UltraTEC
TM
Series UT8,200,F2,4040
Innovative
Technology
for a
Connected
World
Thermoelectric Module
The UltraTEC
Tm
Series is a high heat pumping density thermoelectric module (TEM). The module is
assembled with a large number of semiconductor couples to achieve a higher heat pumping capacity
than standard single stage TEMs.
This product line is available in multiple configurations and is ideal for applications that require higher
cooling capacities with limited surface area. Assembled with Bismuth Telluride semiconductor material
and thermally conductive Aluminum Oxide ceramics, the UltraTEC
Tm
Series is designed for higher
current and larger heat-pumping applications.
FEaTUrES
• High heat pump density
• Precise temperature control
• Reliable solid state operation
• No sound or vibration
• DC operation
• RoHS compliant
appliCaTionS
• Analytical instrumentation
• Clinical diagnostics
• Photonics laser systems
• Electronic enclosure cooling
• Food and beverage cooling
• Chillers (liquid cooling)
Performance SPecIfIcaTIonS
Hot side temperature (°C)
Qmax (watts)
Delta Tmax (°C)
Imax (amps)
Vmax (volts)
Module resistance (ohms)
25
127.5
71
8.5
24.9
2.48
SuffIx ThIckneSS
Ta
TB
0.150” +/- 0.001”
0.150” +/- 0.0005”
flaTneSS &
ParallelISm
0.001” / 0.001”
0.0005” / 0.0005”
hoT face cold face lead lengTh
lapped
lapped
lapped
lapped
7.87”
7.87”
SEaling opTion
SuffIx
rT
eP
SealanT
rTV
Epoxy
color
White
Black
TemP range
-60 to 204 °C
-55 to 150 °C
deScrIPTIon
Non-corrosive, silicone adhesive sealant
Low density syntactic foam epoxy encapsulant
global
solutions:
local
support
Americas: +1 888.246.9050
Europe: +46.31.704.67.57
Asia: +86.755.2714.1166
clv.customerpos@lairdtech.com
www.lairdtech.com
TM
UltraTEC
TM
Series UT8,200,F2,4040
Innovative
Technology
for a
Connected
World
Thermoelectric Module
pErForManCE CUrvES
25.0
20.0
15.0
10.0
5.0
0.0
80
70
60
50
40
30
20
10
0
80
70
60
50
40
30
20
10
0
Delta T (C)
Delta T (C)
Voltage (V)
8.5
6.8
5.1
3.4
1.7
130.0
120.0
110.0
100.0
90.0
80.0
70.0
60.0
50.0
40.0
30.0
20.0
10.0
0.0
MEChaniCal Drawing
1.575
[40.0]
1.575
[40.0]
18 AWG STRANDED TEFLON
(SEE TABLE)
COLD FACE
(SEE OPTIONS)
THICKNESS
(SEE OPTIONS)
1.732
[44.0]
HOT FACE
(SEE OPTIONS)
Ceramic Material 96% Alumina Ceramics
Solder Construction: 138°C BiSn
opEraTing TipS
• Max operating temperature: 80°C
• Do not exceed Imax or Vmax when
operating module
• Reference assembly guidelines for
recommended installation
THR-DS-UT8,200,F2,4040 0909
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird
Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability
of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold
pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2009 Laird Technologies, Inc. All Rights Reserved. Laird,
Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the
property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.
Qc (W)
stm32/stm8
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