARD MICROCIRCUIT DRAWINGS

This handbook is for guidance only. Do not cite this document

as a requirement.

AMSC N/A

FSC 5962

MIL-HDBK-103AP

CONTENTS

PARAGRAPH

1.1

1.2

1.2.1

1.2.2

1.2.3

1.2.4

4.1

4.2

4.3

4.4

4.5

4.6

5.1

5.2

6.1

6.1.1

6.1.2

6.2

7.1

7.2

TABLE 1

SECTION 1

Part I

Part II

Part III

PAGE

SCOPE .......................................................................................................................................... 1

Purpose...................................................................................................................................... 1

Part or identifying number (PIN) ................................................................................................ 1

Drawing number......................................................................................................................... 1

Device class designator ............................................................................................................. 1

Case outline / lead finish ............................................................................................................ 2

Substitutability ............................................................................................................................ 2

APPLICABLE DOCUMENTS ......................................................................................................... 2

DEFINITIONS ................................................................................................................................ 2

REQUIREMENTS .......................................................................................................................... 2

Drawing requirements ................................................................................................................ 2

Preparation procedures ............................................................................................................. 2

Drawing effectivity and duration ................................................................................................. 2

Approved sources of supply....................................................................................................... 2

Radiation hardness assurance (RHA) levels ............................................................................. 2

Electrostatic discharge sensitivity (ESD) listing ......................................................................... 3

CONFIGURATION MANAGEMENT .............................................................................................. 3

Configuration management of SMDs ......................................................................................... 3

Record of users.......................................................................................................................... 3

DISTRIBUTION and REQUESTS .................................................................................................. 4

Distribution ................................................................................................................................. 4

Automatic distribution ................................................................................................................ 4

Electronic distribution ................................................................................................................. 4

Requests .................................................................................................................................... 4

NOTES .......................................................................................................................................... 4

Intended use .............................................................................................................................. 4

Subject item (key word) listing ................................................................................................... 4

Noun code descriptions ................................................................................................................. 5

Microcircuits................................................................................................................................... 12

Listed by SMD PIN .....................................................................................................................

Listed by generic PIN .................................................................................................................

714

Listed approved sources ............................................................................................................

932

Concluding material ...................................................................................................................

936

iii

MIL-HDBK-103AP

1.2.3 Case outline/lead finish. Case outline and lead finish are as described in each SMD. The lead finish indicated in the

section 1 Part I listing is the most readily available from the manufacturer listed for the part. The manufacturer is authorized to

supply other lead finishes than what is listed provided that further testing/qualification is performed by the manufacturer on the

other lead finish(es). The user needs to contact the manufacturer to determine the availability of other lead finishes not listed

herein.

1.2.4 Substitutability. Device-class-Q devices will replace device-class-M devices.

2. APPLICABLE DOCUMENTS This section is not applicable to the handbook.

3. DEFINITIONS This section is not applicable to the handbook.

4. REQUIREMENTS

4.1 Drawing requirements. SMD's will be prepared in accordance with ASME Y14.100 and DOD directives.

4.2 Preparation procedures. The procedures for the generation of an SMD are provided in MIL-HDBK-780.

4.3 Drawing effectivity and duration. SMD's and device class M one part - one part number SMDs which have become

inactive for new design are reflected in section 1, part 1 of the appendix of this document with an "I" in the status column.

4.4 Approved sources of supply. The approved sources of supply list in this handbook supersedes the approved sources

formerly listed in each individual SMD/DLA Land and Maritime Drawing. This handbook is the official list of approved sources

of supply for non-one part - one part number SMD PIN's and for device class M one part - one part number SMD PIN's. Device

classes B, S, Q, V, T, N (monolithic) and H, K, D, G, E (hybrid) one part - one part number SMD PIN's are listed for the

convenience of the users. Official listing for B, S, Q, V, T, N, H, K, D, G, and E levels are available in the applicable QML.

Manufacturers should notify DLA Land and Maritime-VA in writing if they no longer wish to be listed as an approved source of

supply for any device listed herein. This letter will be used by DSCC to remove the manufacturer from MIL-HDBK-103 for

those devices that the manufacturer specifies that he will no longer supply.

4.5 Radiation hardness assurance (RHA) levels. SMD devices which meet the RHA requirements of MIL-PRF-38535 or

MIL-PRF-38534 will be marked with the appropriate RHA designator M, D, P, L, R, F, G, or H replacing the dash (-) in the PIN

as indicated in the following example:

5962(M, D, P, L, R, F, G, or H)8999901EA

Only the highest RHA level for which the device is qualified will be listed in Section 1, Part I of the appendix of this document;

however, at the request of the customer, the manufacturer is authorized to supply any lower RHA level device. At the request

of the customer, the non-RHA PIN designated with a dash (-) may be supplied at the option of the manufacturer. The

manufacturer may also opt to submit a certificate of compliance to have the non-RHA PIN listed in addition to the RHA PIN in

Section 1, Part I of the appendix of this document.

Recommended Resources

One-way operation energy consumption braking circuit 7

Gongtai GT-JDG1 with current transformer application circuit

Circuit diagram to extend battery life

Phone hang-up reminder circuit (2) circuit diagram

Pulse DC electronic fish trap

Computer motherboard circuit diagram 440BX_12

Domestic FPGA Gaoyun GW1N-4 series development board evaluation - unboxing + hardware part 2: [i=s]This post was last edited by Breaking Tradition on 2021-12-12 12:52[/i]I have been waiting for several days. The express was sent on the 6th and arrived yesterday afternoon. I didn’t have time to...; 打破传统 Domestic Chip Exchange

How to simulate a counter with the same frequency as the main clock?: Solution:process (CLK) -- This method can be used to simulate a counter with the same frequency as the main clockbeginif (falling_edge(CLK)) thenSIGNAL_CLK_CNT(3 downto 1)end if;end process;SIGNAL_CLK...; eeleader FPGA/CPLD

Can the disk use a large number of micro disks to form an internal raid0 to improve the read and write performance?: Simply increasing the disk speed to improve read/write performance is not ideal, and the disk is prone to breakage and flying out if it rotates too fast, which may cause casualties. If micro disks are...; 1200324 Embedded System

This is a very strange request, is it possible?: I have a very strange requirement - an STM32 external ferroelectric memory. The requirements are: preferably an SPI interface; preferably a 64Kb capacity; more than millions of erase and write times; ...; 猫熊 Integrated technical exchanges

NXP introduces new plastic packaged RF power transistor: Cost-effective solutions for all RF applications Shanghai , China , June 3 , 2011 - NXP Semiconductors NV (NASDAQ: NXPI) today launched a full range of overmolded plastic (OMP) RF power devices with p...; 恩智浦半导体 RF/Wirelessly

EEWORLD University ----TI High Precision Laboratory - Current Feedback Amplifier: TI Precision Labs - Current Feedback Op Amp : https://training.eeworld.com.cn/course/4107...; hi5 Talking

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components