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910-40-2-19-2-B-0

Description
Heat Sinks CHIPSET H/S PIN FIN 40mm 17.6mm H B/A
CategoryThermal management products    Heat resisting bracing   
File Size1MB,6 Pages
ManufacturerWakefield-Vette
Websitehttp://www.wakefield-vette.com/
Environmental Compliance
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910-40-2-19-2-B-0 Overview

Heat Sinks CHIPSET H/S PIN FIN 40mm 17.6mm H B/A

910-40-2-19-2-B-0 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerWakefield-Vette
Reach Compliance Codecompliant
Heat Resistant Support Device TypeHEAT SINK
901-910 SERIES CHIPSET HEAT SINKS
PIN FIN &
ELLIPTICAL
HEAT SINKS
Wakefield-Vette’s 901-910 Series Heat Sinks
for Chipset can match up to devices from
Intel, Broadcom, Xilinx. TI, Motorola and
many more! These heat sinks are designed
for air flow applications. Enclosed pages
have thermal performance data for natural
forced convection values.
4 Springs at
each corner
Wakefield-Vette heat sink assembles onto
chip set using the space that is between the
PCB and the substrate of the solder balls.
The solder balls provide a minimal gap of
.5mm to .7mm. Attachment feature is below
a .4mm thickness. The clipping system will
not interfere or damage chip. Contact area
is the edge of chip.
Thermal Cooling Solutions from SMART to FINISH

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