5962-9309104HYC datasheet, PDF

5962-9309104HYC: DescriptionEEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32; Categorystorage storage; File Size351KB，12 Pages; ManufacturerWhite Electronic Designs Corporation; Websitehttp://www.wedc.com/

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5962-9309104HYC Overview

EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32
Reach Compliance Code	unknown
Maximum access time	200 ns
Other features	AUTOMATIC WRITE
command user interface	NO
Data polling	YES
JESD-30 code	R-CDIP-T32
JESD-609 code	e4
length	42.4 mm
memory density	4194304 bit
Memory IC Type	EEPROM MODULE
memory width	8
Number of functions	1
Number of terminals	32
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	512KX8
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Encapsulate equivalent code	DIP32,.6
Package shape	RECTANGULAR
Package form	IN-LINE
page size	128 words
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Programming voltage	5 V
Certification status	Not Qualified
Filter level	MIL-PRF-38534 Class H
Maximum seat height	6.98 mm
Maximum standby current	0.01 A
Maximum slew rate	0.18 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	GOLD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
switch bit	NO
width	15.24 mm
Maximum write cycle time (tWC)	10 ms
Base Number Matches	1

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