S29GL01GP
S29GL512P
S29GL256P
S29GL128P
1 Gbit, 512, 256, 128 Mbit, 3 V, Page Flash
with 90 nm MirrorBit Process Technology
General Description
The Cypress S29GL01G/512/256/128P are Mirrorbit
®
Flash products fabricated on 90 nm process technology. These devices
offer a fast page access time of 25 ns with a corresponding random access time as fast as 90 ns. They feature a Write Buffer that
allows a maximum of 32 words/64 bytes to be programmed in one operation, resulting in faster effective programming time than
standard programming algorithms. This makes these devices ideal for today’s embedded applications that require higher density,
better performance and lower power consumption.
Distinctive Characteristics
Single 3V read/program/erase (2.7-3.6 V)
Enhanced VersatileI/O™ control
– All input levels (address, control, and DQ input levels) and
outputs are determined by voltage on V
IO
input. V
IO
range is 1.65
to V
CC
90 nm MirrorBit process technology
8-word/16-byte page read buffer
32-word/64-byte write buffer reduces overall programming time for
multiple-word updates
Secured Silicon Sector region
– 128-word/256-byte sector for permanent, secure identification
through an 8-word/16-byte random Electronic Serial Number
– Can be programmed and locked at the factory or by the
customer
Uniform 64 Kword/128 Kbyte Sector Architecture
– S29GL01GP: One thousand twenty-four sectors
– S29GL512P: Five hundred twelve sectors
– S29GL256P: Two hundred fifty-six sectors
– S29GL128P: One hundred twenty-eight sectors
100,000 erase cycles per sector typical
20-year data retention typical
Offered Packages
– 56-pin TSOP
– 64-ball Fortified BGA
Suspend and Resume commands for Program and Erase
operations
Write operation status bits indicate program and erase operation
completion
Unlock Bypass Program command to reduce programming time
Support for CFI (Common Flash Interface)
Persistent and Password methods of Advanced Sector Protection
WP#/ACC input
– Accelerates programming time (when V
HH
is applied) for greater
throughput during system production
– Protects first or last sector regardless of sector protection
settings
Hardware reset input (RESET#) resets device
Ready/Busy# output (RY/BY#) detects program or erase cycle
completion
Performance Characteristics
Maximum Read Access Times (ns)
Density
Voltage Range
(1)
Regulated V
CC
128 & 256 Mb
Full V
CC
VersatileIO V
IO
Regulated V
CC
512 Mb
Full V
CC
VersatileIO V
IO
Regulated V
CC
1 Gb
Full V
CC
VersatileIO V
IO
Random Access
Time (t
ACC
)
90
100/110
110
100
110
120
110
120
130
Page Access Time
(t
PACC
)
25
CE# Access Time OE# Access Time
(t
CE
)
(t
OE
)
90
100/110
110
100
25
25
110
120
110
25
25
120
130
25
Notes
1.
Access times are dependent on V
CC
and V
IO
operating ranges.
See
Ordering Information
page for further details.
Regulated V
CC
: V
CC
= 3.0–3.6 V.
Full V
CC
: V
CC
= V
IO
= 2.7–3.6 V.
VersatileIO V
IO
: V
IO
= 1.65–V
CC
, V
CC
= 2.7–3.6 V.
2. Contact a sales representative for availability.
Cypress Semiconductor Corporation
Document Number: 002-00886 Rev. *B
•
198 Champion Court
•
San Jose
,
CA 95134-1709
•
408-943-2600
Revised May 22, 2017
S29GL01GP
S29GL512P
S29GL256P
S29GL128P
Current Consumption (typical values)
Random Access Read (f = 5 MHz)
8-Word Page Read (f = 10 MHz)
Program/Erase
Standby
30 mA
1 mA
50 mA
1 µA
Program & Erase Times (typical values)
Single Word Programming
Effective Write Buffer Programming (V
CC
) Per Word
Effective Write Buffer Programming (V
HH
) Per Word
Sector Erase Time (64 Kword Sector)
60 µs
15 µs
13.5 µs
0.5 s
Document Number: 002-00886 Rev. *B
Page 2 of 83
S29GL01GP
S29GL512P
S29GL256P
S29GL128P
Contents
1.
2.
3.
4.
4.1
4.2
4.3
4.4
5.
5.1
5.2
5.3
5.4
6.
6.1
7.
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
8.
8.1
8.2
8.3
8.4
8.5
8.6
9.
9.1
9.2
9.3
9.4
10.
10.1
10.2
10.3
11.
11.1
11.2
11.3
11.4
11.5
11.6
Ordering Information
................................................... 4
Input/Output Descriptions & Logic Symbol
.............. 6
Block Diagram..............................................................
7
Physical Dimensions/Connection Diagrams.............
8
Related Documents ....................................................... 8
Special Handling Instructions for BGA Package............ 8
LAA064—64 ball Fortified Ball Grid Array, 11 x 13 mm. 9
TS056—56-Pin Standard Thin Small Outline Package
(TSOP)......................................................................... 11
Additional Resources
................................................
Application Notes .........................................................
Specification Bulletins ..................................................
Hardware and Software Support..................................
Contacting Cypress......................................................
12
12
12
12
12
11.7 AC Characteristics ........................................................ 53
12. Appendix
..................................................................... 64
12.1 Command Definitions.................................................... 64
12.2 Common Flash Memory Interface................................. 73
13.
Advance Information on S29GL-S Eclipse 65 nm
MirrorBit Power-On and Warm Reset Timing
........... 77
14.
Document History
....................................................... 79
Product Overview
...................................................... 13
Memory Map ................................................................ 13
Device Operations
.....................................................
Device Operation Table ...............................................
Word/Byte Configuration..............................................
Versatile IO
TM
(V
IO
) Control .........................................
Read ............................................................................
Page Read Mode .........................................................
Autoselect ....................................................................
Program/Erase Operations ..........................................
Write Operation Status.................................................
Writing Commands/Command Sequences..................
Advanced Sector Protection/Unprotection
.............
Lock Register ...............................................................
Persistent Protection Bits.............................................
Persistent Protection Bit Lock Bit.................................
Password Protection Method .......................................
Advanced Sector Protection Software Examples ........
Hardware Data Protection Methods.............................
Power Conservation Modes......................................
Standby Mode..............................................................
Automatic Sleep Mode.................................................
Hardware RESET# Input Operation.............................
Output Disable (OE#)...................................................
Secured Silicon Sector Flash Memory Region
.......
Factory Locked Secured Silicon Sector .......................
Customer Lockable Secured Silicon Sector.................
Secured Silicon Sector Entry/Exit Command
Sequences ...................................................................
Electrical Specifications............................................
Absolute Maximum Ratings .........................................
Operating Ranges........................................................
Test Conditions ............................................................
Key to Switching Waveforms .......................................
Switching Waveforms ..................................................
DC Characteristics .......................................................
15
15
16
16
16
16
17
21
32
36
38
39
39
41
41
44
44
45
45
45
45
45
46
46
47
47
49
49
50
50
51
51
52
Page 3 of 83
Document Number: 002-00886 Rev. *B
S29GL01GP
S29GL512P
S29GL256P
S29GL128P
1.
Ordering Information
12
F
F
I
01
0
The ordering part number is formed by a valid combination of the following:
S29GL01GP
PACKING TYPE
0 = Tray (standard
(Note 5))
2 = 7” Tape and Reel
3 = 13” Tape and Reel
MODEL NUMBER (V
IO
range, protection when WP# =V
IL
)
01 = V
IO
= V
CC
= 2.7 to 3.6 V, highest address sector protected
02 = V
IO
= V
CC
= 2.7 to 3.6 V, lowest address sector protected
V1 = V
IO
= 1.65 to V
CC
, V
CC
= 2.7 to 3.6 V, highest address sector protected
V2 = V
IO
= 1.65 to V
CC
, V
CC
= 2.7 to 3.6 V, lowest address sector protected
R1= V
IO
= V
CC
= 3.0 to 3.6 V, highest address sector protected
R2= V
IO
= V
CC
= 3.0 to 3.6 V, lowest address sector protected
TEMPERATURE RANGE
I = Industrial (–40°C to +85°C)
C = Commercial (0°C to +85°C)
PACKAGE MATERIALS SET
A = Pb
(Note 1)
F = Pb-free
PACKAGE TYPE
T = 56-pin Thin Small Outline Package (TSOP) Standard Pinout(TSO56)
F = 64-ball Fortified Ball Grid Array, 1.0 mm pitch package (LAA064)
SPEED OPTION
90 = 90 ns
10 = 100 ns
11 = 110 ns
12 = 120 ns
13 = 130 ns
DEVICE NUMBER/DESCRIPTION
S29GL01GP, S29GL512P, S29GL256P, S29GL128P
3.0 Volt-only, 1024, 512, 256 and 128 Megabit Page-Mode Flash Memory, manufactured on 90 nm MirrorBit
®
process
technology
Recommended Combinations
Recommended Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to
confirm availability of specific recommended combinations and to check on newly released combinations.
Document Number: 002-00886 Rev. *B
Page 4 of 83
S29GL01GP
S29GL512P
S29GL256P
S29GL128P
S29GL-P Valid Combinations
Base Part
Number
Speed
11
12
S29GL01GP
13
11
12
13
10
11
S29GL512P
12
10
11
12
90
10, 11
S29GL128P,
S29GL256P
11
90
10, 11
11
Notes
1. Contact a local sales representative for availability.
2. TSOP package marking omits packing type designator from ordering part number.
3. BGA package marking omits leading “S29” and packing type designator from ordering part number.
4. Operating Temperature range: I = Industrial (–40°C to +85°C)
C = Commercial (0°C to +85°C)
5. Type 0 is standard. Specify other options as required.
Package
(2)(3)
Temperature
(4)
I, C
Model Number
R1, R2
01, 02
V1, V2
R1, R2
01, 02
V1, V2
R1, R2
01, 02
V1, V2
R1, R2
01, 02
V1, V2
R1, R2
01, 02
V1, V2
R1, R2
01, 02
V1, V2
Packing Type
(5)
0, 3
TA
(1),
TF
I
I, C
FA
(1),
FF
I
I, C
0, 2, 3
TA
(1),
TF
I
I, C
0, 3
FA
(1),
FF
I
I, C
0, 2, 3
TA
(1),
TF
I
I, C
0, 3
FA
(1),
FF
I
0, 2, 3
Document Number: 002-00886 Rev. *B
Page 5 of 83
stm32/stm8
京公网安备 11010802033920号
EEWORLD
