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LC6546C

Description
CMOS LSI SINGLE-CHIP 4-BIT MICROCOMPUTER FOR SMALL-SCALE CONTROL-ORIENTED APPLICATIONS 
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,41 Pages
ManufacturerSANYO
Websitehttp://www.semic.sanyo.co.jp/english/index-e.html
Download Datasheet Parametric Compare View All

LC6546C Overview

CMOS LSI SINGLE-CHIP 4-BIT MICROCOMPUTER FOR SMALL-SCALE CONTROL-ORIENTED APPLICATIONS 

LC6546C Parametric

Parameter NameAttribute value
MakerSANYO
Parts packaging codeDIP
package instructionDIP,
Contacts30
Reach Compliance Codeunknow
Has ADCNO
Other featuresALSO AVAILABLE IN MFP30S PACKAGE; CAN ALSO OPERATE AT 3V MIN SUPPLY
Address bus width
bit size4
maximum clock frequency4.33 MHz
DAC channelNO
DMA channelNO
External data bus width
JESD-30 codeR-PDIP-T30
Number of I/O lines25
Number of terminals30
Maximum operating temperature70 °C
Minimum operating temperature-30 °C
PWM channelNO
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
ROM programmabilityMROM
speed1.444 MHz
Maximum supply voltage6 V
Minimum supply voltage4 V
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Temperature levelOTHER
Terminal formTHROUGH-HOLE
Terminal locationDUAL
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER

LC6546C Related Products

LC6546C LC6546H LC6543H LC6543C
Description CMOS LSI SINGLE-CHIP 4-BIT MICROCOMPUTER FOR SMALL-SCALE CONTROL-ORIENTED APPLICATIONS  CMOS LSI SINGLE-CHIP 4-BIT MICROCOMPUTER FOR SMALL-SCALE CONTROL-ORIENTED APPLICATIONS  CMOS LSI SINGLE-CHIP 4-BIT MICROCOMPUTER FOR SMALL-SCALE CONTROL-ORIENTED APPLICATIONS  CMOS LSI SINGLE-CHIP 4-BIT MICROCOMPUTER FOR SMALL-SCALE CONTROL-ORIENTED APPLICATIONS 
Parts packaging code DIP DIP DIP DIP
package instruction DIP, DIP, DIP, DIP,
Contacts 30 30 30 30
Reach Compliance Code unknow unknow unknow unknow
Has ADC NO NO NO NO
Other features ALSO AVAILABLE IN MFP30S PACKAGE; CAN ALSO OPERATE AT 3V MIN SUPPLY ALSO AVAILABLE IN MFP30S PACKAGE ALSO AVAILABLE IN MFP30S PACKAGE ALSO AVAILABLE IN MFP30S PACKAGE; CAN ALSO OPERATE AT 3V MIN SUPPLY
bit size 4 4 4 4
maximum clock frequency 4.33 MHz 4.33 MHz 4.33 MHz 4.33 MHz
DAC channel NO NO NO NO
DMA channel NO NO NO NO
JESD-30 code R-PDIP-T30 R-PDIP-T30 R-PDIP-T30 R-PDIP-T30
Number of I/O lines 25 25 25 25
Number of terminals 30 30 30 30
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
Minimum operating temperature -30 °C -30 °C -30 °C -30 °C
PWM channel NO NO NO NO
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP DIP DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
ROM programmability MROM MROM MROM MROM
speed 1.444 MHz 4.33 MHz 4.33 MHz 1.444 MHz
Maximum supply voltage 6 V 6 V 6 V 6 V
Minimum supply voltage 4 V 4.5 V 4.5 V 4 V
Nominal supply voltage 5 V 5 V 5 V 5 V
surface mount NO NO NO NO
technology CMOS CMOS CMOS CMOS
Temperature level OTHER OTHER OTHER OTHER
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal location DUAL DUAL DUAL DUAL
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER
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