5962-9461201H4A datasheet, PDF

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5962-9461201H4A: DescriptionFlash Module, 512KX32, 150ns, CHIP66, 1.075 INCH, CERAMIC, HIP-66; Categorystorage storage; File Size480KB，41 Pages; ManufacturerWhite Microelectronics

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5962-9461201H4A Overview

Flash Module, 512KX32, 150ns, CHIP66, 1.075 INCH, CERAMIC, HIP-66

5962-9461201H4A Parametric

Parameter Name	Attribute value
package instruction	1.075 INCH, CERAMIC, HIP-66
Reach Compliance Code	unknown
Maximum access time	150 ns
Other features	USER CONFIGURABLE AS 2M X 8
Spare memory width	16
JESD-30 code	S-CHIP-P66
JESD-609 code	e0
length	27.305 mm
memory density	16777216 bit
Memory IC Type	FLASH MODULE
memory width	32
Number of functions	1
Number of terminals	66
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	512KX32
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	HIP
Package shape	SQUARE
Package form	IN-LINE
Parallel/Serial	PARALLEL
Programming voltage	5 V
Certification status	Not Qualified
Maximum seat height	4.6 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	HEX
type	NOR TYPE
width	27.305 mm
Base Number Matches	1

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REVISIONS

LTR

DESCRIPTION

Corrected dimension D2 for case outlines U, X, and 4. Corrected

dimensions D/E and D1/E1 for case outline Y. -sld

Added case outline 9. Added device type 05. Added vendor cage

0EU86 for device types 01 through 03 in the Standard Microcircuit

Drawing Source Approval Bulletin. Figure 1; Made corrections to case

outline M. Added thermal resistance ratings for all case outlines to

paragraph 1.3 . –sld

Added case outline A. Updated drawing to current requirements of

MIL-PRF-38534. -sld

Added case outline B. Added note to paragraph 1.2.4. -sld

Table I; For COE capacitance test, changed the maximum limit from

32 pF to 36 pF and for the CWE and CAD tests changed the

maximum limit from 32 pF to 34 pF for the case outline N only.

Updated drawing to the current requirements. -sld

Update drawing to latest requirements of MIL-PRF-38534. -gc

DATE (YR-MO-DA)

98-10-02

APPROVED

K.A. Cottongim

00-05-11

Raymond Monnin

03-02-21

03-10-10

06-02-03

Raymond Monnin

17-10-17

Charles F. Saffle

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Steve L. Duncan

CHECKED BY

Michael C. Jones

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS

AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

AMSC N/A

DLA LAND AND MARITIME

COLUMBUS, OHIO 43218-3990

http://www.landandmaritime.dla.mil/

APPROVED BY

Kendall A. Cottongim

MICROCIRCUIT, HYBRID, MEMORY, FLASH

ERASABLE/PROGRAMMABLE READ ONLY

MEMORY, 512K x 32-BIT

DRAWING APPROVAL DATE

96-07-31

REVISION LEVEL

SIZE

SHEET

CAGE CODE

67268

1 OF

5962-94612

DSCC FORM 2233

APR 97

DISTRIBUTION STATEMENT A. Approved for public release. Distribution is unlimited.

5962-E036-18

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part

of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the

solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATIONS

MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 - Test Method Standard Microcircuits.

MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 - List of Standard Microcircuit Drawings.

MIL-HDBK-780 - Standard Microcircuit Drawings.

(Copies of these documents are available online at

http://quicksearch.dla.mil

or from the Standardization Document Order

Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in

accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as

designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The

manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as

defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not

affect the form, fit, or function of the device for the applicable device class.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38534 and herein.

3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.

3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.

3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figures 4, 5, and 6 .

3.2.5 Block diagram. The block diagram shall be as specified on figure 7.

3.2.6 Output load circuit. The output load circuit shall be as specified on figure 8.

3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are

as specified in table I and shall apply over the full specified operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

tests for each subgroup are defined in table I.

STANDARD

MICROCIRCUIT DRAWING

DLA LAND AND MARITIME

COLUMBUS, OHIO 43218-3990

SIZE

REVISION LEVEL

5962-94612

SHEET

DSCC FORM 2234

APR 97

3.5 Programming procedure. The programming procedure shall be as specified by the manufacturer and shall be available

upon request.

3.6 Marking of Device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with

the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.

3.7 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described

herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,

for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those

which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be

made available to the preparing activity (DLA Land and Maritime-VA) upon request.

3.8 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this

drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime-VA shall affirm that the

manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein.

3.9 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of

microcircuits delivered to this drawing.

3.10 Endurance. A reprogram ability test shall be completed as part of the vendor's reliability monitors. This reprogram

ability test shall be done for the initial characterization and after any design process changes which may affect the reprogram

ability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of program/erase

cycles listed in section 1.3 herein over the full military temperature range. The vendor's procedure shall be kept under document

control and shall be made available upon request of the acquiring or preparing activity.

3.11 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test shall

be done for initial characterization and after any design process change which may affect data retention. The methods and

procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over the full military

temperature range. The vendor's procedure shall be kept under document control and shall be made available upon request of

the acquiring or preparing activity.

4. VERIFICATION

4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as

modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form,

fit, or function as described herein.

STANDARD

MICROCIRCUIT DRAWING

DLA LAND AND MARITIME

COLUMBUS, OHIO 43218-3990

SIZE

REVISION LEVEL

5962-94612

SHEET

DSCC FORM 2234

APR 97

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