NC258
SAC305
Lead-Free No Clean Solder Paste
Features:
- Long Pause-to-Print Capabilities
- Excellent Wetting, Even Leadless Devices
- Enhances Fine Print Definitions
- Reduced Voiding
- No Head-in-Pillow
- RoHS Compliant
Description:
NC258 has been developed to offer long pause-to-print capabilities while enhancing fine print definitions. NC258 reduces
such defects as voiding and eliminates head-in-pillow. The superior wetting ability of NC258 results in bright, smooth and
shiny solder joints. It also offers very low post process residues, which remain crystal clear even at the elevated
temperatures required for today’s lead-free alloys.
Printing:
-
Apply sufficient paste to the stencil to allow a smooth, even roll during the print cycle (a bead diameter of 12 to 16
mm (½ to ⅝ inch) is normally sufficient to begin).
-
Apply small amounts of fresh solder paste to the stencil at controlled intervals to maintain paste chemistry and
workable properties.
-
NC258 provides the necessary tack time and force for today’s high speed placement equipment, which will enhance
product performance and reliability.
-
Cleaning of your stencil will vary by application; however, it can be accomplished using AIM DJAW-10 stencil
cleaner.
RECOMMENDED INITIAL PRINTER SETTINGS BELOW ARE DEPENDENT ON PCB AND PAD DESIGN
PARAMETER
Squeegee Pressure
Squeegee Speed
Snap-off Distance
RECOMMENDED INITIAL SETTINGS
0.9 - 1.5 lbs/inch of blade
0.5 - 6 inches/second
On Contact 0.00 mm (0.00”)
PARAMETER
PCB Separation Distance
PCB Separation Speed
RECOMMENDED INITIAL SETTINGS
0.75 - 2.0 mm (.030 -.080”)
3.0 - 20.00 mm/second
Reflow Profile:
Two unique profile families are depicted below; both can be used in ramp-spike or ramp-soak-spike applications,
and they each have similar reflow temperatures. The two profiles differ in where they reach their respective peak
temperatures, as well as the time above liquidus (TAL). The shorter profile of the two would apply to smaller
assemblies, where as the longer profile would apply to larger assemblies, such as backplanes or high-density
boards. The shaded area defines the process window. Oven efficiency, board size/mass, component type and
density all influence the final profile for a given assembly. These profiles are starting points, and processing
boards with thermal-couples attached is recommended to optimize the process.
RATE OF
RISE 2°C /
SEC MAX
Short Profiles
Long Profiles
RAMP TO
150°C
(302°F)
≤ 60 Sec
≤ 90 Sec
PROGRESS
THROUGH
150°C-175°C
(302°F-347°F)
15-45 Sec
60-90 Sec
TO PEAK
TEMP 230°C-
245°C (445°F-
474°F)
45-75 Sec
45-60 Sec
TIME ABOVE
217°C (425°F)
COOLDOWN
≤
4 °C / SEC
PROFILE
LENGTH
AMBIENT TO
COOL DOWN
2.75-3.75 Min
4.0-5.0 Min
45-60 Sec
45-75 Sec
45± 15 Sec
45± 15 Sec
THE RECOMMENDED REFLOW PROFILE FOR
NC258
IS PROVIDED AS A GUIDELINE
.
OPTIMAL PROFILE MAY DIFFER DUE TO OVEN TYPE
,
ASSEMBLY
LAYOUT
,
OR OTHER PROCESS VARIABLES
.
CONTACT
AIM
TECHNICAL SUPPORT IF YOU REQUIRE ADDITIONAL PROFILING ASSISTANCE
.
Compatible Products:
-
AIM Lead-Free Electropure Solder Bar
-
NC Paste Flux, No-Clean Tacky Flux
-
NC270WR VOC-Free No-Clean Spray Flux
-
NC264-5 No-Clean Flux Spray/Foam
-
-
-
-
Glowcore No-Clean Cored Wire
One-Step Underfill FF35
Epoxy 4044 Chip Bonding Epoxy
200AX Stencil Cleaner
Cleaning:
-
NC258 can be cleaned if necessary with saponified water or an appropriate solvent cleaner.
-
Please refer to the AIM cleaner matrix for a list of compatible cleaning materials.
Handling and Storage:
-
NC258 is best used within 1 year when stored between -22° and +22° C (-8° and 72° F).
-
Allow the solder paste to warm up completely and naturally to ambient temperature (8 hrs.) prior to breaking the
seal for use.
-
Mix the product lightly and thoroughly (1-2 mins. max) to ensure even distribution of any separated material.
-
Do not store new and used paste in the same container, and reseal any opened containers while not in use.
-
Replace the internal plug and cap of the 500 gram jars to ensure the best possible seal.
Physical Properties:
ITEM
Appearance
Alloy
Melting Point
Particle Size
Metal Loading
Viscosity
Packaging
SPECIFICATION
Gray, Smooth, Creamy
SAC305
217° -218° C
T3 , T4, T5
89% (T3), 88.5% (T4, T5)
Print/dispense versions available.
Available in all industry standard packaging.
Test Data Summary:
CLASSIFICATION
Product Name
NC258
IPC Classification to J-STD-004
ROL0
Copper Mirror to J-STD-004B
LOW
Silver Chromate to J-STD-004B
PASS
POWDER TESTING
No.
Item
Results
Test Method
1
2
Powder Size
Powder Shape
Type 3 – 45-25 micron
Type 4 – 38-20 micron
Spherical
Results
145 +/- 4 mg KOH/ g flux
Silver Chromate Paper - Pass
No fluoride
Low
Pass
Pass
Pass – See AIM Qualification Test Report # NC258052510
See list of recommended products above
Bromine 269 mg/Kg
Chlorine <99.9 mg/Kg
IPC TM 650 2.2.14
Microscope
Test Method
J-STD-004B IPC TM 650 2.3.13
J-STD-004B IPC TM 650 2.3.35
J-STD-004B IPC TM 650
2.3.35.1
J-STD-004B IPC TM 650
2.3.35.2
J-STD-004B IPC TM 650 2.3.32
J-STD-004B IPC TM 650 2.6.15
J-STD-004B IPC TM 650 2.3.33
J-STD-004 IPC TM 650 2.6.3.7
GR-78-CORE
EN 14582:2007
SW 9056 SW 5050
FLUX MEDIUM TESTING
No.
Item
1
2
3
4
5
6
7
8
9
Acid Value
Halide Content
Fluorides Spot Test
Corrosivity Test/ Copper Mirror
Corrosion Flux
Halide-Free/Silver Chromate Paper Test
Surface Insulation Resistance
Compatibility Test
Oxygen Bomb
VISCOSITY TESTING
No.
Item
1
T-Bar Spindle Test Method
Results
900 ± 10% kcps
Test Method
J-STD-005 IPC TM 650 2.4.34
SOLDER PASTE TESTING
No.
Item
1
2
3
4
5
6
Tack Test
Tack Test
Solder Ball Test
Wetting Test
Paste Shelf Life
Solder Paste Slump Test
Results
37.9 g
94.8 g
Pass
Pass
Between -22° and +22° C (-8° and 72° F) = 1 year
Pass
Test Method
J-STD-005 IPC TM 650 2.4.44
JIS Z 3284 Annez 9
J-STD-005 IPC TM 650 2.4.43
J-STD-005 IPC TM 650 2.4.45
AIM TM 125-11
J-STD-005 IPC TM 650 2.4.35
Canada +1-514-494-2000 · USA +1-401-463-5605 · Mexico +52-656-630-0032 · Europe +44-1737-222-258
Asia-Pacific +86-755-2993-6487 · India +91-80-41554753 · info@aimsolder.com · www.aimsolder.com
AIM IS ISO9001:2008 CERTIFIED
The information contained herein is based on data considered accurate and is offered at no charge. Product information is based upon the assumption of
proper handling and operating conditions. All information pertaining to solder paste is produced with 45-micron powder. Liability is expressly
disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated. Please refer to
http://www.aimsolder.com/Home/TermsConditions.aspx
to review AIM's terms and conditions.
06/12
Document Rev # 14
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